JPS6370161U - - Google Patents
Info
- Publication number
- JPS6370161U JPS6370161U JP16421086U JP16421086U JPS6370161U JP S6370161 U JPS6370161 U JP S6370161U JP 16421086 U JP16421086 U JP 16421086U JP 16421086 U JP16421086 U JP 16421086U JP S6370161 U JPS6370161 U JP S6370161U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- semiconductor device
- lead frame
- island
- sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 3
- 229920005989 resin Polymers 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 6
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/484—Connecting portions
- H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
- H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986164210U JPH0447966Y2 (US07922777-20110412-C00004.png) | 1986-10-28 | 1986-10-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986164210U JPH0447966Y2 (US07922777-20110412-C00004.png) | 1986-10-28 | 1986-10-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6370161U true JPS6370161U (US07922777-20110412-C00004.png) | 1988-05-11 |
| JPH0447966Y2 JPH0447966Y2 (US07922777-20110412-C00004.png) | 1992-11-12 |
Family
ID=31093119
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986164210U Expired JPH0447966Y2 (US07922777-20110412-C00004.png) | 1986-10-28 | 1986-10-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0447966Y2 (US07922777-20110412-C00004.png) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009060093A (ja) * | 2007-08-06 | 2009-03-19 | Seiko Instruments Inc | 半導体装置 |
| JPWO2019116457A1 (ja) * | 2017-12-13 | 2020-05-28 | 三菱電機株式会社 | 半導体装置及び電力変換装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4967552U (US07922777-20110412-C00004.png) * | 1972-09-28 | 1974-06-12 | ||
| JPS53124068A (en) * | 1976-12-27 | 1978-10-30 | Hitachi Ltd | Lead frame |
-
1986
- 1986-10-28 JP JP1986164210U patent/JPH0447966Y2/ja not_active Expired
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4967552U (US07922777-20110412-C00004.png) * | 1972-09-28 | 1974-06-12 | ||
| JPS53124068A (en) * | 1976-12-27 | 1978-10-30 | Hitachi Ltd | Lead frame |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009060093A (ja) * | 2007-08-06 | 2009-03-19 | Seiko Instruments Inc | 半導体装置 |
| JPWO2019116457A1 (ja) * | 2017-12-13 | 2020-05-28 | 三菱電機株式会社 | 半導体装置及び電力変換装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0447966Y2 (US07922777-20110412-C00004.png) | 1992-11-12 |
