JPS6383724U - - Google Patents
Info
- Publication number
- JPS6383724U JPS6383724U JP17890586U JP17890586U JPS6383724U JP S6383724 U JPS6383724 U JP S6383724U JP 17890586 U JP17890586 U JP 17890586U JP 17890586 U JP17890586 U JP 17890586U JP S6383724 U JPS6383724 U JP S6383724U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- gap
- utility
- model registration
- bushing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000014759 maintenance of location Effects 0.000 description 1
Landscapes
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
- Insulating Bodies (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17890586U JPS6383724U (de) | 1986-11-20 | 1986-11-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17890586U JPS6383724U (de) | 1986-11-20 | 1986-11-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6383724U true JPS6383724U (de) | 1988-06-01 |
Family
ID=31121477
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17890586U Pending JPS6383724U (de) | 1986-11-20 | 1986-11-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6383724U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009530588A (ja) * | 2006-03-20 | 2009-08-27 | テンプトロニック コーポレイション | 温度チャンバ及び温度制御システムならびに自動閉鎖ケーブル貫通モジュール |
-
1986
- 1986-11-20 JP JP17890586U patent/JPS6383724U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009530588A (ja) * | 2006-03-20 | 2009-08-27 | テンプトロニック コーポレイション | 温度チャンバ及び温度制御システムならびに自動閉鎖ケーブル貫通モジュール |
| US8408020B2 (en) | 2006-03-20 | 2013-04-02 | Temptronic Corporation | Temperature-controlled enclosures and temperature control system using the same |
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