JPS6366979A - Led array head and manufacture thereof - Google Patents
Led array head and manufacture thereofInfo
- Publication number
- JPS6366979A JPS6366979A JP61210024A JP21002486A JPS6366979A JP S6366979 A JPS6366979 A JP S6366979A JP 61210024 A JP61210024 A JP 61210024A JP 21002486 A JP21002486 A JP 21002486A JP S6366979 A JPS6366979 A JP S6366979A
- Authority
- JP
- Japan
- Prior art keywords
- light
- led
- light emitting
- light output
- array head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000011247 coating layer Substances 0.000 claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 claims description 12
- 108091008695 photoreceptors Proteins 0.000 claims description 3
- 230000003287 optical effect Effects 0.000 abstract description 13
- 230000001678 irradiating effect Effects 0.000 abstract 2
- 230000001105 regulatory effect Effects 0.000 abstract 2
- 239000010410 layer Substances 0.000 description 17
- 229920003002 synthetic resin Polymers 0.000 description 6
- 239000000057 synthetic resin Substances 0.000 description 6
- 230000007423 decrease Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000001427 coherent effect Effects 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 230000000903 blocking effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000010419 fine particle Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000010187 selection method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Landscapes
- Printers Or Recording Devices Using Electromagnetic And Radiation Means (AREA)
- Led Device Packages (AREA)
- Led Devices (AREA)
- Dot-Matrix Printers And Others (AREA)
Abstract
Description
【発明の詳細な説明】
（イ）産業上の利用分野
この発明は、電子写真方式の光プリンタに装備されるＬ
ＥＤアレイヘッドであって、複数のＬＥＤチップの各発
光部から発する光出力が均一となるようにしたＬＥＤア
レイヘッド及びその製造方法に関する。DETAILED DESCRIPTION OF THE INVENTION (a) Industrial application field
The present invention relates to an ED array head in which light output from each light emitting part of a plurality of LED chips is uniform, and a method for manufacturing the same.
（ロ）従来の技術 第７図は、電子写真方式の光プリンタの原理図である。(b) Conventional technology FIG. 7 is a diagram showing the principle of an electrophotographic optical printer.
光プリンタ５は、感光ドラム５１を帯電器５２で帯電さ
せ、発光素子アレイ５３を用いた光プリンタヘッド５４
で静電潜像を形成する。形成された潜像は、現像器５５
によって感光ドラム５１上にトナーが付着され、顕現化
される。このトナーは、用紙カセット５６から送られた
きた記録紙５７に転写器５８で転写され、記録紙５７に
転写されたトナーは、熱圧ローラ等の定着器５９で定着
される。また、感光ドラム５１上の残留トナーは、清掃
器６０でクリーニングされる。そして、消去ランプ６１
で潜像が消去され、−回のプロセスを終了し、次の作像
に備える。The optical printer 5 charges a photosensitive drum 51 with a charger 52 and prints an optical printer head 54 using a light emitting element array 53.
to form an electrostatic latent image. The formed latent image is transferred to the developing device 55.
The toner is adhered onto the photosensitive drum 51 and made visible. This toner is transferred by a transfer device 58 to a recording paper 57 sent from a paper cassette 56, and the toner transferred to the recording paper 57 is fixed by a fixing device 59 such as a heat pressure roller. Further, residual toner on the photosensitive drum 51 is cleaned by a cleaner 60. And erase lamp 61
The latent image is erased, the -th process is completed, and preparations are made for the next image formation.
この光プリンタに使用される光プリンタヘッド（ＬＥＤ
アレイヘッド）は、通常は、第６図に示すような構造の
ものが使用されている。The optical printer head (LED) used in this optical printer
The array head (array head) usually has a structure as shown in FIG.
ＬＥＤアレイヘッドは、放熱兼用取付台板７１の上面に
、複数個のＬＥＤチップ７３を直線状に基板長手方向へ
配列し、ＬＥＤアレイ７４を構成している。そして、こ
の各ＬＥＤチップ７３には、例えば６４個の発光素子（
ＬＥＤ）７７が一列状配置されている。また、各ＬＥＤ
チップ７３に対応して、ドライバチップ７５を配置しで
ある。In the LED array head, a plurality of LED chips 73 are arranged linearly in the longitudinal direction of the substrate on the upper surface of a heat dissipation/mounting plate 71 to form an LED array 74. Each LED chip 73 includes, for example, 64 light emitting elements (
LEDs) 77 are arranged in a row. In addition, each LED
A driver chip 75 is arranged corresponding to the chip 73.
さらに、各ドライバチップ７５には、それぞれ電極が配
置されており、この電極を外部と接続するために、基板
７２の一端部には、外部接続用の信号線ケーブル（フレ
キシブルプリント板）７６が配備されている。Furthermore, electrodes are arranged on each driver chip 75, and in order to connect these electrodes with the outside, a signal line cable (flexible printed board) 76 for external connection is provided at one end of the board 72. has been done.
このＬＥＤアレイヘッドは、ＬＥＤアレイ７４（発光素
子アレイ５３）、つまりＬＥＤチップ７３の配列方向が
感光ドラム５１の軸方向に平行して配置され、ＬＥＤチ
フプ７３と感光ドラム５１との間に集束性ロッドレンズ
（商品名：セルフォックレンズ）６２を配置し、ＬＥＤ
チップ７３のＬＥＤ７７から発した光を集束性ロッドレ
ンズ６２を介して感光ドラム５１上に投射し、潜像を形
成するようにしている（第７図参照）。In this LED array head, an LED array 74 (light emitting element array 53), that is, an array direction of LED chips 73 is arranged parallel to the axial direction of the photosensitive drum 51, and a focusing property is provided between the LED chip 73 and the photosensitive drum 51. A rod lens (product name: SELFOC lens) 62 is arranged, and an LED
Light emitted from the LED 77 of the chip 73 is projected onto the photosensitive drum 51 via the focusing rod lens 62 to form a latent image (see FIG. 7).
（ハ）発明が解決しようとする問題点
高印字品質を得るためには、各発光素子（ＬＥＤ）から
発する光出力が均一であることが理想である。ところが
、各ＬＥＤチップに形成される複数のＬＥＤの光出力は
バラツキを持つ傾向にある。(c) Problems to be Solved by the Invention In order to obtain high print quality, it is ideal that the light output emitted from each light emitting element (LED) be uniform. However, the light output of a plurality of LEDs formed on each LED chip tends to vary.
そこで、従来は、各ＬＥＤチップのＬＥＤの光出力を検
査し、はぼ均等な（光出力のバラツキの小さい）光出力
を有するＬＥＤチップを集め、基板に実装する選別方式
や、各ＬＥＤチップのＬＥＤ毎に露光時間を電子回路で
制御ｌシ、ＬＥＤチップアレイ全体の光出力を均一にす
るパルス分割駆動方式が採用されている。Therefore, conventionally, the LED light output of each LED chip is inspected, LED chips with almost uniform light output (small variation in light output) are collected, and selected methods are used to mount them on a board. The exposure time of each LED is controlled by an electronic circuit, and a pulse division drive method is used to uniformize the light output of the entire LED chip array.
ところが、前者の選別方式では、多数のＬＥＤのうち、
１つでも光出力が他のＬＥＤの平均幅（平均光出力）か
ら大きくはみ出すものである時は、このＬＥＤチップは
使用できないこととなり、歩留まりが低下して製品コス
トが高騰する原因となる不利がある。また、後者のパル
ス分割駆動方式では、ＬＥＤヘッドの駆動制御が複雑と
なる等の不利があった。However, in the former selection method, among the large number of LEDs,
If even one LED chip has a light output that greatly exceeds the average width (average light output) of other LEDs, this LED chip cannot be used, which is disadvantageous as it reduces yield and increases product cost. be. Further, the latter pulse division driving method has disadvantages such as complicated driving control of the LED head.
この発明は、従来のものが持つ以上のような問題点を解
消させ、ＬＥＤチップの各ＬＥＤによるドツト毎の光出
力がほぼ均一で、高品質な印字を達成するＬＥＤアレイ
ヘッド及びその製造方法を提供することを目的としてい
る。This invention solves the above-mentioned problems of the conventional head, and provides an LED array head and method for manufacturing the same that achieves high-quality printing with almost uniform light output for each dot from each LED of the LED chip. is intended to provide.
（ニ）問題点を解決するための手段及び作用この目的を
達成させるために、第１の発明のＬＥＤアレイヘッドは
、絶縁基板の上面に多数の発光部を有する複数個のＬＥ
Ｄチップを一直線状に配置し、前記各発光部から発する
光を感光体に投射するものにおいて、前記各ＬＥＤチッ
プの発光部上面に、光出力を均一にする光出力調整部材
を特徴的に配備している。(d) Means and operation for solving the problem In order to achieve this object, the LED array head of the first invention includes a plurality of LEDs having a large number of light emitting parts on the upper surface of an insulating substrate.
In a device in which D chips are arranged in a straight line and light emitted from each of the light emitting parts is projected onto a photoreceptor, a light output adjustment member is characteristically provided on the upper surface of the light emitting part of each of the LED chips to make the light output uniform. are doing.
このＬＥＤアレイヘッドでは、各ドツトを構成する発光
部の出力光の強さがバラついても、その表面に光の強さ
を均一化する光出力調整部材が設けられているので、各
発光部より発せられた光は、この光出力調整部材を通過
すると、均一な強さとなる。In this LED array head, even if the output light intensity of the light emitting parts that make up each dot varies, a light output adjustment member is provided on the surface to equalize the light intensity. The emitted light becomes uniform in intensity when it passes through this light output adjustment member.
また、第２の発明は、上記ＬＥＤアレイヘッドを製造す
る方法であり、この製造方法では、先ず、従来と同様に
絶縁基板の上面に、多数の発光部を有する複数個のＬＥ
Ｄチップが一直線状に配置される。続いて、各ＬＥＤチ
ップの各発光部を発光させ、各発光部の光出力を検出す
る。次に、各発光部上面に光出力に対応した透明度を持
つ減光被覆層を形成する。この減光被覆層の形成には、
例えば、透明合成樹脂が使用される。すなわち、絶縁基
板の上面に、−直線状に配置されたＬＥＤチップの発光
部上面に透明合成樹脂層を形成し、この透明合成樹脂層
に例えばレーザ光による熱エネルギを照射し、この透明
合成樹脂層を発光部の光出力に対応して透明度を減少さ
せ、減光被覆層を形成する。この減光被覆層は、発光部
の光出力が強いほど不透明度を強くし、光出力が弱いと
不透明度も軽くされる。そのため、この方法によって製
造されたＬＥＤアレイヘッドは、減光被覆層を通過した
光の強さが均一となる。つまり、ドツト毎の光出力がほ
ぼ一定なＬＥＤアレイヘッドが得られる。A second invention is a method of manufacturing the above-mentioned LED array head, and in this manufacturing method, first, a plurality of LEDs having a large number of light emitting parts are placed on the upper surface of an insulating substrate as in the conventional method.
D chips are arranged in a straight line. Subsequently, each light emitting part of each LED chip is caused to emit light, and the light output of each light emitting part is detected. Next, a light-attenuating coating layer having transparency corresponding to the light output is formed on the upper surface of each light emitting part. To form this light-attenuating coating layer,
For example, transparent synthetic resin is used. That is, a transparent synthetic resin layer is formed on the upper surface of an insulating substrate and on the upper surface of the light emitting parts of LED chips arranged linearly, and this transparent synthetic resin layer is irradiated with thermal energy, for example, by laser light, and the transparent synthetic resin is The transparency of the layer decreases in response to the light output of the light emitting portion to form a light attenuating coating layer. The opacity of the light-attenuating coating layer increases as the light output of the light emitting part increases, and the opacity decreases as the light output decreases. Therefore, in the LED array head manufactured by this method, the intensity of light passing through the light attenuation coating layer is uniform. In other words, an LED array head in which the light output per dot is substantially constant can be obtained.
（ホ）実施例
以下、実施例により、この発明をさらに詳細に説明する
。(E) Examples The present invention will be explained in more detail with reference to Examples below.
第１図は、この発明の一実施例を示すＬＰ、Ｄアレイヘ
ッドのＬＥＤチップの具体例を示す要部拡大斜視図、第
２図は、同ＬＥＤチップの断面図である。FIG. 1 is an enlarged perspective view of a main part showing a specific example of an LED chip of an LP and D array head showing an embodiment of the present invention, and FIG. 2 is a sectional view of the same LED chip.
この実施例ＬＥＤアレイヘッドは、前述の従来例く第６
図のもの）と基本において同様の構成である。つまり、
アルミナセラミック基板（絶縁基板）１の上面に、複数
のＬＥＤチップ１１を一直線状に配列してＬＥＤチフプ
アレイが形成され、各ＬＥＤチップ１１には、例えば６
４個の発光素子（ＬＥＤ）１２が直線状に配列して、ド
ツト部を形成している。そして、各ＬＥＤ１２には、一
端部に個別電極１３が接続され、ＬＥＤチップ１１の下
面には共通電極１４が形成されている（第２図参照）。The LED array head of this embodiment is similar to the sixth conventional example described above.
The configuration is basically the same as the one in the figure). In other words,
An LED chip array is formed by arranging a plurality of LED chips 11 in a straight line on the upper surface of an alumina ceramic substrate (insulating substrate) 1, and each LED chip 11 has, for example, 6
Four light emitting elements (LEDs) 12 are arranged in a straight line to form a dot part. An individual electrode 13 is connected to one end of each LED 12, and a common electrode 14 is formed on the lower surface of the LED chip 11 (see FIG. 2).
この実施例ＬＥＤアレイヘッドの特徴は、複数のＬＥＤ
チップ１１からなるＬＥＤチップアレイの発光面、つま
りＬＥＤ１２の上表面に、光出力を均一にする光出力調
整部材２を配備した点にある。この光出力調整部材２に
は、発光部面毎に透明度の相違する減光被覆層であり、
それぞれＬＥＤ１２の発光力の強さに対応して、透明度
が異なるように設定されている。従って、ＬＥＤ１２の
表面より発せられる光の強さが区々であっても、このそ
れぞれのＬＥＤ１２から発せられる光の強さに応じて透
明度を減するように構成しているので、この光出力調整
部材２を通過した光は、一定の強さになるようになって
いる。The feature of this embodiment LED array head is that a plurality of LEDs
A light output adjustment member 2 is provided on the light emitting surface of the LED chip array consisting of chips 11, that is, on the upper surface of the LEDs 12, to make the light output uniform. This light output adjustment member 2 includes a light-attenuating coating layer with different transparency for each light-emitting part surface,
Transparency is set to differ depending on the strength of the luminous power of each LED 12. Therefore, even if the intensity of the light emitted from the surface of the LED 12 varies, the transparency is reduced according to the intensity of the light emitted from each LED 12, so the light output can be adjusted. The light passing through the member 2 is designed to have a constant intensity.
次に、この実施例ＬＥＤアレイヘッドの製造方法につい
て説明する。Next, a method of manufacturing the LED array head of this embodiment will be explained.
先ず、第１の工程で、絶縁基板１上に、それぞれが多数
のＬＥＤ１２を直線状に配置してなるＬＥＤチップ１１
を一直線状に配列して、ＬＥＤチフプアレイを形成する
。この工程は、従来のＬＥＤアレイヘッド製造方法と何
ら変わるところはない。次に、このＬＥＤアレイヘッド
のＬＥＤ１２、・・・、１２を含み、透明被膜層２１を
、第１図に示すように、形成する。この透明被膜層２１
は、絶縁性・耐熱性に優れた熱硬化性樹脂であるフェノ
ール樹脂、あるいはエポキシ樹脂等の透明合成樹脂が使
用される。当初、ＬＥＤ１２上に形成した状態で、この
透明被膜層２１の透明度は略同−である。このような状
況下において、ＬＥＤアレイヘッドの各ＬＥＤ１２、・
・・、１２を点灯させ、第３図に示すように、受光器３
で各ＬＥＤ１２、・・・、１２毎の光出力を受光する。First, in a first step, an LED chip 11 each having a large number of LEDs 12 arranged in a straight line is formed on an insulating substrate 1.
are arranged in a straight line to form an LED chip array. This process is no different from the conventional LED array head manufacturing method. Next, a transparent coating layer 21 including the LEDs 12, . . . , 12 of this LED array head is formed as shown in FIG. This transparent coating layer 21
For this purpose, a phenol resin, which is a thermosetting resin with excellent insulation and heat resistance, or a transparent synthetic resin such as an epoxy resin is used. Initially, the transparency of this transparent coating layer 21 is approximately the same as when it is formed on the LED 12. Under such circumstances, each LED 12 of the LED array head,
. . , 12 is turned on, and the receiver 3 is turned on as shown in FIG.
The light output of each LED 12, . . . , 12 is received.
この場合、各ＬＥＤ１２、・・・、１２の光出力の強さ
は、第５図に示すように、ＬＥＤ１２、・・・、１２毎
に区々であり、強いもの、弱いものが存在する。In this case, the intensity of the light output of each LED 12, . . . , 12 varies depending on the LED 12, .
続いて、こ０ＬＥＤ１２毎の各出力を、透明被膜層２１
を経て得た光出力に応じて、例えば第３図に示すように
、その光の強さに応じて、レーザ装置４を使用して、各
ＬＥＤ１２の上面に位置する透明被膜層２１にコヒレン
ト光を照射する。そして、このコヒレント光の熱エネル
ギで透明被膜層２１上面を発熱させる。この熱エネルギ
により、透明被膜層２１が発熱して化学変化（分子の重
合・架橋反応）を起こし、透明度を低下させ、減光層（
減光被覆層）２２を形成する。この減光層２２の減光度
合、つまり透明度の減少は、第５図に示すように、予め
受光器３で受光した各ＬＥＤ１２毎の光出力に比例して
減光させ、減光した後の光出力が、第５図に示す発光基
準レベルになる程度の減光１２２を形成する。ＬＥＤ１
２から発する光の強さが大なるほどコヒレント光の照射
時間を長（し、その部分の減光層２２の透明度を落とす
。Next, each output of each LED 12 is transferred to the transparent coating layer 21.
The laser device 4 is used to emit coherent light onto the transparent coating layer 21 located on the top surface of each LED 12, depending on the intensity of the light, as shown in FIG. 3, for example. irradiate. The thermal energy of this coherent light causes the upper surface of the transparent coating layer 21 to generate heat. This thermal energy causes the transparent coating layer 21 to generate heat and cause chemical changes (polymerization and crosslinking reactions of molecules), reducing transparency and reducing the light attenuation layer (
A light attenuation coating layer) 22 is formed. As shown in FIG. 5, the degree of light attenuation of the light attenuation layer 22, that is, the decrease in transparency, is determined by attenuating the light in proportion to the light output of each LED 12 received by the light receiver 3 in advance, and after the light attenuating. Attenuation 122 is formed such that the light output reaches the light emission reference level shown in FIG. LED1
As the intensity of the light emitted from the light-attenuating layer 22 increases, the irradiation time of the coherent light increases (and the transparency of the light-attenuating layer 22 in that area decreases).
このようにして減光層２２を形成した後、各ＬＥＤ１２
、・・・、１２から発せられた光が、減光層２２を介し
て出力されると、略同−レベルの光が出力されるように
なり、各ドツト毎の光出力が一定にできる。After forming the light attenuation layer 22 in this way, each LED 12
.
なお、透明樹脂を用いる場合、減光被覆層を形成するの
に必要な熱エネルギは、通常の使用条件で生ずる熱量よ
り十分大きく、しかも経時的な透過率の変化がない程度
とすることが望ましい。In addition, when using a transparent resin, it is desirable that the thermal energy required to form the light-attenuating coating layer is sufficiently greater than the amount of heat generated under normal usage conditions, and that the transmittance does not change over time. .
上記実施例において、光出力調整部材である減光１２２
は、透明合成樹脂に熱エネルギを加えて光出力に対応し
た不透明度を持つ層を形成するようにしたものであるが
、これに代えて、光遮断性を有するインク（顔料）の分
散溶液を使用し、そのインクの滴下度合を調整して、光
出力に応じたインクの滴下量により、ＬＥＤ１２の光出
力に対応した減光率を持つ減光層を形成するようにして
もよい。In the above embodiment, the light attenuation 122 which is the light output adjustment member
In this method, thermal energy is applied to transparent synthetic resin to form a layer with an opacity corresponding to the light output, but instead of this, a dispersion solution of ink (pigment) with light blocking properties is used. A light attenuation layer having a light attenuation rate corresponding to the light output of the LED 12 may be formed by adjusting the amount of ink dropped according to the light output.
第４図は、そのインクにより減光部材を形成する方法を
示す説明図である。この実施例では、光出力調整部材、
つまり減光部材２として、光遮断性を有するインク（顔
料）の分散液２３を使用し、ＬＥＤチップ１１のＬＥＤ
１２に対して、インクノズル４ａからインク２３を滴
下させ、減光層２２を形成させることで、ＬＥＤ１２の
光出力を調整する。すなわち、光出力の−大きいＬＥＤ
１２には、インク２３の滴下量を多く （３滴）付着さ
せて、透明度の低い（層の厚い）減光層を形成し、逆に
光出力の小さいＬＥＤ１２には、インク２３０滴下量を
少なく （１滴）付着させ、透明度の高い（層の薄い）
減光層を形成することにより、ＬＥＤチップ１１全体と
して、略一定の光出力に調整する。FIG. 4 is an explanatory diagram showing a method of forming a light attenuation member using the ink. In this embodiment, a light output adjustment member,
That is, as the light attenuation member 2, an ink (pigment) dispersion liquid 23 having light blocking properties is used, and the LED of the LED chip 11 is
The light output of the LED 12 is adjusted by dropping ink 23 onto the LED 12 from the ink nozzle 4a to form a light attenuation layer 22. In other words, LEDs with -larger light output
12, a large amount (3 drops) of ink 23 is deposited to form a low-transparency (thick layer) light-attenuating layer, and conversely, a small amount of ink 230 is deposited on LED 12, which has a small light output. (1 drop) attached, highly transparent (thin layer)
By forming the light attenuation layer, the light output of the entire LED chip 11 is adjusted to a substantially constant level.
また、実施に際しては、減光被覆層の形成は、上記のよ
うな液体（あるいはペースト状）ではなく、トナー等の
固形状の減光部材を発光面に付着させてもよい。トナー
（微粒の黒い樹脂質等の粉末）の場合には、ＬＥＤチッ
プ１１の発光面に熱付着させる。Furthermore, in practice, the light-attenuating coating layer may be formed by attaching a solid light-attenuating material such as toner to the light-emitting surface instead of using a liquid (or paste) as described above. In the case of toner (fine particles of black resin powder, etc.), it is thermally adhered to the light emitting surface of the LED chip 11.
（へ）発明の効果
以上のように、第１の発明では、ＬＥＤチップの発光面
上面に、光出力を均一にする光出力調整部材を配備する
ようにしたものであるから、たとえ発光部の各発光力に
バラツキがあっても、光出力調整部材より出力される光
の強さは略均−のものとなり、感光体等に照射される光
は常に均一となるので、従来と同じシステムに組込んで
も、印字品質のよい優れた光プリンタを実現することが
可能となる。(F) Effects of the Invention As described above, in the first invention, a light output adjustment member for uniformizing the light output is provided on the upper surface of the light emitting surface of the LED chip. Even if there are variations in the luminous power of each light, the intensity of the light output from the light output adjustment member will be approximately equal, and the light irradiated to the photoreceptor etc. will always be uniform, so the same system as before can be used. Even when incorporated, it is possible to realize an excellent optical printer with good print quality.
また、第２の発明によれば、従来の製法である絶縁基板
の上面に、多数の発光部を有する複数個のＬＥＤチップ
を一直線状に配置する工程に加えて、前記ＬＥＤチップ
の各発光部を発光させて発光部毎の光出力を検出する工
程と、前記各発光部上面に、前記光出力に対応した透明
度を持つ減光被覆層を形成する工程を付加して製造する
ものであるから、各ＬＥＤチップの発光部自体の光出力
が他の発光部に比して大きく外れるものであっても、Ｌ
ＥＤチップをドライバと共に絶縁基板に形成した状態で
減光被覆層の透明度を調節し得、光出力のバラツキを小
さく押さえ得るので、ＬＥＤチップの歩留まりが向上す
る。また、チップ選別不要に伴う工数削減、設備不要等
によるＬＥＤチップのコスト低減が図れる。そのため、
従来方法に比し、格段の優位性がある。Further, according to the second invention, in addition to the conventional manufacturing method of arranging a plurality of LED chips having a large number of light emitting parts in a straight line on the upper surface of an insulating substrate, each light emitting part of the LED chips is This is because it is manufactured by adding a step of emitting light and detecting the light output of each light emitting part, and a step of forming a light attenuation coating layer having a transparency corresponding to the light output on the upper surface of each of the light emitting parts. , even if the light output of the light emitting part itself of each LED chip is significantly different from that of other light emitting parts, the L
The transparency of the light-reducing coating layer can be adjusted while the ED chip and the driver are formed on the insulating substrate, and variations in light output can be suppressed, thereby improving the yield of LED chips. In addition, it is possible to reduce the cost of LED chips due to the need for no chip sorting and the need for equipment. Therefore,
It has a significant advantage over conventional methods.
第１図は、この発明の一実施例を示すＬＥＤアレイヘッ
ドの構成を示す要部拡大斜視図、第２図は、同ＬＥＤア
レイヘッドのＬＥＤチップの断面図、第３図は、同ＬＥ
Ｄアレイヘッドの製造方法を説明するための説明図、第
４図は、光出力調整部材を形成する他の方法を説明する
ための図、第５図は、減光層により各ＬＥＤの光出力を
一定レベルに調整する状態を示す説明図、第６図は、従
来のＬＥＤアレイヘフドを示す斜視図、第７図は、光プ
リンタの原理図である。
１：絶縁基板、 ２：光出力調整部材、３：受光器
、 ４；レーザ装置、１１ ： ＬＥＤチップ
、１２ ： ＬＥＤ。
２１：透明被膜層、 ２２：減光層。
特許出願人 ローム株式会社代理人
弁理士 中 村 茂 信第 ２ プ
２：九出ＴＩｘ贅部Ｊλ
ＩＴＵミＤ千−ソフち
１２：ＬＥＤ
第３図
３：受九器
８４図
第５図
第６図
第７図FIG. 1 is an enlarged perspective view of essential parts showing the configuration of an LED array head showing an embodiment of the present invention, FIG. 2 is a sectional view of an LED chip of the LED array head, and FIG.
An explanatory diagram for explaining the manufacturing method of the D array head, FIG. 4 is a diagram for explaining another method of forming the light output adjusting member, and FIG. FIG. 6 is a perspective view showing a conventional LED array head, and FIG. 7 is a diagram showing the principle of an optical printer. DESCRIPTION OF SYMBOLS 1: Insulating substrate, 2: Optical output adjustment member, 3: Light receiver, 4: Laser device, 11: LED chip, 12: LED. 21: Transparent film layer, 22: Light attenuation layer. Patent applicant ROHM Co., Ltd. agent
Patent Attorney Shigeru Nakamura Shindai 2 Pu 2: Kude TI x Futabe Jλ ITU Mi D Sen-Sofuchi 12: LED Figure 3 3: Ukukuki 84 Figure 5 Figure 6 Figure 7
Claims (2)
のＬＥＤチップを一直線状に配置し、前記各発光部から
発する光を感光体に投射するＬＥＤアレイヘッドにおい
て、 前記各ＬＥＤチップの発光部上面に、光出力を均一にす
る光出力調整部材を配備したことを特徴とするＬＥＤア
レイヘッド。(1) In an LED array head in which a plurality of LED chips each having a large number of light emitting parts are arranged in a straight line on the upper surface of an insulating substrate, and light emitted from each of the light emitting parts is projected onto a photoreceptor, each of the LED chips An LED array head characterized in that a light output adjustment member for making the light output uniform is provided on the upper surface of the light emitting part.
のＬＥＤチツプを一直線状に配置する工程と、前記ＬＥ
Ｄチップの各発光部を発光させて、各発光部毎の光出力
を検出する工程と、前記各発光部上面に前記光出力に対
応した透明度を持つ減光被覆層を形成する工程とからな
るＬＥＤアレイヘッドの製造方法。(2) A step of arranging a plurality of LED chips having a large number of light emitting parts in a straight line on the upper surface of an insulating substrate;
It consists of a step of causing each light emitting part of the D chip to emit light and detecting the light output of each light emitting part, and a step of forming a light attenuation coating layer having a transparency corresponding to the light output on the upper surface of each of the light emitting parts. A method for manufacturing an LED array head.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61210024A JPS6366979A (en) | 1986-09-06 | 1986-09-06 | Led array head and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61210024A JPS6366979A (en) | 1986-09-06 | 1986-09-06 | Led array head and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6366979A true JPS6366979A (en) | 1988-03-25 |
Family
ID=16582554
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61210024A Pending JPS6366979A (en) | 1986-09-06 | 1986-09-06 | Led array head and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6366979A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63187674A (en) * | 1987-01-30 | 1988-08-03 | Yokogawa Medical Syst Ltd | Manufacture of light-emitting element array |
| JPH0334475A (en) * | 1989-06-30 | 1991-02-14 | Oki Electric Ind Co Ltd | Led-array print head |
| JP2011044754A (en) * | 2003-06-30 | 2011-03-03 | Osram Opto Semiconductors Gmbh | Radiation-emitting semiconductor chip, method of manufacturing the same, and method of adjusting/setting brightness of the same |
| JP2014086558A (en) * | 2012-10-23 | 2014-05-12 | Fuji Xerox Co Ltd | Light-emitting component, print head and image formation apparatus |
| JP2020140981A (en) * | 2019-02-26 | 2020-09-03 | ローム株式会社 | Semiconductor light-emitting device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61121969A (en) * | 1984-11-19 | 1986-06-09 | Tokyo Electric Co Ltd | Method and apparatus for controlling quantity of light of light emitting element array |
| JPS6146521B2 (en) * | 1980-02-15 | 1986-10-15 | Mitsubishi Metal Corp | |
| JPS6365685A (en) * | 1986-09-05 | 1988-03-24 | Rohm Co Ltd | Manufacture of led array head |
-
1986
- 1986-09-06 JP JP61210024A patent/JPS6366979A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6146521B2 (en) * | 1980-02-15 | 1986-10-15 | Mitsubishi Metal Corp | |
| JPS61121969A (en) * | 1984-11-19 | 1986-06-09 | Tokyo Electric Co Ltd | Method and apparatus for controlling quantity of light of light emitting element array |
| JPS6365685A (en) * | 1986-09-05 | 1988-03-24 | Rohm Co Ltd | Manufacture of led array head |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63187674A (en) * | 1987-01-30 | 1988-08-03 | Yokogawa Medical Syst Ltd | Manufacture of light-emitting element array |
| JPH0334475A (en) * | 1989-06-30 | 1991-02-14 | Oki Electric Ind Co Ltd | Led-array print head |
| JP2011044754A (en) * | 2003-06-30 | 2011-03-03 | Osram Opto Semiconductors Gmbh | Radiation-emitting semiconductor chip, method of manufacturing the same, and method of adjusting/setting brightness of the same |
| JP2014086558A (en) * | 2012-10-23 | 2014-05-12 | Fuji Xerox Co Ltd | Light-emitting component, print head and image formation apparatus |
| JP2020140981A (en) * | 2019-02-26 | 2020-09-03 | ローム株式会社 | Semiconductor light-emitting device |
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