JPS6373975U - - Google Patents
Info
- Publication number
- JPS6373975U JPS6373975U JP1986168387U JP16838786U JPS6373975U JP S6373975 U JPS6373975 U JP S6373975U JP 1986168387 U JP1986168387 U JP 1986168387U JP 16838786 U JP16838786 U JP 16838786U JP S6373975 U JPS6373975 U JP S6373975U
- Authority
- JP
- Japan
- Prior art keywords
- lead
- light emitting
- spacer
- emitting diode
- holes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 125000006850 spacer group Chemical group 0.000 claims description 6
- 230000037431 insertion Effects 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
第１図は本考案の一実施例を示す平面図、第２
図は第１図におけるＡ―Ａ矢視断面図、第３図は
従来例を示す斜視図である。
１１はプリント基板、１１ａはリード挿通孔、
１２は発光ダイオード、１２ａはリード、１３は
スペーサ、１４ａ〜１４ｇはリード貫通孔である
。
Figure 1 is a plan view showing one embodiment of the present invention;
The figure is a sectional view taken along the line AA in FIG. 1, and FIG. 3 is a perspective view showing a conventional example. 11 is a printed circuit board, 11a is a lead insertion hole,
12 is a light emitting diode, 12a is a lead, 13 is a spacer, and 14a to 14g are lead through holes.
Claims (1)
オードのリードを貫通させるリード貫通孔が形成
されたスペーサを介して、プリント基板上に複数
の発光ダイオードを配設する発光ダイオードの取
付構造において、上記スペーサは板状に形成され
、この同一のスペーサ上に複数の発光ダイオード
が配設されると共に、上記スペーサは、下面側に
スペーサの高さを決定する複数の突部が形成され
、かつスペーサに形成された少なくとも４つのリ
ード貫通孔のうち、任意の２つのリード貫通孔は
、リードの配設中心に対して一方にずれ、他の２
つのリード貫通孔は上記とは反対の方向にずれて
、これら反対方向にずれた各リード貫通孔の内面
と発光ダイオードのリードとが当接するように形
成されていることを特徴とする発光ダイオードの
取付け構造。 In a light emitting diode mounting structure in which a plurality of light emitting diodes are arranged on a printed circuit board via a spacer in which a lead through hole is formed to determine the arrangement height of the light emitting diodes and allow the leads of the light emitting diodes to pass through, the light emitting diode mounting structure described above is provided. The spacer is formed into a plate shape, and a plurality of light emitting diodes are disposed on the same spacer, and a plurality of protrusions are formed on the lower surface side of the spacer to determine the height of the spacer. Of the at least four lead through holes formed, any two lead through holes are shifted to one side with respect to the lead arrangement center, and the other two lead through holes are shifted to one side with respect to the lead arrangement center.
A light-emitting diode characterized in that the two lead through-holes are offset in the opposite direction to the above, and the leads of the light-emitting diode are formed such that the inner surface of each lead through-hole offset in the opposite direction comes into contact with the lead of the light-emitting diode. Mounting structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986168387U JPS6373975U (en) | 1986-10-31 | 1986-10-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986168387U JPS6373975U (en) | 1986-10-31 | 1986-10-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6373975U true JPS6373975U (en) | 1988-05-17 |
Family
ID=31101222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986168387U Pending JPS6373975U (en) | 1986-10-31 | 1986-10-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6373975U (en) |
-
1986
- 1986-10-31 JP JP1986168387U patent/JPS6373975U/ja active Pending
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