JPS6375063U - - Google Patents
Info
- Publication number
- JPS6375063U JPS6375063U JP1986170419U JP17041986U JPS6375063U JP S6375063 U JPS6375063 U JP S6375063U JP 1986170419 U JP1986170419 U JP 1986170419U JP 17041986 U JP17041986 U JP 17041986U JP S6375063 U JPS6375063 U JP S6375063U
- Authority
- JP
- Japan
- Prior art keywords
- fiber
- fiber holder
- semiconductor substrate
- holder
- alignment indicator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000835 fiber Substances 0.000 claims description 13
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000000758 substrate Substances 0.000 claims description 5
- 230000003287 optical effect Effects 0.000 claims description 3
- 239000013307 optical fiber Substances 0.000 claims description 3
- 238000012544 monitoring process Methods 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
Landscapes
- Solid State Image Pick-Up Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986170419U JPH0447983Y2 (enrdf_load_html_response) | 1986-11-06 | 1986-11-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986170419U JPH0447983Y2 (enrdf_load_html_response) | 1986-11-06 | 1986-11-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6375063U true JPS6375063U (enrdf_load_html_response) | 1988-05-19 |
| JPH0447983Y2 JPH0447983Y2 (enrdf_load_html_response) | 1992-11-12 |
Family
ID=31105133
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986170419U Expired JPH0447983Y2 (enrdf_load_html_response) | 1986-11-06 | 1986-11-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0447983Y2 (enrdf_load_html_response) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997015850A1 (fr) * | 1995-10-27 | 1997-05-01 | Hoya Corporation | Element de fixation de fibre optique et procede de fabrication |
| JP2013025113A (ja) * | 2011-07-21 | 2013-02-04 | Citizen Holdings Co Ltd | 光モジュール |
-
1986
- 1986-11-06 JP JP1986170419U patent/JPH0447983Y2/ja not_active Expired
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO1997015850A1 (fr) * | 1995-10-27 | 1997-05-01 | Hoya Corporation | Element de fixation de fibre optique et procede de fabrication |
| US6240235B1 (en) | 1995-10-27 | 2001-05-29 | Hoya Corporation | Optical fiber fixing member and method for manufacturing the same |
| JP2013025113A (ja) * | 2011-07-21 | 2013-02-04 | Citizen Holdings Co Ltd | 光モジュール |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0447983Y2 (enrdf_load_html_response) | 1992-11-12 |