JPS638076Y2 - - Google Patents

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a mounting structure for a switching circuit unit of a high frequency induction heating oscillator used as a heating power source in semiconductor manufacturing equipment.

(Prior art) For example, in semiconductor manufacturing equipment such as epitaxial film production equipment, a high frequency oscillator is used as a power source for induction heating a semiconductor wafer in a reaction tube with high frequency. Since a large output is required, if a semiconductor active element such as a thyristor such as a GTO is used in the switching circuit, a large number of elements are required. In this case, the switching circuit unit has a structure in which a large number of semiconductor active elements are arranged on an insulating base serving as a holding member, and this switching circuit unit is mounted and housed in a housing.

On the other hand, in the case of semiconductor manufacturing equipment, the installation location must be made into a highly clean room, so the investment amount per unit area at the installation location is unavoidable. Therefore, in order to reduce the amount of investment as much as possible, efforts are made to reduce the area where semiconductor manufacturing equipment is installed, and the equipment housed there is small and space-saving. will be required. This is no exception to the above-mentioned high-frequency induction heating oscillator, and for this reason, the switching circuit unit thereof is also configured to be extremely small, and the semiconductor active elements such as thyristors included in the unit are densely packed. Furthermore, since various electrical components are mounted closely around these semiconductor active elements, the work efficiency during troubleshooting or maintenance inspections is significantly deteriorated, and switching circuit units are often required for troubleshooting or maintenance inspections. It takes a lot of time to take it out of the case and put it back into the case, which reduces productivity.

(Purpose of the invention) The object of the invention is to provide a mounting structure for a switching circuit unit that reduces the size and space of equipment and improves workability during failure repair or maintenance inspection.

(Structure of the invention) The present invention is characterized in that the holding member that holds the switching circuit unit is pivotally attached to one end of the arm-shaped frame member, and the other end of the arm-shaped frame member is pivotably attached to the casing. By pivoting the arm-shaped frame member and the holding member, the switching circuit unit can be easily taken out of the housing in a desired posture.

(Effects of the invention) With the above configuration, even in a high-frequency induction heating oscillator that uses a lot of semiconductor active elements, access is extremely easy for troubleshooting or maintenance inspection, and the effect is that it can be made smaller and more dense. be.

(Example) An example of the present invention will be described in detail below with reference to the drawings.

FIG. 1 is a front view showing the arrangement of a high frequency conversion circuit in a high frequency oscillator in which active elements are made of semiconductors, and FIG. 2 is a plan view thereof. The switching circuit unit 1 has a plate-shaped holding member 2 made of an insulating material, and a conductive lead plate 3 having substantially the same shape as the holding member 2 is fixed onto the holding member 2. There are 12 thyristors T on the lead plate 3.
(GTO) are arranged with their anodes fixed on the lead plate 3. Reference numeral 4 denotes a conductive lead plate having a slightly smaller area than the lead plate 3 described above, to which the cathodes of all the thyristors T are electrically and mechanically connected. The gates of all the thyristors T are further connected to a small-area conductive lead plate 5, which is attached to the lead plate 4 via an insulating connecting member 6.
Furthermore, a circuit unit 7 for operating the switching circuit unit 1 is mounted on the lead plate 5 via an insulating connecting member 8.

The above is the configuration of the switching circuit unit 1. Such a unit 1 includes a frame member 10 along the inner surfaces of the left and right side walls 9L and 9R of the housing 9.
In this embodiment, each thyristor T is responsible for approximately 1 kW of oscillator output, resulting in a total output of 50 kW. The frame member 10 has shafts 11a and 11b provided at the ends of the upper edge 10a and the lower edge 10b on the side of the housing inlet so as to protrude upward and downward, respectively.
The shafts 11a and 11b are provided with bearing members 12 fixed to the inner surfaces of the side walls 9L and 9R of the housing 9.
a and 12b, respectively, so that the frame member 10 can pivot about point A in FIG. 2. Further, on the main surface 10c of the frame member 10, two pillars 13a and 13b are provided protruding from the main surface 10c of the frame member 10 at a distance from each other in the vertical direction. On the other hand, shafts 15a, 15b are provided to protrude downward from the tips of protrusions 14a, 14b extending from one edge of the holding member 2 of the switching circuit unit 1, and these shafts 15a, 15b are connected to the supports 13a, 13b. 2, the switching circuit unit 1 is configured to be able to pivot around point B in FIG. 2. Note that 16 and 17 are electrical resistors and capacitors disposed on the main surface 10c of the frame member 10.

Since the present invention has the above-described configuration, when performing troubleshooting or maintenance inspection, the frame member 10 is first pivoted about point A in FIG. 2 to remove the switching circuit unit 1 from the housing 9. If the switching circuit unit 1 is removed and then pivoted about point B in FIG. 2, the switching circuit unit 1 can be placed in the desired position as shown in phantom lines in FIG. Therefore, troubleshooting or maintenance inspection is extremely easy, and the switching circuit 1 can be taken out and stored outside the housing 9 extremely quickly, so that productivity can be improved.

[Brief explanation of the drawing]

Figure 1 is a front view showing one embodiment of the present invention;
The figure is a plan view thereof. In the figure, 1 is a switching circuit unit;
2 is a holding member, 3, 4, and 5 are lead plates, 6 and 8 are connecting members, 7 is a circuit unit, 9 is a housing, and 10 is a frame member.

Claims (1)

[Claims for Utility Model Registration] A switching circuit for an oscillator for high-frequency induction heating, which has a holding member and a large number of semiconductor active elements disposed thereon, and a switching circuit unit housed in a housing. In the unit mounting structure, the holding member of the switching circuit unit is pivotally mounted to one end of the frame member;
and the other end of the arm-shaped frame member is pivotally attached to the housing, and by pivoting the frame member and the holding member, the switching circuit unit is moved out of the housing as desired. 1. A mounting structure for a switching unit of a high-frequency induction heating oscillator, characterized in that the switching unit can be taken out with a posture of .