JPS6371875U - - Google Patents

Info

Publication number
JPS6371875U
JPS6371875U JP1986167492U JP16749286U JPS6371875U JP S6371875 U JPS6371875 U JP S6371875U JP 1986167492 U JP1986167492 U JP 1986167492U JP 16749286 U JP16749286 U JP 16749286U JP S6371875 U JPS6371875 U JP S6371875U
Authority
JP
Japan
Prior art keywords
cutting tool
tape member
positioning base
hole
drilled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1986167492U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986167492U priority Critical patent/JPS6371875U/ja
Publication of JPS6371875U publication Critical patent/JPS6371875U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Landscapes

  • Wire Bonding (AREA)
  • Scissors And Nippers (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は本考案に係る切断工具の実施例を示す
斜視図、第２図は第１図の切断工具の使用時の斜
視図、第３図は第１図の切断工具で切断されるテ
ープ部材の部分平面図、第４図はＴＡＢリード型
半導体装置の平面図、第５図は第４図の半導体装
置の側断面図、第６図はＴＡＢリード型半導体装
置の中間構体であるテープ部材の部分平面図、第
７図は第６図のテープ部材から切断された中間構
体を特性試験するＢＴボードを示す斜視図である
。 ３……金属箔、４……半導体ペレツト、５……
バンプ電極、６……テープ部材、７……絶縁性テ
ープ、７ａ……送り孔、８……孔、１５……切断
工具、１６……位置決め台、１６ａ……位置決め
ピン、１６ｂ……遊嵌凹部、１７……切断溝、１
７ａ……片端縁、１８……可動刃。 Fig. 1 is a perspective view showing an embodiment of the cutting tool according to the present invention, Fig. 2 is a perspective view of the cutting tool shown in Fig. 1 in use, and Fig. 3 is a tape cut by the cutting tool shown in Fig. 1. 4 is a plan view of the TAB lead type semiconductor device, FIG. 5 is a side sectional view of the semiconductor device of FIG. 4, and FIG. 6 is a tape member which is an intermediate structure of the TAB lead type semiconductor device. FIG. 7 is a perspective view showing a BT board for testing the characteristics of the intermediate structure cut from the tape member of FIG. 6. 3...Metal foil, 4...Semiconductor pellet, 5...
Bump electrode, 6... tape member, 7... insulating tape, 7a... feed hole, 8... hole, 15... cutting tool, 16... positioning stand, 16a... positioning pin, 16b... loose fit Recessed portion, 17... Cutting groove, 1
7a...One edge, 18...Movable blade.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 両側縁に沿つて定ピツチで送り孔が穿設された
長尺な絶縁性テープに所定間隔毎に孔を穿設し、
一端が孔内に延びる金属箔リードを設け、孔内に
配置した半導体ペレツトの電極とリードとを電気
的に接続したテープ部材の切断工具であつて、上
記送り孔に挿通する位置決めピン及び上記半導体
ペレツトの遊嵌凹部を上面に有して上記テープ部
材を位置決め保持する位置決め台と、位置決め台
の上面中間部を、位置決め台に保持されたテープ
部材の短手方向に刻設した切断溝と、切断溝の片
端縁を片刃として鋏刃を形成する可動刃とからな
ることを特徴とする切断工具。 Holes are drilled at predetermined intervals in a long insulating tape that has perforations drilled at a fixed pitch along both side edges.
A cutting tool for a tape member having a metal foil lead with one end extending into the hole and electrically connecting the lead to an electrode of a semiconductor pellet placed in the hole, the cutting tool including a positioning pin inserted into the feed hole and the semiconductor pellet. a positioning base having a pellet loose fitting recess on the upper surface to position and hold the tape member; and a cutting groove carved in the middle part of the upper surface of the positioning base in the transverse direction of the tape member held by the positioning base; A cutting tool comprising a movable blade that forms a scissor blade with one edge of the cutting groove serving as a single edge.
JP1986167492U 1986-10-30 1986-10-30 Pending JPS6371875U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986167492U JPS6371875U (en) 1986-10-30 1986-10-30

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986167492U JPS6371875U (en) 1986-10-30 1986-10-30

Publications (1)

Publication Number Publication Date
JPS6371875U true JPS6371875U (en) 1988-05-13

Family

ID=31099471

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986167492U Pending JPS6371875U (en) 1986-10-30 1986-10-30

Country Status (1)

Country Link
JP (1) JPS6371875U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004071896A1 (en) * 2003-02-12 2004-08-26 Fuji Machine Mfg. Co., Ltd. Method for connecting component delivery tapes, structure of the connection, and scissors for component delivery tape, used for the connection method

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2004071896A1 (en) * 2003-02-12 2004-08-26 Fuji Machine Mfg. Co., Ltd. Method for connecting component delivery tapes, structure of the connection, and scissors for component delivery tape, used for the connection method
JPWO2004071896A1 (en) * 2003-02-12 2006-06-01 富士機械製造株式会社 Component supply tape connection method, connection structure thereof, and component supply tape cage used for the connection method
CN100434344C (en) * 2003-02-12 2008-11-19 富士机械制造株式会社 Method for connecting component delivery tapes, structure of the connection, and scissors for component delivery tape, used for the connection method
JP4558644B2 (en) * 2003-02-12 2010-10-06 富士機械製造株式会社 供給 for parts supply tape

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