JPS6380849U - - Google Patents
Info
- Publication number
- JPS6380849U JPS6380849U JP1986176802U JP17680286U JPS6380849U JP S6380849 U JPS6380849 U JP S6380849U JP 1986176802 U JP1986176802 U JP 1986176802U JP 17680286 U JP17680286 U JP 17680286U JP S6380849 U JPS6380849 U JP S6380849U
- Authority
- JP
- Japan
- Prior art keywords
- ceramic
- semiconductor element
- casing
- storage container
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/30—
-
- H10W70/682—
-
- H10W72/01308—
-
- H10W72/07311—
-
- H10W72/07353—
-
- H10W72/334—
-
- H10W72/5522—
-
- H10W72/884—
-
- H10W72/931—
-
- H10W90/734—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986176802U JPS6380849U (index.php) | 1986-11-17 | 1986-11-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986176802U JPS6380849U (index.php) | 1986-11-17 | 1986-11-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6380849U true JPS6380849U (index.php) | 1988-05-27 |
Family
ID=31117402
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986176802U Pending JPS6380849U (index.php) | 1986-11-17 | 1986-11-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6380849U (index.php) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007253323A (ja) * | 2006-03-24 | 2007-10-04 | Infineon Technologies Sensonor As | Ｍｅｍｓ構造用の一体化した台座マウント |
| WO2012004249A1 (fr) * | 2010-07-09 | 2012-01-12 | E2V Semiconductors | Composant electronique en boîtier ceramique |
| WO2020117431A3 (en) * | 2018-12-07 | 2020-07-30 | Google Llc | Integrated circuit substrate for containing liquid adhesive bleed-out |
-
1986
- 1986-11-17 JP JP1986176802U patent/JPS6380849U/ja active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007253323A (ja) * | 2006-03-24 | 2007-10-04 | Infineon Technologies Sensonor As | Ｍｅｍｓ構造用の一体化した台座マウント |
| WO2012004249A1 (fr) * | 2010-07-09 | 2012-01-12 | E2V Semiconductors | Composant electronique en boîtier ceramique |
| FR2962578A1 (fr) * | 2010-07-09 | 2012-01-13 | E2V Semiconductors | Composant électronique en boitier céramique |
| WO2020117431A3 (en) * | 2018-12-07 | 2020-07-30 | Google Llc | Integrated circuit substrate for containing liquid adhesive bleed-out |
| US10818567B2 (en) | 2018-12-07 | 2020-10-27 | Google Llc | Integrated circuit substrate for containing liquid adhesive bleed-out |
| US11264295B2 (en) | 2018-12-07 | 2022-03-01 | Google Llc | Integrated circuit substrate for containing liquid adhesive bleed-out |