JPS6367254U - - Google Patents

Info

Publication number
JPS6367254U
JPS6367254U JP16131886U JP16131886U JPS6367254U JP S6367254 U JPS6367254 U JP S6367254U JP 16131886 U JP16131886 U JP 16131886U JP 16131886 U JP16131886 U JP 16131886U JP S6367254 U JPS6367254 U JP S6367254U
Authority
JP
Japan
Prior art keywords
semiconductor device
substrate
screw member
fixed
fixing structure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16131886U
Other languages
Japanese (ja)
Other versions
JPH0440281Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP16131886U priority Critical patent/JPH0440281Y2/ja
Publication of JPS6367254U publication Critical patent/JPS6367254U/ja
Application granted granted Critical
Publication of JPH0440281Y2 publication Critical patent/JPH0440281Y2/ja
Expired legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図ないし第3図は本考案に係る半導体装置
の固定構造の実施例を示し、第1図はその平面図
、第2図は第1図のAA断面図、第3図は締付け
部の拡大縦断面図、第4図は従来の半導体装置の
固定構造における締付け部の縦断面図である。 10……半導体装置、11……半導体本体、1
2……ケース、12b……底板、15……締付け
板、17……ボルト。
1 to 3 show an embodiment of the fixing structure for a semiconductor device according to the present invention, FIG. 1 is a plan view thereof, FIG. 2 is a sectional view taken along line AA in FIG. 1, and FIG. FIG. 4 is an enlarged longitudinal sectional view of a fastening portion in a conventional semiconductor device fixing structure. 10...Semiconductor device, 11...Semiconductor body, 1
2...Case, 12b...Bottom plate, 15...Tightening plate, 17...Bolt.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体装置と基板とを接着して板材にねじ部材
で固定する半導体装置の固定構造において、前記
半導体装置の接着面に、前記ねじ部材を貫通して
端面が前記基板に対接する環状突起を突設したこ
とを特徴とする半導体装置の固定構造。
In a semiconductor device fixing structure in which a semiconductor device and a substrate are bonded and fixed to a plate material with a screw member, an annular protrusion is provided on the bonding surface of the semiconductor device to protrude through the screw member and whose end face faces the substrate. A fixed structure for a semiconductor device characterized by:
JP16131886U 1986-10-20 1986-10-20 Expired JPH0440281Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16131886U JPH0440281Y2 (en) 1986-10-20 1986-10-20

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16131886U JPH0440281Y2 (en) 1986-10-20 1986-10-20

Publications (2)

Publication Number Publication Date
JPS6367254U true JPS6367254U (en) 1988-05-06
JPH0440281Y2 JPH0440281Y2 (en) 1992-09-21

Family

ID=31087521

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16131886U Expired JPH0440281Y2 (en) 1986-10-20 1986-10-20

Country Status (1)

Country Link
JP (1) JPH0440281Y2 (en)

Also Published As

Publication number Publication date
JPH0440281Y2 (en) 1992-09-21

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