JPS6367253U - - Google Patents
Info
- Publication number
- JPS6367253U JPS6367253U JP1986161992U JP16199286U JPS6367253U JP S6367253 U JPS6367253 U JP S6367253U JP 1986161992 U JP1986161992 U JP 1986161992U JP 16199286 U JP16199286 U JP 16199286U JP S6367253 U JPS6367253 U JP S6367253U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor
- lead pattern
- semiconductor substrate
- semiconductor device
- central recess
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 17
- 239000000758 substrate Substances 0.000 claims description 4
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986161992U JPS6367253U (de) | 1986-10-22 | 1986-10-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986161992U JPS6367253U (de) | 1986-10-22 | 1986-10-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6367253U true JPS6367253U (de) | 1988-05-06 |
Family
ID=31088830
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986161992U Pending JPS6367253U (de) | 1986-10-22 | 1986-10-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6367253U (de) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07202062A (ja) * | 1993-12-28 | 1995-08-04 | Nec Corp | 半導体装置 |
-
1986
- 1986-10-22 JP JP1986161992U patent/JPS6367253U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07202062A (ja) * | 1993-12-28 | 1995-08-04 | Nec Corp | 半導体装置 |