JPS6380845U - - Google Patents
Info
- Publication number
- JPS6380845U JPS6380845U JP1986174915U JP17491586U JPS6380845U JP S6380845 U JPS6380845 U JP S6380845U JP 1986174915 U JP1986174915 U JP 1986174915U JP 17491586 U JP17491586 U JP 17491586U JP S6380845 U JPS6380845 U JP S6380845U
- Authority
- JP
- Japan
- Prior art keywords
- hole
- metal wire
- thin metal
- semiconductor
- bonding tool
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/0711—
-
- H10W72/07141—
Landscapes
- Wire Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986174915U JPS6380845U (index.php) | 1986-11-14 | 1986-11-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986174915U JPS6380845U (index.php) | 1986-11-14 | 1986-11-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6380845U true JPS6380845U (index.php) | 1988-05-27 |
Family
ID=31113745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986174915U Pending JPS6380845U (index.php) | 1986-11-14 | 1986-11-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6380845U (index.php) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100565960B1 (ko) * | 1999-07-14 | 2006-03-30 | 삼성전자주식회사 | 와이어 본딩 장치 |
| USD771168S1 (en) | 2014-10-31 | 2016-11-08 | Coorstek, Inc. | Wire bonding ceramic capillary |
| USD797172S1 (en) | 2015-02-03 | 2017-09-12 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD797171S1 (en) | 2015-02-03 | 2017-09-12 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD797826S1 (en) | 2015-02-03 | 2017-09-19 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD868123S1 (en) | 2016-12-20 | 2019-11-26 | Coorstek, Inc. | Wire bonding wedge tool |
-
1986
- 1986-11-14 JP JP1986174915U patent/JPS6380845U/ja active Pending
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100565960B1 (ko) * | 1999-07-14 | 2006-03-30 | 삼성전자주식회사 | 와이어 본딩 장치 |
| USD771168S1 (en) | 2014-10-31 | 2016-11-08 | Coorstek, Inc. | Wire bonding ceramic capillary |
| USD797172S1 (en) | 2015-02-03 | 2017-09-12 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD797171S1 (en) | 2015-02-03 | 2017-09-12 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD797826S1 (en) | 2015-02-03 | 2017-09-19 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD821468S1 (en) | 2015-02-03 | 2018-06-26 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD824970S1 (en) | 2015-02-03 | 2018-08-07 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD824969S1 (en) | 2015-02-03 | 2018-08-07 | Coorstek, Inc. | Ceramic bonding tool with textured tip |
| USD868123S1 (en) | 2016-12-20 | 2019-11-26 | Coorstek, Inc. | Wire bonding wedge tool |