JPS6371576U - - Google Patents

Info

Publication number

JPS6371576U

JPS6371576U JP16591786U JP16591786U JPS6371576U JP S6371576 U JPS6371576 U JP S6371576U JP 16591786 U JP16591786 U JP 16591786U JP 16591786 U JP16591786 U JP 16591786U JP S6371576 U JPS6371576 U JP S6371576U

Authority

JP

Japan

Prior art keywords

solder

wiring board

printed wiring

via hole

coated

Prior art date

1986-10-29

Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)

Pending

Links

• Espacenet
• Global Dossier
• Discuss

• 229910000679 solder Inorganic materials 0.000 claims description 5
• 238000005476 soldering Methods 0.000 claims description 4
• 238000000034 method Methods 0.000 description 3
• RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
• 229910052802 copper Inorganic materials 0.000 description 1
• 239000010949 copper Substances 0.000 description 1