JPS6367260U - - Google Patents
Info
- Publication number
- JPS6367260U JPS6367260U JP1986160172U JP16017286U JPS6367260U JP S6367260 U JPS6367260 U JP S6367260U JP 1986160172 U JP1986160172 U JP 1986160172U JP 16017286 U JP16017286 U JP 16017286U JP S6367260 U JPS6367260 U JP S6367260U
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- die pad
- semiconductor chip
- pad portion
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/5449—
-
- H10W72/931—
-
- H10W90/756—
Landscapes
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986160172U JPH06834Y2 (ja) | 1986-10-21 | 1986-10-21 | 半導体装置用リ−ドフレ−ム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986160172U JPH06834Y2 (ja) | 1986-10-21 | 1986-10-21 | 半導体装置用リ−ドフレ−ム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6367260U true JPS6367260U (cg-RX-API-DMAC10.html) | 1988-05-06 |
| JPH06834Y2 JPH06834Y2 (ja) | 1994-01-05 |
Family
ID=31085305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986160172U Expired - Lifetime JPH06834Y2 (ja) | 1986-10-21 | 1986-10-21 | 半導体装置用リ−ドフレ−ム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH06834Y2 (cg-RX-API-DMAC10.html) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016134592A (ja) * | 2015-01-22 | 2016-07-25 | Ｓｈマテリアル株式会社 | リードフレーム |
| JP2019079935A (ja) * | 2017-10-25 | 2019-05-23 | 三菱電機株式会社 | 電力用半導体装置 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5684360U (cg-RX-API-DMAC10.html) * | 1979-11-29 | 1981-07-07 | ||
| JPS5818948A (ja) * | 1981-07-27 | 1983-02-03 | Toshiba Corp | リ−ドフレ−ム |
-
1986
- 1986-10-21 JP JP1986160172U patent/JPH06834Y2/ja not_active Expired - Lifetime
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5684360U (cg-RX-API-DMAC10.html) * | 1979-11-29 | 1981-07-07 | ||
| JPS5818948A (ja) * | 1981-07-27 | 1983-02-03 | Toshiba Corp | リ−ドフレ−ム |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016134592A (ja) * | 2015-01-22 | 2016-07-25 | Ｓｈマテリアル株式会社 | リードフレーム |
| JP2019079935A (ja) * | 2017-10-25 | 2019-05-23 | 三菱電機株式会社 | 電力用半導体装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06834Y2 (ja) | 1994-01-05 |