JPS6380966A - Soldering device - Google Patents
Soldering deviceInfo
- Publication number
- JPS6380966A JPS6380966A JP22558086A JP22558086A JPS6380966A JP S6380966 A JPS6380966 A JP S6380966A JP 22558086 A JP22558086 A JP 22558086A JP 22558086 A JP22558086 A JP 22558086A JP S6380966 A JPS6380966 A JP S6380966A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- heater electrode
- stopper
- electrode
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims description 34
- 229910000679 solder Inorganic materials 0.000 claims abstract description 67
- 239000000463 material Substances 0.000 claims abstract description 29
- 238000001514 detection method Methods 0.000 claims abstract description 25
- 238000010438 heat treatment Methods 0.000 claims description 7
- 239000000155 melt Substances 0.000 claims description 6
- 230000005611 electricity Effects 0.000 claims description 2
- 238000005304 joining Methods 0.000 abstract description 7
- 238000002844 melting Methods 0.000 abstract description 4
- 230000008018 melting Effects 0.000 abstract description 4
- 238000003466 welding Methods 0.000 abstract 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 11
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 230000008646 thermal stress Effects 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 238000006073 displacement reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 230000035882 stress Effects 0.000 description 2
- 235000011511 Diospyros Nutrition 0.000 description 1
- 244000236655 Diospyros kaki Species 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- 230000008642 heat stress Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Die Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
この説明は、はんだを介在させて対向させた被接り材の
一方にヒータ電極を当接加圧させた状態で、このヒータ
電降に通電し、このヒータ電極に発生するジュール熱に
よって前記はんだを溶融させて、前記嫂接合材ｒｃｉＩ
士を接合するはんだ付装置に関するものである。[Detailed Description of the Invention] [Industrial Application Field] This explanation is based on a method in which a heater electrode is brought into contact with one side of the welded materials facing each other with a solder interposed therebetween, and is pressurized, The solder is melted by the Joule heat generated in the heater electrode, and the second bonding material rciI is melted.
The present invention relates to a soldering device for joining metal parts.
［関東の技術］
従来、この柿の装置としては、［アビオの接合技術、］
９８２．Ｖｏ ｌ 、’１１に記載されているパルス
ヒートソルダリ〉グ′装置がある。第・１図はこの装７
ｒを示すものであり、図において、■は電源装置でめり
、＋ｉ７’ｌ源及びタイマから構成される装２は加圧へ
・ソドであり、加圧ヘッド２には、図示しない電気絶縁
部材を介して、６電性のアーム３゜３′が互に平行に取
付けられている。アーム３゜３′の先端にはし１字形の
ヒータ電極４が取付けられている。ヒータ電極７１の材
料はモリブデン（ＭＯ）などである、５は一方の被接合
材である導電部材、６は他方の被接合材であるリード線
、７ははんだて゛あり、導電部材５またはリード線６の
いずれか、あるいは、その双方にプリコートされている
。電源装置１から加圧ヘッド２．アーム３゜３゛を介し
てヒータ電極４に電流回路が構成されており、電源装置
から供給されるパルス電流８が流れるようになっている
。[Kanto technology] Conventionally, this persimmon device was made using [Abio joining technology,]
982. There is a pulse heat soldering apparatus described in Vol. '11. Figure 1 is this outfit 7
In the figure, ■ is a power supply, equipment 2 consisting of a +i7'l source and a timer is a pressurizing unit, and the pressurizing head 2 is equipped with an electric insulator (not shown). Six electrically conductive arms 3° and 3' are attached in parallel to each other via members. A heater electrode 4 in the shape of a chopstick is attached to the tip of the arm 3°3'. The material of the heater electrode 71 is molybdenum (MO), etc. 5 is a conductive member which is one of the materials to be joined, 6 is a lead wire which is the other material to be joined, and 7 is a solder wire, which is the conductive member 5 or the lead wire. 6 or both are precoated. From the power supply device 1 to the pressure head 2. A current circuit is constructed in the heater electrode 4 via the arms 3 and 3, through which a pulse current 8 supplied from a power supply device flows.
次に動作について説明する。加圧ヘッド２によりアーム
３．３′を加圧すると、アーム３．３′の先端に収り付
けられたヒータ電極４が下降し、リード線６に当接加圧
する。この状ｆぶで電源装置１を作動させると、パルス
電流８が例えば、アーム３からヒータ電極４からアーム
３′を通って流れ、ヒータ電極４の先端部（Ｕ字形の下
端部）がジコール熱を発生し温度が−Ｅ昇する。この熱
は熱伝導によりリード線６を通ってはんだ７に供給され
、その結果、はんだ７は溶融する。この際、リード線６
はヒータ電極４の加圧により、はんだ７を導電部材５に
押し付けており、この状すで通電が終了すると、はんだ
７の冷却、凝固によりリード線６と導電部材５とのはん
だ付が行われ完了する。Next, the operation will be explained. When the arm 3.3' is pressurized by the pressure head 2, the heater electrode 4 housed at the tip of the arm 3.3' is lowered and comes into contact with the lead wire 6 to apply pressure. When the power supply device 1 is operated in this state, the pulse current 8 flows from the arm 3 through the heater electrode 4 and the arm 3', and the tip of the heater electrode 4 (lower end of the U-shape) is heated by the dicol heat. is generated and the temperature rises by -E. This heat is supplied to the solder 7 through the lead wire 6 by thermal conduction, and as a result, the solder 7 is melted. At this time, lead wire 6
The solder 7 is pressed against the conductive member 5 by the pressure of the heater electrode 4, and when the current is turned off in this state, the lead wire 6 and the conductive member 5 are soldered by cooling and solidifying the solder 7. Complete.
［発明が解決しようとする間厘点］
以」−のように、パルスヒートソルダリング装置を用い
たはんだ付手段は、ヒータ電極１１で発生したジュール
熱の熱伝導により、はんだ７を溶融させる方法であるた
め、パルス電流８の値や、はんだ７の厚さや、ヒータ電
極４とリード線６の接触状態などが変動すれば、はんだ
付の結製にばらつきが出るのは必定である。したがって
、不十分なはんだ付で接合部が外れたりしてはいけない
ので、入熱量や加圧力をオーバー気味に設定せざるを得
す、そのため、被接合材の熱変質や熱応力が大きくなる
ため、熱に弱い材料や破損しやすい材料には不辿当であ
った。[Disadvantages to be Solved by the Invention] As described above, the soldering means using a pulse heat soldering device is a method in which the solder 7 is melted by thermal conduction of Joule heat generated in the heater electrode 11. Therefore, if the value of the pulse current 8, the thickness of the solder 7, the contact state between the heater electrode 4 and the lead wire 6, etc. change, variations in soldering results are inevitable. Therefore, in order to prevent the joint from coming off due to insufficient soldering, it is necessary to set the amount of heat input and pressurizing force slightly excessively.As a result, thermal deterioration and thermal stress of the materials to be joined will increase. However, it was inappropriate for materials that are sensitive to heat or easily damaged.
また、量産時において、はんだ付回数の増大に伴って、
ヒータ電極４の先端部が酸化するため、火熱条件が変動
し、はんだ付の品質の安定性という面で大きな欠点を有
していた。Also, during mass production, as the number of soldering increases,
Since the tip of the heater electrode 4 is oxidized, the heat conditions fluctuate, resulting in a major drawback in terms of stability of soldering quality.
さらに、このはんだ付方法が適用されるマイクロ接合構
造体においては、一般に、熱的および機械的特性の胃な
る微小な材料、すなわち、導電部材５．リード線６．は
んだ７が積層された形で接合されることが多く、製品と
して使用される際に、マイクロ接合構造木の内部では熱
的な負荷による熱応力や機械的な負荷による振動応力な
どが発生することが多く、これらの応力の大きさ如何に
よっては、構成素材の疲労あるいは破壊といった強度−
ヒの問題に発展することになる。はんだ７は両部材、す
なわち、導電部材５とリード！Ｉ６とを電気的および機
械的に接合する役目も果たしている。Furthermore, in a micro-junction structure to which this soldering method is applied, a conductive member 5. Lead wire 6. Solder 7 is often bonded in a stacked form, and when used as a product, thermal stress due to thermal load and vibration stress due to mechanical load may occur inside the micro-bonded structure wood. Depending on the magnitude of these stresses, the strength of the constituent materials such as fatigue or destruction
This will develop into a problem. The solder 7 is applied to both parts, that is, the conductive member 5 and the lead! It also serves to electrically and mechanically connect I6.
このため、一般に、接合部に残存するはんだ７は１−Ｊ
、い方が良いと言われている。しかるに、前記のような
従来の装置によってはんだ付すると、はんだ７がヒータ
電極４により常に加圧されているため、通電中に溶融し
たはんだの大部分が接合面の外へ押し出され、接合面に
残存するはんだの厚さが非常に少なくなり、接合品・買
上の大きな問題点となっていた。Therefore, in general, the solder 7 remaining at the joint is 1-J
, is said to be better. However, when soldering is performed using the conventional device as described above, since the solder 7 is constantly pressurized by the heater electrode 4, most of the melted solder is pushed out of the joint surface during energization, and the solder is not deposited on the joint surface. The thickness of the remaining solder became extremely small, which became a major problem when purchasing and bonding products.
この発明は、以上のような従来の装置における欠点を除
去するためになされたもので、はんだｒ：ｔけ完了時に
接合部に残存するはんだの厚さを所定値以上に確保でき
るはんだ付装置を実現し、もって、はんだ付の高信頼性
と量産時の安定性を得ることを目的とする。This invention was made in order to eliminate the drawbacks of the conventional devices as described above, and provides a soldering device that can ensure that the thickness of the solder remaining in the joint at the completion of soldering is at least a predetermined value. The aim is to achieve high reliability in soldering and stability during mass production.
［問題点を解決するための１段１
この発明にかかるはんだ付装置は、はんだ溶融時におけ
るヒータ電極の被接合材加圧方向への動きを停止させる
ためのストッパと、ヒータ電極がストッパに当接したこ
とを検出する検出部と、その検出ｆΔ号によって通電を
遮断する通電遮断部とを１１備したものである。[Step 1 for Solving the Problems] The soldering apparatus according to the present invention includes a stopper for stopping the movement of the heater electrode in the direction of pressurizing the material to be joined when the solder is melted, and the heater electrode is in contact with the stopper. It is equipped with 11 detection parts that detect contact, and energization cutoff parts that cut off energization based on the detection fΔ.
［ｆｆ″用］
この発明におけるはんだＩ＝を装置では、はんだの溶融
によってヒータ電極が所定の変位量だけ沈み込むと、ヒ
ータ電極がスト・・ソバに当接して、それ以上のし−タ
電極の変位をストッパが停止させて、溶融したはんだに
圧力が加わらないようにするので、接合面からの溶融は
んだの過大な排出が抑制され、接合面には所定の厚さの
はんだが確実に残存するようになる。また、検出部はヒ
ータ電極とストッパとの当接を検出して、その検出ｆｚ
号を通電遮断部へ送信するもので、この検出信号により
、はんだの溶融と確実に検出することができ、高信卯性
のはんだ１寸部を安定して破産することができる５通電
遮１ｔｌｒ部は、検出部からの検出信号によって通電遮
断指令を電源装置に発信するので、必要最小限の人Ｐ、
１によってはんだ付けが速成でき、熱や熱応力などに弱
い材料に対しても欠点の生じない優れた接合をすること
が可能となる。[For ff''] In the solder I= device according to the present invention, when the heater electrode sinks by a predetermined displacement amount due to melting of the solder, the heater electrode comes into contact with the strip, and the heater electrode further The stopper stops the displacement of the solder and prevents pressure from being applied to the molten solder, thereby suppressing excessive discharge of molten solder from the joint surface and ensuring that the specified thickness of solder remains on the joint surface. In addition, the detection unit detects the contact between the heater electrode and the stopper, and the detection fz
This detection signal can be used to reliably detect the melting of solder, and can stably destroy a 1-inch section of solder with high reliability. The unit sends a de-energization command to the power supply device based on the detection signal from the detection unit, so the minimum number of people P,
1 allows for quick soldering and enables excellent bonding without defects even to materials that are susceptible to heat and thermal stress.
［発明の実施Ｍ］
以下、この発明の一実施例を図について説明する。第１
図に示すはんだ付装置は、第４図について説明した従来
例と同様に、電源装置１がら供給される電流が、加圧ヘ
ッド２．アーム３．ヒータ電極４．アーＡ ３ ′、加
圧ヘッド２を通って、パルス電流８として流れ、ヒータ
電極４の１１字形千−端にジュール熱を発生させ、被接
合材である導電部材５とリード線６との間に挟まれて押
しつけられているはんだ７をン８融させ、導電部材５と
リード線６とを接合させるものである。第１Ｅ′Ａに示
すこの発明によるはんだ（＝ｆ装置の実施例では、スト
ッパつと取付板１０が設けられている。ストッパ９は、
例えば、突出是を微小に調整し設定することができるマ
イクロメータヘッドを用いる。取付板１０はアーム３ま
たは３′のいずれが一方に固着されている。アーム３ま
たは３′の直下にストッパ９を設置することかり能なス
ペースがあれば、そこにストッパ９を設ｉ？Ｔ Ｌ、ア
ーム３または３′がスト・ツバ９に当接するようにすれ
ば取ｒｔｉｔ。[Implementation M of the Invention] An embodiment of the present invention will be described below with reference to the drawings. 1st
In the soldering apparatus shown in the figure, as in the conventional example explained with reference to FIG. Arm 3. Heater electrode 4. A3' flows through the pressure head 2 as a pulse current 8, generates Joule heat at the 11-shaped end of the heater electrode 4, and generates Joule heat between the conductive member 5, which is the material to be joined, and the lead wire 6. The solder 7 sandwiched between the conductive members 5 and the lead wires 6 is melted to join the conductive member 5 and the lead wires 6. In the embodiment of the solder (=f) device according to the invention shown in No. 1E'A, a stopper and a mounting plate 10 are provided.The stopper 9 is
For example, a micrometer head is used that can finely adjust and set the protrusion. The mounting plate 10 has either arm 3 or 3' fixed to one side. If there is enough space to install the stopper 9 directly under the arm 3 or 3', install the stopper 9 there. TL, the arm 3 or 3' should be in contact with the strike collar 9.
は不要である。is not necessary.
検出部１１は、アーム３．３′、ヒータ電極４が下降し
て、−ｌｉ接板１０がスト・・ソバ９に当接ずれば、こ
れを検出し２て、検出信号を通電遮断部１２に送り、通
電遮断部１２は検出部１１からの検出信号により通電遮
断指令を電源装置１に送り、通電を遮断させる。When the arm 3.3' and the heater electrode 4 are lowered and the -li contact plate 10 comes into contact with the strike buckle 9, the detection unit 11 detects this and sends a detection signal to the current cutoff unit 12. Based on the detection signal from the detection unit 11, the energization cutoff unit 12 sends a energization cutoff command to the power supply device 1 to cut off the energization.
図示の状態は、通電して、はんだを溶融させる直前の状
態であり、導電部材５．はんだ７．リード線６分積層し
、ヒータ電極４がリード線６の−Ｅに当接した状態であ
る。こめとき、スＩ・・ソバ９は取（、ｆ板１０のｒ面
（当接面）との間に微小間隙（ｈｌ＞を有するように設
定されている。鎖車間隙（ｂｌ＞は、はんだ７のプリコ
ート厚さくｈｌ）より小さい値である。はんだ７が溶融
してヒータ電ｆ＆４が下降し、当接板１０がストッパ９
に当接したとき、はんだ７の厚さは（ｈｌ−）’ｚ＞と
なるので、その厚さが所望値になるように５スト・・ソ
バ９の突出高さを設定する。The illustrated state is the state immediately before electricity is applied to melt the solder, and the conductive member 5. Solder 7. Six lead wires are stacked, and the heater electrode 4 is in contact with the -E of the lead wire 6. When tightening, the chain wheel gap (bl> is This value is smaller than the pre-coat thickness (hl) of the solder 7. The solder 7 melts, the heater electric current f&4 descends, and the abutment plate 10 reaches the stopper 9.
Since the thickness of the solder 7 is (hl-)'z> when it comes into contact with the solder 7, the protruding height of the 5-stroke buckle 9 is set so that the thickness becomes the desired value.
なお、はんだ７のプリコート厚さがある範囲でばらつい
ている場合には、微小間隙（ｈｌ）は五ｙ小のはんだブ
リコーｔ−１’Ｘさよりも小さくなるように設定してお
く。Note that if the precoat thickness of the solder 7 varies within a certain range, the minute gap (hl) is set to be smaller than the thickness of the solder bricoat t-1'X.
第１図の状態で、加圧へ・・ｌド２よりヒータ電極４を
圧接させて、電源装置１からヒータ電極４にパルス電流
８を流すと、ヒータ電極４にジュール熱が発生し、はん
だ７が溶融し、溶融したはんだが接合面の外へ押し出さ
れ、ヒータ電極７１は下降する。このヒータ電極４の下
降−Ｖが微小間隙（Ｙ］１）に達すると、取付板１０は
ストッパ９の先端に当接し、それ以上の下降は停＋）−
する。取付板１０がストッパ９に当接すると、検出部１
】がこれを検出し、検出信号を通電遮断部１２に送る。In the state shown in Figure 1, pressurize... When the heater electrode 4 is brought into pressure contact with the electrode 2 and the pulse current 8 is passed from the power supply 1 to the heater electrode 4, Joule heat is generated in the heater electrode 4, and the solder 7 is melted, the molten solder is pushed out of the joint surface, and the heater electrode 71 is lowered. When the downward movement of the heater electrode 4 -V reaches the minute gap (Y]1), the mounting plate 10 comes into contact with the tip of the stopper 9, and further downward movement is stopped.
do. When the mounting plate 10 comes into contact with the stopper 9, the detection part 1
] detects this and sends a detection signal to the current cutoff section 12.
この信号を受けて通電遮断部１２は電源装置１に通電遮
断指令を送り通電を停止させるにれにより、必要最小限
の入熱ではんだ付が完了する７以上において、当接板１
０がストッパ９に当接した後は、加圧力はストッパ９で
受は持たれ、ヒータ電極４の先端、すなわち、？８融し
たはんだ７の部分には負荷されない、その結県、ｉ８融
したはんだは接合面の外へ押し出されることはなく、は
んだが接合面に（ｈｌ−ｈｌ）のＩゾさで確実に残存す
ることになる。In response to this signal, the energization cutoff section 12 sends a energization cutoff command to the power supply 1 to stop the energization, and when the soldering is completed with the minimum necessary heat input, the contact plate 1
0 comes into contact with the stopper 9, the pressurizing force is held by the stopper 9, and the tip of the heater electrode 4, ie, ? 8. No load is applied to the molten solder 7. Therefore, the molten solder is not pushed out of the joint surface, and the solder remains on the joint surface with a degree of (hl-hl). I will do it.
第２図はこの発明によるはんだ付装置の池の実施四を示
す、第２図において第１図と異なるところは遅延回路】
３が設けられていることである。Fig. 2 shows a fourth embodiment of the soldering device according to the present invention. The difference in Fig. 2 from Fig. 1 is the delay circuit]
3 is provided.
遅延回路１３は検出部１】からの検出信号によって通電
遮断部１２から電源装ｒ１に送られる通電５Ｉ！断指令
を、任意の設定時間だけ遅延させるものである。The delay circuit 13 detects the energization 5I! which is sent from the energization cutoff section 12 to the power supply device r1 in response to the detection signal from the detection section 1! This is to delay the disconnection command by an arbitrary set time.
一般に、良好なはんだ行状態を得るためには、はんだ７
が被接合材の表面によくなじむことが重要であり、その
ためには、被接合材のはんだ付される部分を十分に温度
上昇させる必要がある。第１図に示した実施例では、は
んだ７が溶融して当接＆】０がストッパ９に当接すると
、検出部１１からの信号により、通電遮断部１２は直ち
に電源装置に通電を停止させていたのであるが、被接合
材の熱容景が小さい場合にはけんだ７が十分なじむ状態
が得られるものの、被接合材の熱容聚が大きい場合には
、ヒータ電極４から供給される熱が被接合材に逃げ、は
んだが溶融しても被接合材に」分なじまない、いわゆる
、いも行状態と呼ばれる接合不良となることが多い。Generally, in order to obtain a good solder line condition, solder 7
It is important that the soldering material blends well with the surface of the material to be joined, and for this purpose, it is necessary to sufficiently raise the temperature of the part of the material to be soldered. In the embodiment shown in FIG. 1, when the solder 7 melts and comes into contact with the stopper 9, the energization cutoff section 12 immediately stops energizing the power supply device in response to a signal from the detection section 11. However, if the heat capacity of the materials to be welded is small, the solder 7 can be sufficiently absorbed, but if the heat capacity of the materials to be welded is large, the solder 7 is supplied from the heater electrode 4. Heat escapes to the materials to be joined, and even if the solder melts, it does not blend into the materials to be joined, which often results in poor joining, so-called a sluggish state.
これに対して、第２ Ｆ２１に示す実施例では、はんだ
７が溶融して、ヒータ電極１１が下降し、当接板１０が
ストッパ９に！５接し、検出部１１からの検出信号によ
り通電遮断部Ｊ２が通電遮断指令を電源装置に送るとき
、遅延回路部１３で任意の設定時間だけ遅らせているた
め、はんだ７が溶融した後にも所定時間だけパルス電流
８がヒータ電極に流れ、被接合材の温度を１−昇させる
。その結果、はんだ７は被接合材の表面によくなじみ、
良好な接合状態が得られることになる。On the other hand, in the embodiment shown in the second F21, the solder 7 is melted, the heater electrode 11 is lowered, and the contact plate 10 becomes the stopper 9! 5 contact, and when the current cutoff section J2 sends a current cutoff command to the power supply device based on the detection signal from the detection section 11, the delay circuit section 13 delays it by an arbitrary set time, so even after the solder 7 melts, the current cutoff command is delayed for a predetermined time. The pulse current 8 flows through the heater electrode to raise the temperature of the materials to be joined by 1-. As a result, the solder 7 blends well with the surface of the materials to be joined.
A good bonding condition can be obtained.
第３図はこの発明のさらに他の実施例を示す。FIG. 3 shows yet another embodiment of the invention.
第３図においては、被接合材（導電部材５など）を予め
加熱するための、例えばホットプレートなどの補助加熱
装置１４が設けられている。補助加熱装置１４は、はん
だ付は前に加熱して所定温度に上昇させておき、ヒータ
電極４に通電し、はんた７が７８融して、当接板１０が
ストッパ９に当接した時点で直ちに通電を停止し、でも
、？８融はんだが被接合材によくなじみ、良好なはんだ
行状態が得られるようにすることを目的としている。In FIG. 3, an auxiliary heating device 14, such as a hot plate, is provided for preheating the materials to be joined (conductive member 5, etc.). The auxiliary heating device 14 is heated before soldering to raise it to a predetermined temperature, and the heater electrode 4 is energized to melt the solder 7 and the contact plate 10 contacts the stopper 9. Immediately stop energizing at that point, but? The purpose is to allow the 8-melt solder to blend well with the materials to be joined and to obtain good soldering conditions.
なお、補助加熱装置としては、ホットプレートに限らず
、ホットエアー装置等を用いて熱風を吹付けることによ
っても同様な効果を奏する。Note that the auxiliary heating device is not limited to a hot plate, and the same effect can be achieved by blowing hot air using a hot air device or the like.
なお、以上の各実施例では、パルスヒートソルダリング
装置を用いた場合について説明したが、この発明はこれ
に限るものではなく、加圧しながら加熱するはんだ「・
１装置、例えばホットラムによる常時加熱装置などに適
用しても同様な作用効果を奏する。In each of the above embodiments, the case where a pulse heat soldering device was used was described, but the present invention is not limited to this.
Even when applied to one device, such as a constant heating device using a hot ram, the same effects can be obtained.
また、この発明は、はんだｒ−ｔに限るものではなく、
加圧しながら加熱するろう付においても同様な作用効製
を奏する。Moreover, this invention is not limited to solder rt,
Similar effects can be achieved in brazing, which involves heating while applying pressure.
また１図示の実施例では、加圧ヘッド２に取付けたアー
ム３．３′の先端にヒータ電極４を取付け、このアーム
３または３′に取付板１０を設けているが、ヒータ電極
・１を直接、加圧ヘッド２に組１・ｒけて、ヒータ電極
１１に取付板１０または相当する当接部を設けてもよい
。In addition, in the embodiment shown in Figure 1, a heater electrode 4 is attached to the tip of an arm 3.3' attached to the pressure head 2, and a mounting plate 10 is provided on this arm 3 or 3'. The heater electrode 11 may be provided with a mounting plate 10 or a corresponding abutment part directly on the pressure head 2 .
また、被接合材としては図示例の導電部材５とリード線
６以外のものであってもよいことは勿論である。Further, it goes without saying that the material to be joined may be other than the conductive member 5 and lead wire 6 shown in the illustrated example.
「発明の効果１
以」―のように、この発明によれば、被接合材の間に介
在させたはんだが溶融したとき、ヒータ電極の沈み込み
を停止ヒさせるスト・ツバとストッパの当接を検出する
検出部と、通電遮断部とを具備したので、溶融したはん
だを、さらに加圧して押し出すようなことがないので、
接合面に所定値以［二の厚さのはんだを確実に残存させ
ることができ、接合品１丁の向上が得られる。また、は
んだの溶融を検知した後、通電を停止し１、必要鼓小限
の大タヘではんだ付を行なうので、熱や熱応力に弱い被
接合材に対しても、盲信１１境のはんだ封部を安定して
星産することができる。As described in "Effects of the Invention 1 and Below", according to the present invention, when the solder interposed between the materials to be joined melts, the stopper and the stopper stop the sinking of the heater electrode. Since it is equipped with a detection part that detects the current and a current cutoff part, there is no need to pressurize the molten solder further and push it out.
It is possible to reliably leave solder with a thickness of more than a predetermined value on the bonding surface, and an improvement in the bonded product can be obtained. In addition, after detecting the melting of the solder, the current is turned off and soldering is carried out with as large a solder as possible. It is possible to stably produce star parts.
第１図はこの発明の−・実施例によるはんだ針装置の斜
視説明図、第２ＵＡはこの発明の他の実施例によるはん
だ針装置の斜視説明図、第３図はこの発明のさらに他の
実施例によるはんだ針装置の斜視説明ＬＡ、第４図は従
来例のはんだ針装置の斜視説明図である。
図において、１は電源装置、２は加圧ヘーノド、４はヒ
ータ電ｉ、５．６は被接合材、７ははんだ、９はストッ
パ、１０は当接板、１１は検出部、］２は通電遮断部、
１３は遅延回路、１１１は補助加熱装置である。
なお、図中、同一符号は同一または相当部分を示す。FIG. 1 is a perspective explanatory view of a soldering needle device according to an embodiment of the present invention, 2UA is a perspective explanatory view of a soldering needle device according to another embodiment of the present invention, and FIG. FIG. 4 is a perspective illustration LA of a soldering needle device according to an example, and FIG. 4 is a perspective illustration of a conventional soldering needle device. In the figure, 1 is a power supply device, 2 is a pressurizing node, 4 is a heater electrode i, 5.6 is a material to be joined, 7 is a solder, 9 is a stopper, 10 is a contact plate, 11 is a detection unit, ] 2 is a Current cutoff part,
13 is a delay circuit, and 111 is an auxiliary heating device. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (4)
ヒータ電極を当接加圧させ、該ヒータ電極に通電して発
生する熱により前記はんだを溶融させて被接合材同士を
接合させるはんだ付装置において、前記はんだの溶融に
伴い前記はんだを押し出しながら変位する前記ヒータ電
極の一部に当接して前記ヒータ電極を所定の位置で停止
させるストッパと、前記ヒータ電極の一部が前記ストッ
パに当接したことを検出する検出部と、該検出部からの
検出信号によつて前記ヒータ電極の通電を遮断させる通
電遮断部とを具備したことを特徴とするはんだ付装置。(1) A heater electrode is brought into contact with and pressurized one side of the materials to be joined that are opposed to each other with solder interposed therebetween, and the solder is melted by the heat generated by applying electricity to the heater electrode, and the materials to be joined are joined together. In the soldering apparatus, a stopper that stops the heater electrode at a predetermined position by coming into contact with a part of the heater electrode that is displaced while pushing out the solder as the solder melts, and a stopper that stops the heater electrode at a predetermined position; 1. A soldering device comprising: a detection section that detects contact with the heater electrode; and an energization cutoff section that cuts off energization of the heater electrode in response to a detection signal from the detection section.
通電の遮断までの遅延時間を設定する遅延回路部を具備
したことを特徴とする特許請求の範囲第１項記載のはん
だ付装置。(2) The soldering apparatus according to claim 1, wherein the energization cutoff section includes a delay circuit section that sets a delay time from reception of the detection signal to cutoff of the energization.
めの補助加熱装置を具備したことを特徴とする特許請求
の範囲第１項記載のはんだ付装置。(3) The soldering device according to claim 1, wherein the soldering device is equipped with an auxiliary heating device for preheating the materials to be joined.
を特徴とする特許請求の範囲第１項、第２項、第３項の
いずれかに記載のはんだ付装置。(4) The soldering apparatus according to any one of claims 1, 2, and 3, wherein the stopper is a micrometer head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22558086A JPS6380966A (en) | 1986-09-24 | 1986-09-24 | Soldering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP22558086A JPS6380966A (en) | 1986-09-24 | 1986-09-24 | Soldering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6380966A true JPS6380966A (en) | 1988-04-11 |
Family
ID=16831535
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP22558086A Pending JPS6380966A (en) | 1986-09-24 | 1986-09-24 | Soldering device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6380966A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03101358U (en) * | 1990-01-29 | 1991-10-22 | ||
| JP2007179767A (en) * | 2005-12-27 | 2007-07-12 | Nippon Avionics Co Ltd | Terminal processing method of coaxial cable, and reflow device using it |
-
1986
- 1986-09-24 JP JP22558086A patent/JPS6380966A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03101358U (en) * | 1990-01-29 | 1991-10-22 | ||
| JP2007179767A (en) * | 2005-12-27 | 2007-07-12 | Nippon Avionics Co Ltd | Terminal processing method of coaxial cable, and reflow device using it |
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