JPS6382719A - Mold equipment of transfer molding tool - Google Patents

Abstract

PURPOSE:To enable pulling out of a plunger and pressure equalizer from mold equipment without disassembling them, by a method wherein descending limit of driving equipment raising and lowering the plunger is made into a height where the tip of the plunger is separable from an insertion hole of the plunger of a master die set accommodating a chase block and a sliding plate is fitted to the top of the driving equipment. CONSTITUTION:A long groove 30a opening on the side of mold equipment is provided on a bottom force rest 30 supporting a bottom force master die set 18 and lid 31 is fitted to an opening part attachably and detachably. A lower cylinder 33 is shortened so that the tip of a plunger 21 enters into the long groove 30a of the bottom force rest 30. Thus interference of the bottom force master die set 18 with the plunger 21 is eliminated. When the long groove 30a of the bottom force rest 30 is opened by removing the lid 31 and a stationary block 34b is removed, the plunger 21 and a pressure equalizer 22 can be pulled out of the mold equipment from a sliding plate 34 by keeping them unified with a base stand 32.

Description

Detailed Description of the Invention [Industrial Application Field] The present invention relates to a so-called multi-plunger quive transfer mold mold device having the same number of plungers inserted into a plurality of material supply pots. The present invention relates to a mold device that allows the plunger and isostatic device to be replaced extremely easily due to pitch changes.

[Conventional technology and problems]

In order to seal a semiconductor component with a resin, a method is used in which the semiconductor component is set in a cavity of a mold, and the heated and softened resin is compressed into the cavity and heated and hardened.

Transfer molding is generally used for such molding, in which the resin is fed into the mold through a narrow gate.
The heating is uniform and the molded product cures uniformly, resulting in a product with good performance.The curing time is short and the dimensional accuracy is good.Since the softened and molten resin is injected, there is no possibility of damaging or deforming the inserted semiconductor parts. There's not much to do.

However, in the transfer molding method, as shown in FIGS. 4 and 5, the resin material to be heated and pressurized is pressed by a plunger a, and then flows through a supply bottle b) through an auxiliary runner C and a gate d. The resin material is press-fitted into the cavity e, and only the resin material press-fitted into the cavity e becomes a product.

Therefore, other residual materials cannot be reused, resulting in a low yield of resin materials.

In order to eliminate such drawbacks, recently, as shown in Fig. 6, a large number of supply bottles (b) are provided in the cavity e in close proximity to each other via a gate d, and a plunger corresponding to each supply bottle (b) is provided. So-called multi-plunger transfer molding molds have come into use to reduce residual resin material.

A mold of this type is shown in FIG.

The mold is composed of a fixed upper mold l and a movable lower mold 2. On the upper mold side, an upper mold mounting plate 4 is attached to the lower surface of the heat insulating plate 3, and a compression spring 5 is interposed on the lower surface of the upper mold mounting plate 4. The upper ejector plate 6 is arranged so as to be removable.

Below the ejector plate 6, an upper mold chase block 9 is fixed to the upper mold master die set 8 and the upper mold master die set 8 at a distance of 7 and has a cavity e.
will be placed.

10 passes through the upper mold master die set 8 and the upper mold chase block 9 and connects the base end to the upper ejector plate 6
The tip of the ejector turbine is fixed to each cavity e.
and supply bot b.

Also, the ejector plate 6 has a master guide set 8.
An upper return bin 11 passing through is fixed.

Similar to the upper mold, the lower mold has a lower mold mounting plate 13 attached to the upper surface of the heat insulating plate 12, and a lower ejector plate 15 is disposed with a gap 14 in between.
A lower mold master guide set 18 having a lower mold chase block 17 fixed to its upper surface via a spring 16 is disposed above the lower mold chase block 5 .

The lower master guide set 18 is provided with a guide bush 20 that fits into a guide bin 19 attached to the upper master guide set 8.

A plunger 21 passes through the lower mold master guide set 19 and the lower mold chase block F, and presses the resin supply bot b of the lower mold chase block 17 by means of an equal pressure device 22.

An ejector turbine 23 that passes through the lower chase block 17 and the lower master guisette set 18 and appears in and out of each cavity e, and a lower return bin 24 that abuts the upper return bin 11 are fixed to the lower ejector plate 15.

25 is an ejector bar that can press the lower ejector plate 15 upward.

In order to resin-seal a semiconductor component using the mold device configured as described above, first open the upper and lower molds, set the semiconductor in the cavity e, and insert the resin material into the supply box e. , after closing the upper and lower molds, the plunger 21 is pressed upward by the equal pressure device 25 and the resin material is poured into the cavity e.
Press fit inside.

Next, when the mold is opened, the ejector turbines 10 and 23 are pressed by the spring 5 and the ejector bar 25, respectively.
protrudes into the cavity e, and the product is ejected from the cavity e.

As described above, the same product can be produced one after another, but when switching to manufacturing another product, the mold must be replaced with a mold for molding the next product.

Also, if the pinch of the supply bot changes, the pitch of the plunger must be changed accordingly.

However, as shown in FIG. 8, the positional relationship between the lower chase block 17 and the plunger 21 is such that when the plunger 21 is at its lower limit, the upper material bot b of the plunger 21 is at the height of the resin material 5. Therefore, the tip of the plunger 21 has not completely come out of the lower chase block 17.

Therefore, when replacing the lower chase block 17,
As shown in FIG. 9, raise the plunger 21 to the position shown by the dashed line, pull out only the head 21a of the plunger 21 upward, and remove the plunger 21, the lower chase block 17, and the lower master die set. 18, the plunger 21 and the isobaric device 22 had to be pulled out horizontally.

Since replacing the mold and plunger as described above requires extremely troublesome setup work, in practice a method has been adopted in which the entire mold apparatus is replaced entirely.

However, preparing the entire expensive mold apparatus for each type of product is a heavy economic burden and requires a large amount of mold storage space.

The present invention provides a mold device in which the plunger and the isobaric device can be integrally pulled out from the mold device without disassembly, and mold replacement time can be extremely shortened.

[Means for solving problems]

The present invention provides a mold device for a multi-plunger quive transfer mold, in which the lowering limit of a drive device for raising and lowering a plunger is separated from the plunger insertion hole of a master quive set in which a chase block is accommodated. A sliding plate is attached to the upper surface of the driving device, and an isobaric device for supporting the plunger is removably inserted into the sliding plate.

[For production]

With the above configuration, after the lower cylinder is lowered to its lower limit and the tip of the plunger is separated from the master guide set, the equal pressure device on the sliding plate and the plunger can be pulled out of the mold device. can.

〔Example〕

Embodiments of the present invention will be described with reference to the drawings.

Note that the same parts as in the conventional example are given the same reference numerals.

Instead of the lower transfer cylinder 31, a drive device that moves up and down using a screw or an electric jack can be used.

1 to 3 show a mold apparatus, in which a plurality of cavities e are provided on the mold surfaces of an upper mold chase block 9 and a lower mold chase block 17, and each cavity e is provided on the mold surface of the lower mold chase block 17. A material supply pot b is provided which communicates with e.

An upper ejector turbine 10 and a lower ejector turbine 23, which are provided to be retractable into each cavity e in order to take out the product molded in each cavity e, are fixed to an upper ejector plate 6 and a lower ejector plate 15, respectively. .

The upper mold ejector plate 6 and the lower mold ejector plate 15 are housed inside the upper mold chase block 9 and the lower mold chase block 17, respectively, so as to be vertically movable.

Upper chase block 9 and lower chase block 17
are T-shaped sliding grooves 8a and 1 provided in the upper master guide set 8 and the lower master guide set 18, respectively.
It is removably fitted into 8a.

Upper chase block 9 and lower chase block 17
Bottle holes 9a and 17a are drilled in the cylinders, respectively, and piston pins 26a and 27a of cylinders 26 and 27 attached to the upper master guisset 8 and the lower master guisent 18, respectively, are fitted into the pin holes 9a and 17a. At this time, the inserted upper die chase block 9 and lower die chase block 17 are positioned and locked at their normal positions.

Upper chase block 9 and lower chase block 17
Handles 28 and 29 fixed to the side end faces of the chase block are used for pulling out and inserting the chase block when replacing it.

A lower mold pedestal 30 that supports the lower mold master tool set 18 is provided with a long groove 30a that opens on the side surface of the mold device, and a lid 31 is removably attached to the opening.

The lower mold mount 30 may be integrated with the lower mold master tool set 18.

The isobaric device 22 is housed on a base 32 having a T-shaped groove;
The base 32 is slidably fitted into a sliding groove of a sliding plate 34 fixed to the upper surface of a drive device 33 that raises and lowers the plunger 21, and is fitted with a stopper 348 and a fixed block provided on both sides of the sliding plate 34. It is positioned and fixed by 34b.

The drive device 33 may be of a cylinder type, a screw type, or an electric jack type as long as it moves the plunger 21 up and down.

In order to replace the upper die chase block 9, the lower die chase block 17, and the plunger 21 using the mold device configured as described above, first, as shown in FIG. The tip of the jar 21 is made to enter the long groove 30a of the lower mold mount 30.

Thus, the lower master die set 18 and the plunger 2
1 interference is eliminated.

Next, with the upper and lower molds open, the cylinder 26
and 27 to retract the piston pins 26a and 27a, the upper chase block 9 and lower chase block 17 can be pulled out, so use the handles 28 and 29 to pull out the upper chase block 9 and lower chase block Replace chase block 17.

Thus, the upper chase block 9 and the lower chase block 17 can be replaced very easily.

Next, when the lid 31 is removed to open the long groove 30a of the lower mold mount 30 and the fixed block 34b is removed, the plunger 21 and the equal pressure chamber 22 remain integrated with the base 32, and the sliding plate 34 to the outside of the mold apparatus.

The plunger 21 and the isobaric chamber 22 are replaced with ones that match the mold to be used next, or are pinch-adjusted on the base 32 and then reinserted into the mold apparatus.

Setting of the base 32 is performed in the reverse order of removal.

[Effect] Conventionally, it was difficult to replace both the plunger and the mold due to interference between the plunger and the mold, but the present invention lowers the plunger and the isobaric chamber to avoid interference with the mold. In addition, since the plunger and the isobaric chamber can be pulled out sideways from the mold device while being integrated, the plunger can be replaced very easily.

As a result, it has become easier to produce a wide variety of products in small quantities, which had been considered a drawback of multi-blunger quib mold equipment.

[Brief explanation of the drawing]

1 to 3 show embodiments of the present invention, FIG. 1 is a longitudinal sectional view of the mold device, FIG. 2 is a side view of the same (a sectional view of the main part),
Fig. 3 is a longitudinal cross-sectional view of the mold device showing the plunger in the lowered state, Fig. 4 is a plan view showing a part of the mold surface of the lower mold, and Fig. 5 is a view of the contact portion of the upper and lower molds. 6 is a plan view showing a part of the mold surface of the lower mold, FIG. 7 is a longitudinal sectional view of a conventional mold device, and FIG. 8 is a contact portion between the upper mold and the lower mold. FIG. 9 is a longitudinal cross-sectional view of a main part of the plunger, and FIG. 9 is an explanatory diagram of a plunger extraction procedure. 6...Upper die ejector plate, 8...Upper die master die center, 8a...Sliding groove, 9...Upper die chase block, 9a...Bottle hole, 19...Upper die ejector Bin, 15...lower ejector plate,
17... Lower die chase block, 17a... Bottle hole, 18... Lower die master die set, 18a... Sliding groove, 21... Plunger, 22... Equal pressure loading chamber,
23...Lower eject turbine, 26.27...Cylinder, 26a, 27a...Piston pin, 28
, 29... Handle, 30... Lower mold mount, 30a...
Long groove, 31... Lid, 32... Base, 33... Drive device, 34... Sliding plate, 34a... Stopper, 3
4b...Fixed block, b...Material supply pot, e
···cavity. Figure 7

Claims (1)

[Claims] In a transfer mold mold device having the same number of plungers that pressurize resin material inserted into a plurality of material supply pots provided on the mold surface of a chase block,
The lowering limit of the drive device that raises and lowers the plunger is set to a height that allows the tip of the plunger to be separated from the plunger insertion hole of the master die set that accommodates the chase block, and a sliding plate is installed on the top surface of the drive device; A mold device for a transfer mold, characterized in that an isobaric device for supporting the plunger is removably inserted into the sliding plate.