JPS6371529U - - Google Patents

Info

Publication number
JPS6371529U
JPS6371529U JP16697886U JP16697886U JPS6371529U JP S6371529 U JPS6371529 U JP S6371529U JP 16697886 U JP16697886 U JP 16697886U JP 16697886 U JP16697886 U JP 16697886U JP S6371529 U JPS6371529 U JP S6371529U
Authority
JP
Japan
Prior art keywords
semiconductor chip
chamber
resin
opening
resin coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16697886U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16697886U priority Critical patent/JPS6371529U/ja
Publication of JPS6371529U publication Critical patent/JPS6371529U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L24/743—Apparatus for manufacturing layer connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
    • H01L2224/743—Apparatus for manufacturing layer connectors

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Coating Apparatus (AREA)
  • Die Bonding (AREA)
JP16697886U 1986-10-29 1986-10-29 Pending JPS6371529U (enrdf_load_stackoverflow)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16697886U JPS6371529U (enrdf_load_stackoverflow) 1986-10-29 1986-10-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16697886U JPS6371529U (enrdf_load_stackoverflow) 1986-10-29 1986-10-29

Publications (1)

Publication Number Publication Date
JPS6371529U true JPS6371529U (enrdf_load_stackoverflow) 1988-05-13

Family

ID=31098470

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16697886U Pending JPS6371529U (enrdf_load_stackoverflow) 1986-10-29 1986-10-29

Country Status (1)

Country Link
JP (1) JPS6371529U (enrdf_load_stackoverflow)

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