JPS6381274A - Acceleration sensor - Google Patents
Acceleration sensorInfo
- Publication number
- JPS6381274A JPS6381274A JP22558686A JP22558686A JPS6381274A JP S6381274 A JPS6381274 A JP S6381274A JP 22558686 A JP22558686 A JP 22558686A JP 22558686 A JP22558686 A JP 22558686A JP S6381274 A JPS6381274 A JP S6381274A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- electronic circuit
- detection
- acceleration sensor
- acceleration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001133 acceleration Effects 0.000 title claims abstract description 49
- 238000001514 detection method Methods 0.000 claims abstract description 47
- 239000000758 substrate Substances 0.000 claims abstract description 21
- 238000005530 etching Methods 0.000 claims abstract description 12
- 239000006089 photosensitive glass Substances 0.000 claims abstract description 4
- 239000010409 thin film Substances 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 abstract description 6
- 239000000919 ceramic Substances 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003908 quality control method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Pressure Sensors (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は加速度センサに関するもので、特に、加速度の
大きさをアナログまたはディジタル出力する加速度セン
サ、加速度の大きざによりスイッチング出力を得る加速
度センサ等に使用できる加速度センサの構造に関するも
のである。[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an acceleration sensor, and in particular, an acceleration sensor that outputs the magnitude of acceleration in analog or digital form, an acceleration sensor that obtains a switching output depending on the magnitude of acceleration, etc. The present invention relates to the structure of an acceleration sensor that can be used for.
[従来の技術]
従来のこの種の加速度センサとして、特開昭60−22
8966号公報の技術を挙げることができる。第3図は
前記公報の従来の加速度センサの断面図、第4図は第3
図の従来の加速度センサの原理を説明する説明図、第5
図は第3図の従来の加速度センサのインピーダンス変換
回路の回路図である。[Prior art] As a conventional acceleration sensor of this type, Japanese Patent Application Laid-Open No. 60-22
The technique disclosed in Japanese Patent No. 8966 can be mentioned. FIG. 3 is a sectional view of the conventional acceleration sensor disclosed in the above publication, and FIG.
Explanatory diagram illustrating the principle of the conventional acceleration sensor shown in Fig. 5.
This figure is a circuit diagram of the impedance conversion circuit of the conventional acceleration sensor shown in FIG. 3.
第3図において、慣性質量であるウエート1をセラミッ
ク2の周囲に接するように設け、このセラミック2の中
心部を外装ケース3で支持させて加速度を検出する加速
度検出部を構成されている。In FIG. 3, a weight 1, which is an inertial mass, is provided so as to be in contact with the periphery of a ceramic 2, and the center of the ceramic 2 is supported by an exterior case 3 to constitute an acceleration detection section for detecting acceleration.
なお、制動抵抗4は共振ピークを制御する作用をするも
のである。Note that the braking resistor 4 functions to control the resonance peak.
次に、第4図を用いて第3図の加速度センサの動作を説
明する。Next, the operation of the acceleration sensor shown in FIG. 3 will be explained using FIG. 4.
外装ケース3は娠動源に接続され、加速度検出部を構成
する外装ケース3に振動が加えられる。The outer case 3 is connected to a vibration source, and vibrations are applied to the outer case 3 constituting the acceleration detection section.
この振動をセラミック2に伝達させ、その先端に設けら
れているウエート1によって、上記外装ケース3から伝
達された振動が時間的に遅れを生じ、セラミック2に応
力が加わる。そこで、前記セラミック2の圧電効果によ
りセラミック2の両端の端子A、B間に発生する電圧が
センサの出力として得られる。This vibration is transmitted to the ceramic 2, and due to the weight 1 provided at the tip thereof, the vibration transmitted from the exterior case 3 is delayed in time, and stress is applied to the ceramic 2. Therefore, due to the piezoelectric effect of the ceramic 2, a voltage generated between the terminals A and B at both ends of the ceramic 2 is obtained as the output of the sensor.
通常、前記センサの端子A、B間に発生する電圧出力は
、第5図に示すインピーダンス変換素子のFETを用い
た回路を使用してインピーダンス変換され出力される。Normally, the voltage output generated between terminals A and B of the sensor is impedance-converted using a circuit using an FET as an impedance conversion element shown in FIG. 5, and then output.
したがって、図中の端子A。Therefore, terminal A in the figure.
8間に発生する電圧出力は、前記セラミック2の端子C
,D間に得られる電圧が出力電圧voutとなる。The voltage output generated between 8 and 8 is the terminal C of the ceramic 2.
, D becomes the output voltage vout.
[発明が解決しようとする問題点]
しかし、従来の加速度センサは加速度を検出する加速度
検出部と、その検出出力を信号処理するインピーダンス
変換回路等の電子回路部とが別体になっており、製造工
程が複雑であり、かつ!!!造工程上の管理が難しかっ
た。[Problems to be Solved by the Invention] However, in the conventional acceleration sensor, an acceleration detection section that detects acceleration and an electronic circuit section such as an impedance conversion circuit that processes the detection output as a signal are separated. The manufacturing process is complicated, and! ! ! It was difficult to manage the manufacturing process.
また、加速度検出部とその検出出力を信号処理する電子
回路部とが、接着等の手段により接続されているので、
衝撃力等の機械的外力に対して、電気的及び機械的に弱
い等の問題があった。In addition, since the acceleration detection section and the electronic circuit section that processes the detection output are connected by means such as adhesive,
There were problems such as being electrically and mechanically weak against mechanical external forces such as impact force.
そこで、本発明は上記問題点を解決すべきなされたもの
で、電気的及び機械的強度が強く、しかも製造が容易な
加速度センサの提供を目的とするものである。SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and aims to provide an acceleration sensor that has strong electrical and mechanical strength and is easy to manufacture.
[問題点を解決するための手段]
本発明にかかる加速度センサは、基板に形成したウエー
ト部及び検出部及び電子回路装着部と、前記電子回路装
着部に取付けた電子回路構成部品と、検出部に形成した
歪ゲージとを具備するものである。[Means for Solving the Problems] The acceleration sensor according to the present invention includes a weight portion, a detection portion, and an electronic circuit mounting portion formed on a substrate, an electronic circuit component attached to the electronic circuit mounting portion, and a detection portion. It is equipped with a strain gauge formed in
[作用]
本発明においては、基板の一端を重りとして機能するウ
エート部とし、基板の他端を加速度検出出力を電気的に
処理する電子回路の構成部品を取付ける電子回路装着部
とし、その間に、基板の断面積を小さくした検出部を形
成し、基板に形成した検出部の歪ゲージが加速度を検出
したとき、同一基板上に形成した電子回路装着部の電子
回路で信号を処理し、加速度センサ出力とするものであ
る。[Function] In the present invention, one end of the board is used as a weight part that functions as a weight, the other end of the board is used as an electronic circuit mounting part to which components of an electronic circuit that electrically processes acceleration detection output are attached, and in between, A detection part is formed with a small cross-sectional area of the board, and when the strain gauge of the detection part formed on the board detects acceleration, the signal is processed by the electronic circuit of the electronic circuit mounting part formed on the same board, and the acceleration sensor is This is the output.
[実施例]
第1図は本発明の実施例の加速度センサの平面図、第2
図は同じく本発明の実施例の加速度センサの平面図の中
央横断面図である。[Example] Fig. 1 is a plan view of an acceleration sensor according to an embodiment of the present invention, and Fig.
The figure is also a central cross-sectional view of a plan view of an acceleration sensor according to an embodiment of the present invention.
図において、基板10は感光性ガラス(例えば、コーニ
ング社、「フォトセラム」)で、その基板10の一端を
重りとして機能するウエート部10aとし、その大きさ
は測定対象の加速度及び基板10の質量、及び後述する
検出部10bによって決定される。また、基板10の他
端は加速度検出出力として、加速度に応じた電気的信号
を得るに必要な処理を行う電子回路を構成する電子回路
構成部品12を取付ける電子回路装着部IC)Cとする
。この電子回路装着部10cには電源回路、増幅回路、
シュミット回路または比較回路等のスイッチング回路、
A−D変換回路等の回路の1種または複数種類の回路が
形成されるべく、電子回路構成部品12が取付けられる
。そして、ウエート部10aと電子回路@首部10Gと
の間には、基板10の断面積を小さくした検出部10b
がエツチング加工により形成される。前記検出部10b
のエツチング加工により食刻した反対面には、基板10
上の薄膜にエツチング加工で形成した金属抵抗11が形
成され、それにより歪ゲージを構成している。なお、前
記基板10上の薄膜にエツチング加工で形成した金属抵
抗からなる歪ゲージは、前記電子回路装着部10Gの回
路パターンとともに形成される。In the figure, a substrate 10 is made of photosensitive glass (for example, "Photoceram" manufactured by Corning Inc.), and one end of the substrate 10 is a weight portion 10a that functions as a weight, the size of which is determined by the acceleration of the object to be measured and the mass of the substrate 10. , and the detection unit 10b, which will be described later. The other end of the board 10 is an electronic circuit mounting part IC)C to which is attached an electronic circuit component 12 constituting an electronic circuit that performs processing necessary to obtain an electrical signal corresponding to acceleration as an acceleration detection output. This electronic circuit mounting portion 10c includes a power supply circuit, an amplifier circuit,
switching circuits such as Schmitt circuits or comparison circuits;
Electronic circuit components 12 are attached to form one or more types of circuits such as A-D conversion circuits. Between the weight part 10a and the electronic circuit@neck part 10G, there is a detection part 10b with a reduced cross-sectional area of the substrate 10.
is formed by etching. The detection section 10b
On the opposite side etched by the etching process, there is a substrate 10.
A metal resistor 11 is formed by etching on the upper thin film, thereby forming a strain gauge. A strain gauge made of a metal resistor formed by etching a thin film on the substrate 10 is formed together with the circuit pattern of the electronic circuit mounting portion 10G.
このように構成された加速度センサは、次のように動作
することができる。The acceleration sensor configured in this manner can operate as follows.
まず、基板10の電子回路装着部10C側を被測定対象
物に堅固に取付け、片持ち梁状を構成する。この状態で
、加速度が加わると、ウエート部10aの荷重により検
出部10bに撓みが生じ、検出部10bに形成された金
属抵抗11が膨張または収縮等の変化で、その抵抗値が
変化する。この抵抗値変化を電子回路構成部品12で構
成された電子回路で加速度に応じた所定の検出信号に変
換される。First, the electronic circuit mounting portion 10C side of the board 10 is firmly attached to the object to be measured to form a cantilever shape. When acceleration is applied in this state, the detection section 10b is deflected due to the load of the weight section 10a, and the resistance value of the metal resistance 11 formed on the detection section 10b changes due to changes such as expansion or contraction. This change in resistance value is converted into a predetermined detection signal according to the acceleration by an electronic circuit made up of the electronic circuit components 12.
上記のように、本実施例の加速度センサは、つエート部
10a及び検出部10b及び電子回路装着部10Cを有
する一枚の基板10と、前記電子回路装着部10Cに取
付けた電子回路構成部品12と、前記検出部10bに形
成した金属抵抗11等の歪ゲージとを具備するものであ
り、ウエート部10a及び検出部10b及び電子回路装
着部10Cを、−枚の基板10に形成したものであるか
ら、部品点数が少なく、かつ、検出部10bをエツチン
グ加工で形成できるから、微細加工及び精密加工が容易
である。As described above, the acceleration sensor of the present embodiment includes a single board 10 having a mounting section 10a, a detection section 10b, and an electronic circuit mounting section 10C, and an electronic circuit component 12 attached to the electronic circuit mounting section 10C. and a strain gauge such as a metal resistor 11 formed on the detection section 10b, and the weight section 10a, the detection section 10b, and the electronic circuit mounting section 10C are formed on the - number of substrates 10. Therefore, the number of parts is small, and the detection part 10b can be formed by etching, so that microfabrication and precision machining are easy.
また、基板10の検出部10b及び電子回路装着部10
Cに、印刷回路基板の技術を使用して回路パターンを形
成するものであるから、両者間にずれが生じないから、
製品に精度の不揃いが生じ難く、製品の品質管理が容易
となる。Further, the detection section 10b of the board 10 and the electronic circuit mounting section 10
C. Since the circuit pattern is formed using printed circuit board technology, there is no misalignment between the two.
Inconsistency in precision is less likely to occur in the product, making product quality control easier.
そして、基板10の検出部10b及び電子回路装着部1
0Gに一体に、歪ゲージ及び電子回路を具備するもので
あるから、小形化でき、しかも、機械的な外力に対して
、電気的及び機械的に耐えられる強度を有する。Then, the detection section 10b of the board 10 and the electronic circuit mounting section 1
Since it is equipped with a strain gauge and an electronic circuit integrally with the 0G, it can be miniaturized and has the strength to withstand electrical and mechanical external forces.
なお、上記実施例では、ウエート部及び検出部及び電子
回路装着部を有する一枚の基板として、感光性ガラスを
使用しているが、金属性の基板を使用してもよい。特に
、前記基板材料の選択は、ウエート部に必要な質量が得
られること、検出部がエツチング加工できること、検出
部が所定以上の弾性力に耐えること、絶縁体であること
等を前提要件とするが、例えば、絶縁体でなくとも、所
定以上の接合強度の絶縁皮膜の形成が容易である場合、
エツチング加工ができなくとも、機械的切削加工ができ
る場合等には、前記基板材料として使用することができ
る。しかし、エツチング加工に替えて機械的切削加工を
行ったものにおいては、一般に、その仕上がり精度がエ
ツチング加工よりおちる。In the above embodiment, photosensitive glass is used as a single substrate having the weight section, the detection section, and the electronic circuit mounting section, but a metallic substrate may also be used. In particular, the selection of the substrate material is based on the following prerequisites: that the weight part has the necessary mass, that the detection part can be etched, that the detection part can withstand more than a specified elastic force, that it is an insulator, etc. However, for example, even if it is not an insulator, it is easy to form an insulating film with a bonding strength above a specified level,
Even if it cannot be etched, it can be used as the substrate material if it can be mechanically cut. However, when mechanical cutting is performed instead of etching, the finishing accuracy is generally lower than that of etching.
また、基板に加速度が加わったとき、検出部のみ撓みが
生じ、電子回路装着部には撓みが生じないのが好ましい
ことから、電子回路装着部の厚みは、できるだけ厚いの
が好ましいが、検出部の厚みを薄くすることで、それに
替えることができる。In addition, when acceleration is applied to the board, it is preferable that only the detection part flexes and the electronic circuit mounting part does not. Therefore, it is preferable that the thickness of the electronic circuit mounting part is as thick as possible. This can be replaced by reducing the thickness of .
そして、検出部のエツチング加工は一面側から行ってい
るが、両面または1側面を加えた3面または2側面を加
えた4面から行うこともできる。Although the detection portion is etched from one side, it can also be etched from both sides, one side plus three sides, or two sides plus four sides.
そして、電子回路装着部に取付けた電子回路構成部品は
、加速度の大きざをアナログまたはディジタル出力する
電子回路、または加速度の大きざによりスイッチング出
力を得るスイッチング回路等を構成することができる。The electronic circuit components attached to the electronic circuit mounting portion can constitute an electronic circuit that outputs the magnitude of acceleration in analog or digital form, or a switching circuit that obtains a switching output based on the magnitude of acceleration.
更に、検出部に形成した歪ゲージは、半導体歪ゲージ、
感圧ダイオードまたは感圧トランジスタとすることもで
きる。Furthermore, the strain gauge formed in the detection part is a semiconductor strain gauge,
It can also be a pressure sensitive diode or a pressure sensitive transistor.
[発明の効果]
以上のように、本発明の加速度センサは、ウェート部及
び検出部及び電子回路装着部を有する一枚の基板と、前
記電子回路装着部に取付けた電子回路構成部品と、前記
検出部に形成した歪ゲージとを具備するものであり、ウ
エート部及び検出部及び電子回路装着部を、−枚の基板
に形成したものであるから、部品点数が少なく、かつ、
検出部をエツチング加工で形成できるから、微細加工及
び精密加工が容易である。また、基板の検出部及び電子
回路装着部に、印刷回路基板の技術を使用して回路パタ
ーンを形成できるから、両者間にずれが生じ難く、製品
に精度の不揃いが生じない。[Effects of the Invention] As described above, the acceleration sensor of the present invention includes a single board having a weight part, a detection part, and an electronic circuit mounting part, an electronic circuit component attached to the electronic circuit mounting part, and the Since the weight part, the detection part, and the electronic circuit mounting part are formed on one board, the number of parts is small, and
Since the detection portion can be formed by etching, microfabrication and precision machining are easy. Further, since circuit patterns can be formed on the detection section and the electronic circuit mounting section of the board using printed circuit board technology, misalignment between the two is less likely to occur, and no irregularities in precision occur in the product.
故に、製品の品質管理が容易となる。Therefore, product quality control becomes easy.
第1図は本発明の実施例の加速度センサの平面図、第2
図は同じく本発明の実施例の加速度センサの平面図の中
央横断面図、第3図は前記公報の従来の加速度センサの
断面図、第4図は第3図の従来の加速度センサの原理を
説明する説明図、第5図は第3図の従来の加速度センサ
のインピーダンス変換回路の回路図である。
図において、
10:基板、
10a:ウエート部、
10b:検出部、
10C:電子回路装着部、
11:金属抵抗、
12:電子回路構成部品、
である。
なお、図中、同−符号及び同一記号は、同一または相当
部分を示す。FIG. 1 is a plan view of an acceleration sensor according to an embodiment of the present invention, and FIG.
The figure is also a central cross-sectional view of the plan view of the acceleration sensor according to the embodiment of the present invention, FIG. 3 is a cross-sectional view of the conventional acceleration sensor of the above publication, and FIG. The explanatory diagram, FIG. 5, is a circuit diagram of the impedance conversion circuit of the conventional acceleration sensor shown in FIG. In the figure, 10: board, 10a: weight section, 10b: detection section, 10C: electronic circuit mounting section, 11: metal resistor, 12: electronic circuit component. In addition, in the figures, the same reference numerals and the same symbols indicate the same or equivalent parts.
Claims (5)
する一枚の基板と、 前記電子回路装着部に取付けた電子回路構成部品と、 前記検出部に形成した歪ゲージと を具備することを特徴とする加速度センサ。(1) A single board having a weight section, a detection section, and an electronic circuit mounting section; an electronic circuit component attached to the electronic circuit mounting section; and a strain gauge formed on the detection section. acceleration sensor.
成したことを特徴とする特許請求の範囲第1項に記載の
加速度センサ。(2) The acceleration sensor according to claim 1, wherein the detection portion of the substrate is formed by etching.
ジとしたことを特徴とする特許請求の範囲第1項または
第2項に記載の加速度センサ。(3) The acceleration sensor according to claim 1 or 2, wherein the strain gauge formed in the detection section is a resistance strain gauge.
膜にエツチング加工で形成した抵抗歪ゲージとしたこと
を特徴とする特許請求の範囲第1項または第2項に記載
の加速度センサ。(4) The acceleration sensor according to claim 1 or 2, wherein the strain gauge formed in the detection section is a resistance strain gauge formed by etching a thin film on a substrate.
を有する基板は、感光性ガラスとしたことを特徴とする
特許請求の範囲第1項から第4項のいずれか1つに記載
の加速度センサ。(5) The acceleration sensor according to any one of claims 1 to 4, wherein the substrate having the weight part, the detection part, and the electronic circuit mounting part is made of photosensitive glass. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22558686A JPS6381274A (en) | 1986-09-24 | 1986-09-24 | Acceleration sensor |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22558686A JPS6381274A (en) | 1986-09-24 | 1986-09-24 | Acceleration sensor |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6381274A true JPS6381274A (en) | 1988-04-12 |
Family
ID=16831633
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP22558686A Pending JPS6381274A (en) | 1986-09-24 | 1986-09-24 | Acceleration sensor |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6381274A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5138414A (en) * | 1990-08-03 | 1992-08-11 | Nissan Motor Company, Ltd. | Pressure sensitive semiconductor device with cantilevers |
JP2009133653A (en) * | 2007-11-29 | 2009-06-18 | Tanita Corp | Acceleration sensor and pedometer |
WO2015111534A1 (en) * | 2014-01-22 | 2015-07-30 | アルプス電気株式会社 | Sensor module, and sensor chip and processing circuit chip used therein |
-
1986
- 1986-09-24 JP JP22558686A patent/JPS6381274A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5138414A (en) * | 1990-08-03 | 1992-08-11 | Nissan Motor Company, Ltd. | Pressure sensitive semiconductor device with cantilevers |
JP2009133653A (en) * | 2007-11-29 | 2009-06-18 | Tanita Corp | Acceleration sensor and pedometer |
WO2015111534A1 (en) * | 2014-01-22 | 2015-07-30 | アルプス電気株式会社 | Sensor module, and sensor chip and processing circuit chip used therein |
US10066942B2 (en) | 2014-01-22 | 2018-09-04 | Alps Electric Co., Ltd. | Sensor module, and sensor chip and processing circuit chip used therefor |
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