JPS6366053B2 - - Google Patents
Info
- Publication number
- JPS6366053B2 JPS6366053B2 JP55096431A JP9643180A JPS6366053B2 JP S6366053 B2 JPS6366053 B2 JP S6366053B2 JP 55096431 A JP55096431 A JP 55096431A JP 9643180 A JP9643180 A JP 9643180A JP S6366053 B2 JPS6366053 B2 JP S6366053B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- lead frame
- bonding
- molding
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000000034 method Methods 0.000 claims description 12
- 238000000465 moulding Methods 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 7
- 230000001105 regulatory effect Effects 0.000 claims 2
- 229910000679 solder Inorganic materials 0.000 description 10
- 238000003860 storage Methods 0.000 description 5
- 229920005992 thermoplastic resin Polymers 0.000 description 5
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- -1 POLYPHENYLENE Polymers 0.000 description 1
- 229920000265 Polyparaphenylene Polymers 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
- G04G17/02—Component assemblies
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/20—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern
- H05K3/202—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by affixing prefabricated conductor pattern using self-supporting metal foil pattern
Description
【発明の詳細な説明】
本発明は、リードフレーム等のパターン化され
た配線部材にICをFC（フリツプチツプ）法にてボ
ンデイングする際、あらかじめICの位置決めと
なる受け台を形成した回路基体に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a circuit board in which a pedestal for positioning an IC is formed in advance when an IC is bonded to a patterned wiring member such as a lead frame by the FC (flip chip) method.
従来、デジタル時計のモジユール構成部品とし
て、表示セルを支持固定する部品（以下、セル支
持枠と呼ぶ）、及び水晶振動子、コンデンサー等
をカバーする部品（以下、デバイスカバーと呼
ぶ）の２部品がモジユールの中で占める容積は大
である。２部品とも生産性の良い熱可塑性プラス
チツクにて成型されていて、各素子を搭載したプ
リント基板、フレキシブルプリント基板、リード
フレーム等の回路基板を挾持するが如く配置され
ている。また、ICのボンデイング法として従来、
ワイヤーボンデイングが多かつたが、工数低下、
実装スペースを小さくするという点から前記ワイ
ヤーボンデイングに代つてワイヤーレスボンデイ
ングが多くなる傾向にある。ワイヤーレスボンデ
イングの中の１つとして、ICのパツドにハンダ
バンプを形成させ、該ハンダバンプが基板のパタ
ーンに載るようにICを搭載し、加熱してボンデ
イングするという方法（これをFC法と呼ぶ）が
ある。今迄FC法にて、リードフレームにICをボ
ンデイングする場合、ICのハンダバンプ側を下
にし、該ハンダバンプを基板のパターンに加熱溶
着させているが、ICの、高さを含めた位置決め
をするものが無いので、作業がしずらく工数増大
をきたし、更にはICのリードフレームに対する
高さが定まらないことから、ボンデイングの信頼
性にも影響があるという欠点があつた。本発明は
上記欠点を解決し、製造コストを廉く、信頼性が
高く、小型薄型の電子時計を提供することを目的
としている。 Conventionally, the module components of a digital watch consist of two parts: a part that supports and fixes the display cell (hereinafter referred to as the cell support frame), and a part that covers the crystal oscillator, capacitor, etc. (hereinafter referred to as the device cover). The volume occupied in the module is large. Both parts are molded from thermoplastic plastic, which is highly productive, and are arranged so as to sandwich circuit boards such as printed circuit boards, flexible printed circuit boards, and lead frames on which each element is mounted. In addition, as a bonding method for IC,
Although a lot of wire bonding was required, the number of man-hours was reduced.
From the viewpoint of reducing the mounting space, there is a tendency for wireless bonding to replace the wire bonding described above. One method of wireless bonding is to form solder bumps on the IC pad, mount the IC so that the solder bumps are on the board pattern, and heat and bond (this is called the FC method). be. Until now, when bonding an IC to a lead frame using the FC method, the solder bump side of the IC is placed down and the solder bump is heated and welded to the pattern on the board. Since there is no lead frame, the work is difficult and the number of man-hours increases.Furthermore, the height of the IC relative to the lead frame cannot be determined, which has the disadvantage of affecting the reliability of bonding. SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned drawbacks and provide an electronic timepiece that is low in manufacturing cost, highly reliable, and small and thin.
上記目的を達成するため、本発明に於いては、
リードフレーム等の配線部材を耐熱性が有り、流
動性の良い熱可塑性樹脂に依り、インサート成形
することによつて、前記セル支持枠及びデバイス
カバーとしての機能を有する一体部品とし、更に
ICの高さを含めた位置決めとなる受け台をIC実
装部内及びその周辺に設けた。 In order to achieve the above object, in the present invention,
By insert molding the wiring member such as the lead frame using a thermoplastic resin that is heat resistant and has good fluidity, it is made into an integrated component that functions as the cell support frame and the device cover, and
A cradle was provided in and around the IC mounting area to determine the position of the IC, including its height.
以下図面により本発明の実施例を詳記する。第
１図は本発明に於ける一実施例である時計用回路
基体の平面図であり、第２図は第１図の時計用回
路基体に表示セル、電池、コネクター等を組込ん
だデジタル電子時計用モジユールのＡ−Ａ断面図
であり、第３図は第２図のIC実装部の拡大断面
図である。 Embodiments of the present invention will be described in detail below with reference to the drawings. FIG. 1 is a plan view of a circuit board for a watch, which is an embodiment of the present invention, and FIG. 3 is an AA sectional view of the watch module, and FIG. 3 is an enlarged sectional view of the IC mounting part of FIG. 2.
第１図に於いて１はリードフレーム２をインサ
ート成形して、従来のセル支持枠とデバイスカバ
ーの機能を有するごとく一体成形して出来た回路
基体を示し、該回路基体１には、表示セルとの電
気的接続の役目をなすコネクターを収納するため
のコネクター収納部３、水晶振動子を収納するた
めの水晶振動子収納部４、電池を収納するための
電池収納部５等のエレメントを収納するための各
収納部が形成されている。リードフレーム２をイ
ンサート成形する際、使用する樹脂として、本実
施例では熱可塑性樹脂の中でも耐熱性が有り、流
動性の良いPPS（POLYPHENYLENE
SULFIDE）樹脂を使用した。このPPS樹脂は成
形時間は約20〜30秒で生産性は抜群である。 In FIG. 1, reference numeral 1 designates a circuit board made by insert-molding a lead frame 2 and integrally molding it to have the functions of a conventional cell support frame and a device cover. Contains elements such as a connector storage section 3 for storing a connector that serves as an electrical connection with the device, a crystal resonator storage section 4 for storing a crystal resonator, and a battery storage section 5 for storing a battery. Each storage section is formed for When insert molding the lead frame 2, the resin used in this example is PPS (POLYPHENYLENE), which has heat resistance and good fluidity among thermoplastic resins.
SULFIDE) resin was used. The molding time for this PPS resin is approximately 20 to 30 seconds, and productivity is excellent.
第２図は、前記回路基体１にIC６をFC法にて
ボンデイングしたのち、液状エポキシ樹脂をポツ
テイングしてIC６を封止した構造を示し、７は
ポツテイング後キユアー炉にて硬化されたエポキ
シ樹脂である。 Figure 2 shows a structure in which IC6 is bonded to the circuit board 1 by the FC method, and then liquid epoxy resin is potted to seal the IC6, and 7 is an epoxy resin cured in a curing furnace after potting. be.
更にIC封止後、各エレメントを各々の収納部
に収納した状態も示しており、８は表示セル、９
はコネクターである。 Furthermore, after IC sealing, the state in which each element is stored in its respective storage section is also shown, 8 is a display cell, 9 is a display cell, and 9 is a display cell.
is a connector.
第３図は耐熱性が有り、流動性の良い熱可塑性
樹脂（PPS樹脂）にて成形された回路基体１に、
IC６がFC法によつてボンデイングされた状態を
拡大して示すものであり、１０はハンダバンプで
あり、１１は前記回路基体１の成形時に同時形成
されたIC受け台である。該受け台１１の形状と
しては次の条件を備えている。高さはFC法にて
ボンデイングされた時の最適なるハンダバンプ高
さh1に相当し、縦方向、横方向のサイズに関して
は、一方の長さは例えば図示したように、IC上
のハンダバンプ間距離l1よりも0.1〜0.2mm程度小
さいl2であり、他方の長さは紙面に垂直方向にl1
とl2と同じ関係でハンダバンプ間距離より0.1〜
0.2mm程度小さい長さを取る。 Figure 3 shows a circuit board 1 made of heat-resistant and fluid thermoplastic resin (PPS resin).
This is an enlarged view of an IC 6 bonded by the FC method, where 10 is a solder bump and 11 is an IC holder formed at the same time as the circuit board 1 is molded. The shape of the pedestal 11 satisfies the following conditions. The height corresponds to the optimal solder bump height h1 when bonding is performed using the FC method, and regarding the vertical and horizontal sizes, one length is, for example, the distance between solder bumps on the IC as shown in the figure. l 2 is about 0.1 to 0.2 mm smaller than l 1 , and the other length is l 1 in the direction perpendicular to the paper surface.
With the same relationship as l 2 , the distance between solder bumps is 0.1~
Take a length that is about 0.2mm smaller.
受け台１１の形状を上記の如くすることに依
り、IC６の回路基体１に対しての平面方向及び
垂直方向の位置決めが、IC６を回路基体１に搭
載するだけで必然的に定まり、大巾なる工数低下
が計れ歩留り、信頼性の向上に役立つた。 By configuring the shape of the cradle 11 as described above, the positioning of the IC 6 in the planar direction and the vertical direction with respect to the circuit board 1 is inevitably determined simply by mounting the IC 6 on the circuit board 1, and the width is greatly improved. This helps reduce man-hours, improve yield, and improve reliability.
特に回路基体１に対して垂直方向となる、IC
６の高さに関して、IC６を該基体１に搭載した
時点では受け台１１とIC６の底部との間に微小
なる間隙を持つが、ボンデイング工程で加熱され
ることに依り、ハンダバンプが溶け始め、IC６
の自重にてIC６が間隙分降下し、受け台１１に
当たり、正確な位置に固定される。 In particular, the IC is perpendicular to the circuit board 1.
Regarding the height of the IC 6, when the IC 6 is mounted on the base 1, there is a small gap between the pedestal 11 and the bottom of the IC 6, but as the solder bumps are heated during the bonding process, the solder bumps begin to melt and the IC 6
The IC 6 descends by the gap due to its own weight, hits the pedestal 11, and is fixed at an accurate position.
上記の如く、本発明は耐熱性があり流動性の良
い熱可塑性樹脂、特にPPS樹脂にてリードフレー
ムをインサートし、回路基体を成形する際、FC
法にてボンデイングされるICの位置決めとなる
受け台を同時成形したことに依り製造コストが廉
く、信頼性が高い小型薄型の電子時計を提供する
ことが出来た。 As mentioned above, the present invention uses heat-resistant and fluid thermoplastic resin, especially PPS resin, to insert the lead frame and mold the circuit board.
By simultaneously molding the cradle that positions the IC that is bonded by the method, we were able to provide a small and thin electronic watch with low manufacturing costs and high reliability.
又、本実施例では熱可塑性の樹脂について示し
たが、これに限定されるものでなく熱硬化性樹脂
（例えばエポキシ樹脂）への適用を考えた場合、
FC法に於けるICの位置決めが容易なることに伴
う効果は同様であり、さらに配線部材としてはリ
ードフレームの代りにプリント基板を使用するこ
とも可能である。 In addition, although this example shows a thermoplastic resin, the present invention is not limited to this, and when considering application to a thermosetting resin (for example, an epoxy resin),
The effect associated with the easy positioning of the IC in the FC method is similar, and furthermore, it is also possible to use a printed circuit board instead of a lead frame as the wiring member.
第１図は本発明に於ける時計用回路基体の平面
図、第２図は時計用回路基体にIC、表示セルコ
ネクター等のエレメントを組込んだデジタル電子
時計用モジユールのＡ−Ａ断面図であり、第３図
は第２図のIC実装部の拡大断面図である。
１……時計用回路基体、２……リードフレー
ム、６……IC、１１……IC受け台。
Fig. 1 is a plan view of a circuit board for a timepiece according to the present invention, and Fig. 2 is a sectional view taken along line A-A of a module for a digital electronic timepiece in which elements such as an IC and a display cell connector are incorporated into the circuit board for a timepiece. 3 is an enlarged sectional view of the IC mounting part of FIG. 2. 1...Circuit base for a watch, 2...Lead frame, 6...IC, 11...IC holder.
Claims (1)
することによりIC実装部及び各エレメントの収
納部を形成し、かつ前記IC実装部内の配線部材
にICをフリツプチツプ法によつてボンデングす
る回路基体に於いて、前記IC実装部内にICの高
さを規制するためのIC受け台を前記回路基体の
成形樹脂による同時成形によつて設け、前記IC
受け台によつてICのボンデング高さを規制した
ことを特徴とする回路基体。1. In a circuit board in which an IC mounting part and a housing part for each element are formed by insert molding a patterned wiring member, and an IC is bonded to the wiring member in the IC mounting part by a flip-chip method, An IC holder for regulating the height of the IC is provided in the IC mounting part by simultaneous molding with the molding resin of the circuit board, and
A circuit board characterized in that the bonding height of an IC is regulated by a cradle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9643180A JPS5722583A (en) | 1980-07-15 | 1980-07-15 | Circuit board for watch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9643180A JPS5722583A (en) | 1980-07-15 | 1980-07-15 | Circuit board for watch |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5722583A JPS5722583A (en) | 1982-02-05 |
| JPS6366053B2 true JPS6366053B2 (en) | 1988-12-19 |
Family
ID=14164808
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9643180A Granted JPS5722583A (en) | 1980-07-15 | 1980-07-15 | Circuit board for watch |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5722583A (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4733664A (en) * | 1983-12-01 | 1988-03-29 | University Of New Mexico | Surgical clip, applier, and method |
-
1980
- 1980-07-15 JP JP9643180A patent/JPS5722583A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5722583A (en) | 1982-02-05 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6940141B2 (en) | Flip-chip image sensor packages and methods of fabrication | |
| KR100837453B1 (en) | Piezoelectric device | |
| JP2019513318A (en) | Camera module, photosensitive part thereof and method of manufacturing the same | |
| CN106257652B (en) | Packaging module and packaging method | |
| FR2310588A1 (en) | METHOD OF ASSEMBLING AN ELECTRONIC WATCH CIRCUIT | |
| US7023288B2 (en) | Piezoelectric oscillator and its manufacturing method | |
| CN110602361B (en) | Camera assembly and electronic equipment | |
| CN110620870A (en) | Camera module, electronic equipment and manufacturing method of camera module | |
| JPS6366053B2 (en) | ||
| JPH10256412A (en) | Semiconductor device and manufacture thereof | |
| US4144705A (en) | Timepiece circuit device | |
| JPS58204547A (en) | Sealing method for ic | |
| JP3148218B2 (en) | IC module | |
| CN110504939A (en) | A kind of crystal oscillator and its manufacturing method | |
| JPS6129543B2 (en) | ||
| TWI792953B (en) | Package structure, manufacturing method of package structure, camera module and electronic device | |
| JPS59149406A (en) | Circuit package structure | |
| US20220108930A1 (en) | Electronic component with metallic cap | |
| JPS58131656U (en) | Electrode circuit board for IC card | |
| JPS6119561Y2 (en) | ||
| JPS6136701B2 (en) | ||
| GB1531677A (en) | Electronic circuit assembly and method of making the same | |
| CN208210136U (en) | A kind of camera module of miniaturization | |
| JPS6017843Y2 (en) | Boost coil holding structure | |
| KR101208875B1 (en) | Printed circuit board mounting process |