JPS6379674U - - Google Patents

Info

Publication number
JPS6379674U
JPS6379674U JP17519686U JP17519686U JPS6379674U JP S6379674 U JPS6379674 U JP S6379674U JP 17519686 U JP17519686 U JP 17519686U JP 17519686 U JP17519686 U JP 17519686U JP S6379674 U JPS6379674 U JP S6379674U
Authority
JP
Japan
Prior art keywords
integrated circuit
hybrid integrated
circuit board
mechanically
terminals
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP17519686U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP17519686U priority Critical patent/JPS6379674U/ja
Publication of JPS6379674U publication Critical patent/JPS6379674U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Mounting Of Printed Circuit Boards And The Like (AREA)
  • Combinations Of Printed Boards (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示す正面図、第2
図は同じく上面図、第3図は本考案に使用するス
ペーサの斜視図である。 1,2……集積回路板、3,4……端子、6…
…スペーサ、7,8……接続線。
Figure 1 is a front view showing one embodiment of the present invention;
The figure is also a top view, and FIG. 3 is a perspective view of the spacer used in the present invention. 1, 2... integrated circuit board, 3, 4... terminal, 6...
...Spacer, 7, 8... Connection wire.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 端子同士が接触しないように、互いに近接して
平行をなす複数のハイブリツド集積回路板を、電
気絶縁材よりなり、接続線を内設したスペーサを
介して、機械的かつ電気的に接続してなる複合ハ
イブリツド集積回路板。
A hybrid integrated circuit board made of a plurality of hybrid integrated circuit boards that are arranged close to each other and parallel to each other so that the terminals do not touch each other are mechanically and electrically connected via spacers made of electrically insulating material and equipped with connecting wires. Composite hybrid integrated circuit board.
JP17519686U 1986-11-13 1986-11-13 Pending JPS6379674U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17519686U JPS6379674U (en) 1986-11-13 1986-11-13

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17519686U JPS6379674U (en) 1986-11-13 1986-11-13

Publications (1)

Publication Number Publication Date
JPS6379674U true JPS6379674U (en) 1988-05-26

Family

ID=31114295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17519686U Pending JPS6379674U (en) 1986-11-13 1986-11-13

Country Status (1)

Country Link
JP (1) JPS6379674U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06291726A (en) * 1993-03-30 1994-10-18 Yamaichi Electron Co Ltd Photoelectric converter

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4941246B1 (en) * 1969-09-24 1974-11-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4941246B1 (en) * 1969-09-24 1974-11-08

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06291726A (en) * 1993-03-30 1994-10-18 Yamaichi Electron Co Ltd Photoelectric converter

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