JPH0369252U - - Google Patents
Info
- Publication number
- JPH0369252U JPH0369252U JP13013689U JP13013689U JPH0369252U JP H0369252 U JPH0369252 U JP H0369252U JP 13013689 U JP13013689 U JP 13013689U JP 13013689 U JP13013689 U JP 13013689U JP H0369252 U JPH0369252 U JP H0369252U
- Authority
- JP
- Japan
- Prior art keywords
- integrated circuit
- circuit device
- hybrid
- lead
- hybrid integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010586 diagram Methods 0.000 description 2
- 239000002131 composite material Substances 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案における複合集積回路装置説明
図で、イは斜視図、ロは断面図、第２図は従来例
における集積回路装置と混成集積回路装置との接
続概略説明図である。
１……大型集積回路装置、２……リード線、３
……混成集積回路装置、４……印刷配線板、５…
…小型集積回路装置、６……回路部品、７……端
子、８……リード部材。
1 is an explanatory diagram of a composite integrated circuit device according to the present invention, A is a perspective view, B is a sectional view, and FIG. 2 is a schematic explanatory diagram of a connection between an integrated circuit device and a hybrid integrated circuit device in a conventional example. 1...Large integrated circuit device, 2...Lead wire, 3
...Hybrid integrated circuit device, 4...Printed wiring board, 5...
...Small integrated circuit device, 6...Circuit components, 7...Terminals, 8...Lead members.
Claims (1)
の上方に、大型集積回路装置１と同じ大きさで、
二方にリード部材８を有する混成集積回路装置３
を重ねるように配置し、混成集積回路装置３のリ
ード部材８は、混成集積回路装置３を支持すると
同時に、大型集積回路装置１のリード線２に接続
されるような構成としたことを特徴とする複合集
積回路装置。 Large integrated circuit device 1 having lead wires 2 on all sides
above, the same size as the large integrated circuit device 1,
Hybrid integrated circuit device 3 having lead members 8 on both sides
The lead members 8 of the hybrid integrated circuit device 3 support the hybrid integrated circuit device 3 and at the same time are connected to the lead wires 2 of the large integrated circuit device 1. complex integrated circuit device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13013689U JPH0636593Y2 (en) | 1989-11-09 | 1989-11-09 | Complex integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13013689U JPH0636593Y2 (en) | 1989-11-09 | 1989-11-09 | Complex integrated circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0369252U true JPH0369252U (en) | 1991-07-09 |
| JPH0636593Y2 JPH0636593Y2 (en) | 1994-09-21 |
Family
ID=31677728
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13013689U Expired - Lifetime JPH0636593Y2 (en) | 1989-11-09 | 1989-11-09 | Complex integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0636593Y2 (en) |
-
1989
- 1989-11-09 JP JP13013689U patent/JPH0636593Y2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0636593Y2 (en) | 1994-09-21 |