JPS6380801U - - Google Patents
Info
- Publication number
- JPS6380801U JPS6380801U JP17628186U JP17628186U JPS6380801U JP S6380801 U JPS6380801 U JP S6380801U JP 17628186 U JP17628186 U JP 17628186U JP 17628186 U JP17628186 U JP 17628186U JP S6380801 U JPS6380801 U JP S6380801U
- Authority
- JP
- Japan
- Prior art keywords
- film
- electronic component
- sheet
- element body
- predetermined part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims description 6
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 239000003990 capacitor Substances 0.000 description 4
Landscapes
- Details Of Resistors (AREA)
Description
第１図は本考案を実施例した電子部品としての
円筒コンデンサの斜視図、第２図はそれぞれ前記
円筒コンデンサに外装材を被覆する工程を説明す
るための斜視図、第３図及び第４図はそれぞれ本
考案の他の実施例としての円筒コンデンサの斜視
図である。
１……円筒コンデンサ、２……素体、５……樹
脂外装材、６……表示部。
FIG. 1 is a perspective view of a cylindrical capacitor as an electronic component embodying the present invention, FIG. 2 is a perspective view illustrating the process of covering the cylindrical capacitor with an exterior material, and FIGS. 3 and 4 respectively. 2A and 2B are perspective views of cylindrical capacitors as other embodiments of the present invention, respectively. 1... Cylindrical capacitor, 2... Element body, 5... Resin exterior material, 6... Display section.
Claims (1)
表面に予め特性等の表示がなされたフイルム若し
くはシート状体であり、該フイルム若しくはシー
ト状体が巻着によつて素体の所定部分に外装され
ていることを特徴とする電子部品。 (2) 前記外装材が熱収縮性樹脂フイルムで形成
されていることを特徴とする実用新案登録請求の
範囲第１項記載の電子部品。[Claims for Utility Model Registration] (1) The exterior material that covers a predetermined part of the element body is a film or sheet-like material whose surface has been marked with characteristics, etc., and the film or sheet-like material is wound. An electronic component characterized in that it is externally packaged on a predetermined part of an element body by a coating. (2) The electronic component according to claim 1, wherein the exterior material is made of a heat-shrinkable resin film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17628186U JPS6380801U (en) | 1986-11-17 | 1986-11-17 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17628186U JPS6380801U (en) | 1986-11-17 | 1986-11-17 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6380801U true JPS6380801U (en) | 1988-05-27 |
Family
ID=31116377
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17628186U Pending JPS6380801U (en) | 1986-11-17 | 1986-11-17 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6380801U (en) |
-
1986
- 1986-11-17 JP JP17628186U patent/JPS6380801U/ja active Pending
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