JPS63754U - - Google Patents

Info

Publication number
JPS63754U
JPS63754U JP1986092571U JP9257186U JPS63754U JP S63754 U JPS63754 U JP S63754U JP 1986092571 U JP1986092571 U JP 1986092571U JP 9257186 U JP9257186 U JP 9257186U JP S63754 U JPS63754 U JP S63754U
Authority
JP
Japan
Prior art keywords
polishing
wafer
surface plate
rotating
rotating surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986092571U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986092571U priority Critical patent/JPS63754U/ja
Publication of JPS63754U publication Critical patent/JPS63754U/ja
Pending legal-status Critical Current

Links

JP1986092571U 1986-06-18 1986-06-18 Pending JPS63754U (US07714131-20100511-C00024.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986092571U JPS63754U (US07714131-20100511-C00024.png) 1986-06-18 1986-06-18

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986092571U JPS63754U (US07714131-20100511-C00024.png) 1986-06-18 1986-06-18

Publications (1)

Publication Number Publication Date
JPS63754U true JPS63754U (US07714131-20100511-C00024.png) 1988-01-06

Family

ID=30954391

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986092571U Pending JPS63754U (US07714131-20100511-C00024.png) 1986-06-18 1986-06-18

Country Status (1)

Country Link
JP (1) JPS63754U (US07714131-20100511-C00024.png)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02100321A (ja) * 1988-10-07 1990-04-12 Sony Corp 研磨装置および研磨方法
JP2000288918A (ja) * 1999-04-02 2000-10-17 Applied Materials Inc パターン面を備える改良型cmpプラテン

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02100321A (ja) * 1988-10-07 1990-04-12 Sony Corp 研磨装置および研磨方法
JP2000288918A (ja) * 1999-04-02 2000-10-17 Applied Materials Inc パターン面を備える改良型cmpプラテン
JP4489903B2 (ja) * 1999-04-02 2010-06-23 アプライド マテリアルズ インコーポレイテッド パターン面を備える改良型cmpプラテン

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