JPS6367760A - Heat dissipation fin structure with built-in micro-heat-pipe - Google Patents

Abstract

PURPOSE:To achieve highly efficient heat dissipation by a method wherein a heat-pipe is composed of a part which is in contact with the upper surface of an electronic device and a part which penetrates the body of a heat dissipation fin main part is built in the heat dissipation fin main part which is composed of a plurality of plate- shape fin parts provided with certain intervals and the body which links the fin parts. CONSTITUTION:The lower part of a micro heat-pipe 20 is formed into a flat spiral 21 and warped upward from the center of the spiral. If the micro heat-pipe 20 is inserted into a heat dissipation fin main part 10, the lower spiral part 21 is fitted in the opening 14 of the heat dissipation fin main part 10 and the part 22 extended upward penetrates through the hole 15 of the body 13 of the heat dissipation fin main part 10. As the spiral part 21 is directly in contact with the upper surface of an electronic device 1, it receives the heat from the electronic device 1 and the liquid in the spiral part 21 is vaporized and quickly transferred to the upper part 22. As the upper part 22 is close to fin parts 11, the part 22 is always cooled and the vaporized liquid is condensed and transferred to the lower spiral part 21 through capillaries by gravity. By repeating this cycle, highly efficient heat dissipation can be achived in a short period.

Description

DETAILED DESCRIPTION OF THE INVENTION [Summary] The present invention relates to a cooling technology for devices with high integration and high power consumption, such as large integrated circuit (LSI) modules, and relates to a structure for enhancing the heat dissipation effect. That is, it has a structure in which heat dissipation fins with a five-layered structure with as large a surface area as possible and a built-in micro heat pipe are mounted on a deep-type package, and the heat on the device is efficiently transferred to the heat dissipation fins.

[Industrial application field]

The present invention relates to the structure of a heat dissipation fin that cools electronic components (devices) such as LSI modules, and particularly to the structure of a heat dissipation fin that includes a built-in micro heat pipe.

[Conventional technology]

Conventional heat dissipation fins that cool highly integrated and high power consumption electronic components such as LSI modules are five-layered fins with a surface area as large as possible, as shown in Part 6.
It was directly mounted on the board constituting the SI module 1. The heat dissipation fin 2 is composed of a cylindrical body part 3 and several disc-shaped fin parts 4, and is mainly used for forced air cooling. released in

[Problem that the invention seeks to solve]

However, in recent years, electronic components such as LSI modules have become smaller and have a higher S density, leading to increased power consumption.
As a result, heat dissipation fins with even better heat dissipation properties are required. Increasing the heat dissipation area of the heat dissipation fins has the problem of increased weight, and there are also other problems such as limitations on the distance from other adjacent electronic components and other printed circuit boards.

On the other hand, electronic components mounted on printed circuit boards have become increasingly smaller and denser in recent years, and power consumption has increased.
The amount of heat generated per electronic component has also increased.

[Means for solving problems]

According to the present invention, at least A heat dissipation fin structure is provided that incorporates a micro heat pipe that includes a portion that contacts the top surface of the electronic component and a portion that penetrates the body portion.

[Operation] The heat from the electronic components is absorbed by the heat pipe, and the liquid at the bottom of the heat pipe evaporates and moves upward at high speed. When it touches the cold part of the upper part of the fin, it condenses into liquid and moves downward under the action of gravity. Return to By repeating this action, heat is efficiently dissipated.

〔Example〕

1 to 5 show examples of heat dissipation fins incorporating micro heat pipes according to the present invention.

The heat dissipation fin main body 10 has several disc-shaped fin parts 11 spaced apart, a square base part 12 at the lowermost side, and a cylindrical body part 13 connecting these parts, which are made of heat dissipating material such as aluminum. It is integrally molded from a metal material with excellent properties.

A circular opening 14 is provided on the lower side of the base portion 12, and a center hole 15 passing through the body portion 13 is provided, and the lower end of this center hole 15 opens into the opening 14. .

A portion 15a of the hole 15 adjacent to the opening 14 has a larger diameter, and a portion 15b has a smaller diameter at the upper portion.

The micro heat pipe 20 is formed into a planar spiral (21) at the lower part, and is curved upward from the center of the spiral part 21, and when the micro heat pipe 20 is inserted into the heat dissipation fin body 10, the lower spiral The portion 21 is accommodated in the opening 14 of the radiation fin body 10, and the upwardly extending portion 22 is inserted into the hole 1 of the body portion 13.
Penetrate 5.

As is well known, the micro heat pipe 20 is composed of a metal tube lined with a wick-shaped capillary material and filled with a small amount of liquid (for example, pure water) in a partial vacuum. The diameter of pipe 20! !
(in this case, 1 to 3 cranes), and assuming that the deep soil l3 of the opening 14 and the inner diameter β2 of the smaller diameter portion 15b of the hole 15, l and pt are slightly smaller than β, and g>i,
, 1>12), the micro heat pipe 20 can be press-fitted into the radiation fin main body 10. Furthermore, when mounted on an electronic component (for example, a 30" x 30 m square shaped component) 1 such as an LSI module on a printed circuit board 5 (Fig. 2), the micro heat pipe 20 is pressed against the upper surface of the electronic component 1. ing.

The larger diameter portion 15a of the hole 15 forms a relief in the bent portion between the spiral portion 21 of the micro heat pipe 20 and the straight portion 22 extending upward. In addition, the micro heat pipe 20 is connected to the heat dissipation fin body 1.
After inserting the micro heat pipe 2o, apply thermal compound (
(not shown) to reduce contact resistance with the radiation fin main body 10 and improve heat conductivity between the two. Further, the heat dissipation fin after the micro heat pipe 20 is assembled can be directly attached to the upper surface of the electronic component 1, for example, the substrate of an LSI module, by screwing the four corners of the base portion 12, for example.

The printed circuit board 5 on which a large number of electronic components 1 are mounted is housed in a shelf (not shown) of an electronic device, and in the case of forced air cooling, cooling air is circulated by a fan (not shown). Since the lower spiral part 21 of the micro heat pipe 20 is in direct contact with the upper surface of the electronic component 1, it receives the heat generated by the electronic component 1, and the liquid inside evaporates and rapidly rises and moves to the upper part 22. . The upper part 22 is cooled because it is close to the fin part 11, becomes a liquid by condensation, and moves downward to the spiral part 21 through a capillary tube by the action of gravity. By repeating this cycle, heat can be efficiently dissipated in a short time.

〔Effect of the invention〕

As explained above, according to the present invention, a micro heat pipe is incorporated into the heat dissipation fin of an electronic component. It can sufficiently deal with the heat dissipation of electronic components.

[Brief explanation of drawings]

FIG. 1 is a plan view of an embodiment of a heat dissipation fin incorporating a micro heat pipe according to the present invention, FIG. 2 is a cross-sectional view of the same, and FIG.
The figure is a perspective view of the same, Figure 4 is a sectional view of the radiation fin body, and Figure 5 is a sectional view of the radiation fin body.
The figure is a perspective view of the heat dissipation fin main body viewed from below, and FIG. 6 is a perspective view showing a conventional heat dissipation fin. 1...Electronic components, 5...Printed circuit boards,
10... Heat dissipation fin body, 11... Fin part, 1
2... Base, 13... Body part, 20.
...Micro heat pipe, 21...Spiral part, 22...Straight line part.

Claims (1)

[Claims] 1. Electronic components such as large integrated circuit modules (1)
Mounted on the top surface, several plate-shaped fins spaced apart (
11) and a body part (13) that connects them, at least a part (21) that contacts the top surface of the electronic component (1) and a body part (13). The radiation fin structure includes a built-in micro heat pipe (20) consisting of a penetrating portion (22).