JPS6365754B2 - - Google Patents
Info
- Publication number
- JPS6365754B2 JPS6365754B2 JP58193345A JP19334583A JPS6365754B2 JP S6365754 B2 JPS6365754 B2 JP S6365754B2 JP 58193345 A JP58193345 A JP 58193345A JP 19334583 A JP19334583 A JP 19334583A JP S6365754 B2 JPS6365754 B2 JP S6365754B2
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- sputtering
- electrodes
- sputter
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19334583A JPS6086272A (ja) | 1983-10-18 | 1983-10-18 | スパツタ装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19334583A JPS6086272A (ja) | 1983-10-18 | 1983-10-18 | スパツタ装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6086272A JPS6086272A (ja) | 1985-05-15 |
JPS6365754B2 true JPS6365754B2 (enrdf_load_stackoverflow) | 1988-12-16 |
Family
ID=16306350
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19334583A Granted JPS6086272A (ja) | 1983-10-18 | 1983-10-18 | スパツタ装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6086272A (enrdf_load_stackoverflow) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0913169A (ja) * | 1995-06-29 | 1997-01-14 | Matsushita Electric Ind Co Ltd | スパッタリング装置 |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3613018A1 (de) * | 1986-04-17 | 1987-10-22 | Santos Pereira Ribeiro Car Dos | Magnetron-zerstaeubungskathode |
US5458759A (en) * | 1991-08-02 | 1995-10-17 | Anelva Corporation | Magnetron sputtering cathode apparatus |
KR20070121838A (ko) * | 2005-04-14 | 2007-12-27 | 탱고 시스템즈 인코포레이티드 | 스퍼터링 시스템 |
US7682495B2 (en) | 2005-04-14 | 2010-03-23 | Tango Systems, Inc. | Oscillating magnet in sputtering system |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59133370A (ja) * | 1983-01-21 | 1984-07-31 | Seiko Instr & Electronics Ltd | マグネトロンスパツタ−装置 |
-
1983
- 1983-10-18 JP JP19334583A patent/JPS6086272A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0913169A (ja) * | 1995-06-29 | 1997-01-14 | Matsushita Electric Ind Co Ltd | スパッタリング装置 |
Also Published As
Publication number | Publication date |
---|---|
JPS6086272A (ja) | 1985-05-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6197165B1 (en) | Method and apparatus for ionized physical vapor deposition | |
US6641702B2 (en) | Sputtering device | |
US7815782B2 (en) | PVD target | |
EP1146139A1 (en) | Sputtering apparatus | |
EP3031946B1 (en) | Film deposition device | |
EP0737999B1 (en) | A magnetron sputtering system | |
KR100532805B1 (ko) | 기판상의 박막 증착 장치 및 방법 | |
KR20170094442A (ko) | Pvd 유전체 증착을 위한 장치 | |
CN114015997A (zh) | 一种离子辅助的多靶磁控溅射设备 | |
US9754771B2 (en) | Encapsulated magnetron | |
US5378341A (en) | Conical magnetron sputter source | |
KR20210118198A (ko) | 펄스형 pvd에서의 플라즈마 수정을 통한 웨이퍼들로부터의 입자 제거를 위한 방법 | |
JPS6365754B2 (enrdf_load_stackoverflow) | ||
US5753089A (en) | Sputter coating station | |
EP0600429B1 (en) | Magnetron sputtering device and method for thin film coating | |
JPH11302841A (ja) | スパッタ装置 | |
US9368331B2 (en) | Sputtering apparatus | |
US20230175112A1 (en) | Film forming method and film forming apparatus | |
CN217052381U (zh) | 一种离子辅助的多靶磁控溅射设备 | |
US6620298B1 (en) | Magnetron sputtering method and apparatus | |
CN112292475A (zh) | 具有多阴极的沉积系统 | |
KR101780945B1 (ko) | 인라인 스퍼터링 시스템 | |
US20100018857A1 (en) | Sputter cathode apparatus allowing thick magnetic targets | |
JPH08134641A (ja) | スパッタリング装置 | |
JPS63223173A (ja) | 基板処理方法およびその装置 |