JPS6371530U - - Google Patents
Info
- Publication number
- JPS6371530U JPS6371530U JP16578086U JP16578086U JPS6371530U JP S6371530 U JPS6371530 U JP S6371530U JP 16578086 U JP16578086 U JP 16578086U JP 16578086 U JP16578086 U JP 16578086U JP S6371530 U JPS6371530 U JP S6371530U
- Authority
- JP
- Japan
- Prior art keywords
- pressure
- control device
- pressure control
- semiconductor resin
- press
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 7
- 229920005989 resin Polymers 0.000 claims description 7
- 239000004065 semiconductor Substances 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 5
- 238000007789 sealing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 4
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Control Of Fluid Pressure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16578086U JPS6371530U (US20090163788A1-20090625-C00002.png) | 1986-10-30 | 1986-10-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16578086U JPS6371530U (US20090163788A1-20090625-C00002.png) | 1986-10-30 | 1986-10-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6371530U true JPS6371530U (US20090163788A1-20090625-C00002.png) | 1988-05-13 |
Family
ID=31096132
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16578086U Pending JPS6371530U (US20090163788A1-20090625-C00002.png) | 1986-10-30 | 1986-10-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6371530U (US20090163788A1-20090625-C00002.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05154863A (ja) * | 1991-12-05 | 1993-06-22 | Sumitomo Bakelite Co Ltd | 熱硬化性成形材料の成形方法 |
| JP2015162598A (ja) * | 2014-02-27 | 2015-09-07 | トヨタ自動車株式会社 | 半導体装置の製造方法および製造装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5211866A (en) * | 1975-07-18 | 1977-01-29 | Mitsubishi Electric Corp | Resin sealing method in a semiconductor device |
| JPS59222326A (ja) * | 1983-06-02 | 1984-12-14 | Matsushita Electronics Corp | 樹脂封止装置 |
| JPS61117843A (ja) * | 1984-11-14 | 1986-06-05 | Sumitomo Heavy Ind Ltd | 半導体樹脂封止成形方法 |
-
1986
- 1986-10-30 JP JP16578086U patent/JPS6371530U/ja active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5211866A (en) * | 1975-07-18 | 1977-01-29 | Mitsubishi Electric Corp | Resin sealing method in a semiconductor device |
| JPS59222326A (ja) * | 1983-06-02 | 1984-12-14 | Matsushita Electronics Corp | 樹脂封止装置 |
| JPS61117843A (ja) * | 1984-11-14 | 1986-06-05 | Sumitomo Heavy Ind Ltd | 半導体樹脂封止成形方法 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05154863A (ja) * | 1991-12-05 | 1993-06-22 | Sumitomo Bakelite Co Ltd | 熱硬化性成形材料の成形方法 |
| JP2015162598A (ja) * | 2014-02-27 | 2015-09-07 | トヨタ自動車株式会社 | 半導体装置の製造方法および製造装置 |
