JPS6367762U - - Google Patents

Info

Publication number
JPS6367762U
JPS6367762U JP16162886U JP16162886U JPS6367762U JP S6367762 U JPS6367762 U JP S6367762U JP 16162886 U JP16162886 U JP 16162886U JP 16162886 U JP16162886 U JP 16162886U JP S6367762 U JPS6367762 U JP S6367762U
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16162886U
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16162886U priority Critical patent/JPS6367762U/ja
Publication of JPS6367762U publication Critical patent/JPS6367762U/ja
Application status is Pending legal-status Critical

Links

JP16162886U 1986-10-23 1986-10-23 Pending JPS6367762U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16162886U JPS6367762U (en) 1986-10-23 1986-10-23

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16162886U JPS6367762U (en) 1986-10-23 1986-10-23

Publications (1)

Publication Number Publication Date
JPS6367762U true JPS6367762U (en) 1988-05-07

Family

ID=31088118

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16162886U Pending JPS6367762U (en) 1986-10-23 1986-10-23

Country Status (1)

Country Link
JP (1) JPS6367762U (en)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7906855B1 (en) 2008-01-21 2011-03-15 Amkor Technology, Inc. Stacked semiconductor package and method of making same
US8072050B1 (en) 2008-11-18 2011-12-06 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including passive device
US8691632B1 (en) 2002-11-08 2014-04-08 Amkor Technology, Inc. Wafer level package and fabrication method
US8853836B1 (en) 1998-06-24 2014-10-07 Amkor Technology, Inc. Integrated circuit package and method of making the same
US8900995B1 (en) 2010-10-05 2014-12-02 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US8981572B1 (en) 2011-11-29 2015-03-17 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9159672B1 (en) 2010-08-02 2015-10-13 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US9184148B2 (en) 2013-10-24 2015-11-10 Amkor Technology, Inc. Semiconductor package and method therefor
US9184118B2 (en) 2013-05-02 2015-11-10 Amkor Technology Inc. Micro lead frame structure having reinforcing portions and method
US9275939B1 (en) 2011-01-27 2016-03-01 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US9324614B1 (en) 2010-04-06 2016-04-26 Amkor Technology, Inc. Through via nub reveal method and structure

Cited By (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9224676B1 (en) 1998-06-24 2015-12-29 Amkor Technology, Inc. Integrated circuit package and method of making the same
US8963301B1 (en) 1998-06-24 2015-02-24 Amkor Technology, Inc. Integrated circuit package and method of making the same
US8853836B1 (en) 1998-06-24 2014-10-07 Amkor Technology, Inc. Integrated circuit package and method of making the same
US8691632B1 (en) 2002-11-08 2014-04-08 Amkor Technology, Inc. Wafer level package and fabrication method
US9406645B1 (en) 2002-11-08 2016-08-02 Amkor Technology, Inc. Wafer level package and fabrication method
US8952522B1 (en) 2002-11-08 2015-02-10 Amkor Technology, Inc. Wafer level package and fabrication method
US7906855B1 (en) 2008-01-21 2011-03-15 Amkor Technology, Inc. Stacked semiconductor package and method of making same
US8072050B1 (en) 2008-11-18 2011-12-06 Amkor Technology, Inc. Semiconductor device with increased I/O leadframe including passive device
US8937381B1 (en) 2009-12-03 2015-01-20 Amkor Technology, Inc. Thin stackable package and method
US9324614B1 (en) 2010-04-06 2016-04-26 Amkor Technology, Inc. Through via nub reveal method and structure
US9159672B1 (en) 2010-08-02 2015-10-13 Amkor Technology, Inc. Through via connected backside embedded circuit features structure and method
US8900995B1 (en) 2010-10-05 2014-12-02 Amkor Technology, Inc. Semiconductor device and manufacturing method thereof
US9508631B1 (en) 2011-01-27 2016-11-29 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US9275939B1 (en) 2011-01-27 2016-03-01 Amkor Technology, Inc. Semiconductor device including leadframe with a combination of leads and lands and method
US8981572B1 (en) 2011-11-29 2015-03-17 Amkor Technology, Inc. Conductive pad on protruding through electrode semiconductor device
US9431323B1 (en) 2011-11-29 2016-08-30 Amkor Technology, Inc. Conductive pad on protruding through electrode
US9184118B2 (en) 2013-05-02 2015-11-10 Amkor Technology Inc. Micro lead frame structure having reinforcing portions and method
US9184148B2 (en) 2013-10-24 2015-11-10 Amkor Technology, Inc. Semiconductor package and method therefor
US9543235B2 (en) 2013-10-24 2017-01-10 Amkor Technology, Inc. Semiconductor package and method therefor

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