JPS6365754B2 - - Google Patents
Info
- Publication number
- JPS6365754B2 JPS6365754B2 JP58193345A JP19334583A JPS6365754B2 JP S6365754 B2 JPS6365754 B2 JP S6365754B2 JP 58193345 A JP58193345 A JP 58193345A JP 19334583 A JP19334583 A JP 19334583A JP S6365754 B2 JPS6365754 B2 JP S6365754B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- sputtering
- electrodes
- sputter
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 58
- 238000004544 sputter deposition Methods 0.000 claims description 43
- 239000010409 thin film Substances 0.000 claims description 13
- 230000005672 electromagnetic field Effects 0.000 claims description 2
- 230000000452 restraining effect Effects 0.000 claims description 2
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 238000000429 assembly Methods 0.000 description 11
- 230000000712 assembly Effects 0.000 description 11
- 239000007789 gas Substances 0.000 description 7
- 238000003780 insertion Methods 0.000 description 5
- 230000037431 insertion Effects 0.000 description 5
- 239000010408 film Substances 0.000 description 4
- 239000012212 insulator Substances 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 3
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 3
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000007599 discharging Methods 0.000 description 3
- 239000011521 glass Substances 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000000088 plastic resin Substances 0.000 description 3
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 2
- 239000000498 cooling water Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000002932 luster Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 1
- 229910052786 argon Inorganic materials 0.000 description 1
- QUQFTIVBFKLPCL-UHFFFAOYSA-L copper;2-amino-3-[(2-amino-2-carboxylatoethyl)disulfanyl]propanoate Chemical compound [Cu+2].[O-]C(=O)C(N)CSSCC(N)C([O-])=O QUQFTIVBFKLPCL-UHFFFAOYSA-L 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000010849 ion bombardment Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19334583A JPS6086272A (ja) | 1983-10-18 | 1983-10-18 | スパツタ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19334583A JPS6086272A (ja) | 1983-10-18 | 1983-10-18 | スパツタ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6086272A JPS6086272A (ja) | 1985-05-15 |
| JPS6365754B2 true JPS6365754B2 (ko) | 1988-12-16 |
Family
ID=16306350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19334583A Granted JPS6086272A (ja) | 1983-10-18 | 1983-10-18 | スパツタ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6086272A (ko) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0913169A (ja) * | 1995-06-29 | 1997-01-14 | Matsushita Electric Ind Co Ltd | スパッタリング装置 |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3613018A1 (de) * | 1986-04-17 | 1987-10-22 | Santos Pereira Ribeiro Car Dos | Magnetron-zerstaeubungskathode |
| US5458759A (en) * | 1991-08-02 | 1995-10-17 | Anelva Corporation | Magnetron sputtering cathode apparatus |
| KR20070121838A (ko) * | 2005-04-14 | 2007-12-27 | 탱고 시스템즈 인코포레이티드 | 스퍼터링 시스템 |
| US7682495B2 (en) | 2005-04-14 | 2010-03-23 | Tango Systems, Inc. | Oscillating magnet in sputtering system |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59133370A (ja) * | 1983-01-21 | 1984-07-31 | Seiko Instr & Electronics Ltd | マグネトロンスパツタ−装置 |
-
1983
- 1983-10-18 JP JP19334583A patent/JPS6086272A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59133370A (ja) * | 1983-01-21 | 1984-07-31 | Seiko Instr & Electronics Ltd | マグネトロンスパツタ−装置 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0913169A (ja) * | 1995-06-29 | 1997-01-14 | Matsushita Electric Ind Co Ltd | スパッタリング装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6086272A (ja) | 1985-05-15 |
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