JPS6367762U - - Google Patents
Info
- Publication number
- JPS6367762U JPS6367762U JP16162886U JP16162886U JPS6367762U JP S6367762 U JPS6367762 U JP S6367762U JP 16162886 U JP16162886 U JP 16162886U JP 16162886 U JP16162886 U JP 16162886U JP S6367762 U JPS6367762 U JP S6367762U
- Authority
- JP
- Japan
- Prior art keywords
- storage chamber
- lighter
- utility
- model registration
- partition wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005192 partition Methods 0.000 claims 5
- 239000012530 fluid Substances 0.000 claims 2
- 235000010585 Ammi visnaga Nutrition 0.000 claims 1
- 244000153158 Ammi visnaga Species 0.000 claims 1
- 235000002918 Fraxinus excelsior Nutrition 0.000 claims 1
- 239000002956 ash Substances 0.000 claims 1
- 235000019504 cigarettes Nutrition 0.000 claims 1
- 239000000446 fuel Substances 0.000 claims 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Lighters Containing Fuel (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16162886U JPS6367762U (enrdf_load_stackoverflow) | 1986-10-23 | 1986-10-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16162886U JPS6367762U (enrdf_load_stackoverflow) | 1986-10-23 | 1986-10-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6367762U true JPS6367762U (enrdf_load_stackoverflow) | 1988-05-07 |
Family
ID=31088118
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16162886U Pending JPS6367762U (enrdf_load_stackoverflow) | 1986-10-23 | 1986-10-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6367762U (enrdf_load_stackoverflow) |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7906855B1 (en) | 2008-01-21 | 2011-03-15 | Amkor Technology, Inc. | Stacked semiconductor package and method of making same |
| US8691632B1 (en) | 2002-11-08 | 2014-04-08 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US9159672B1 (en) | 2010-08-02 | 2015-10-13 | Amkor Technology, Inc. | Through via connected backside embedded circuit features structure and method |
| US9184118B2 (en) | 2013-05-02 | 2015-11-10 | Amkor Technology Inc. | Micro lead frame structure having reinforcing portions and method |
| US9184148B2 (en) | 2013-10-24 | 2015-11-10 | Amkor Technology, Inc. | Semiconductor package and method therefor |
| US9275939B1 (en) | 2011-01-27 | 2016-03-01 | Amkor Technology, Inc. | Semiconductor device including leadframe with a combination of leads and lands and method |
| US9324614B1 (en) | 2010-04-06 | 2016-04-26 | Amkor Technology, Inc. | Through via nub reveal method and structure |
| US9431323B1 (en) | 2011-11-29 | 2016-08-30 | Amkor Technology, Inc. | Conductive pad on protruding through electrode |
-
1986
- 1986-10-23 JP JP16162886U patent/JPS6367762U/ja active Pending
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8691632B1 (en) | 2002-11-08 | 2014-04-08 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US9406645B1 (en) | 2002-11-08 | 2016-08-02 | Amkor Technology, Inc. | Wafer level package and fabrication method |
| US7906855B1 (en) | 2008-01-21 | 2011-03-15 | Amkor Technology, Inc. | Stacked semiconductor package and method of making same |
| US9324614B1 (en) | 2010-04-06 | 2016-04-26 | Amkor Technology, Inc. | Through via nub reveal method and structure |
| US9159672B1 (en) | 2010-08-02 | 2015-10-13 | Amkor Technology, Inc. | Through via connected backside embedded circuit features structure and method |
| US9275939B1 (en) | 2011-01-27 | 2016-03-01 | Amkor Technology, Inc. | Semiconductor device including leadframe with a combination of leads and lands and method |
| US9508631B1 (en) | 2011-01-27 | 2016-11-29 | Amkor Technology, Inc. | Semiconductor device including leadframe with a combination of leads and lands and method |
| US9431323B1 (en) | 2011-11-29 | 2016-08-30 | Amkor Technology, Inc. | Conductive pad on protruding through electrode |
| US9184118B2 (en) | 2013-05-02 | 2015-11-10 | Amkor Technology Inc. | Micro lead frame structure having reinforcing portions and method |
| US9184148B2 (en) | 2013-10-24 | 2015-11-10 | Amkor Technology, Inc. | Semiconductor package and method therefor |
| US9543235B2 (en) | 2013-10-24 | 2017-01-10 | Amkor Technology, Inc. | Semiconductor package and method therefor |