JPS6375308U - - Google Patents
Info
- Publication number
- JPS6375308U JPS6375308U JP16973486U JP16973486U JPS6375308U JP S6375308 U JPS6375308 U JP S6375308U JP 16973486 U JP16973486 U JP 16973486U JP 16973486 U JP16973486 U JP 16973486U JP S6375308 U JPS6375308 U JP S6375308U
- Authority
- JP
- Japan
- Prior art keywords
- conical part
- cutter
- tip
- scribing
- diamond cutter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910003460 diamond Inorganic materials 0.000 claims description 5
- 239000010432 diamond Substances 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16973486U JPS6375308U (es) | 1986-11-05 | 1986-11-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16973486U JPS6375308U (es) | 1986-11-05 | 1986-11-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6375308U true JPS6375308U (es) | 1988-05-19 |
Family
ID=31103814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16973486U Pending JPS6375308U (es) | 1986-11-05 | 1986-11-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6375308U (es) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010129857A (ja) * | 2008-11-28 | 2010-06-10 | Sumco Corp | 半導体ウェーハのスクライブ装置、およびそれを備えたスクライブシステム |
-
1986
- 1986-11-05 JP JP16973486U patent/JPS6375308U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010129857A (ja) * | 2008-11-28 | 2010-06-10 | Sumco Corp | 半導体ウェーハのスクライブ装置、およびそれを備えたスクライブシステム |