JPS6365266U - - Google Patents
Info
- Publication number
- JPS6365266U JPS6365266U JP16051286U JP16051286U JPS6365266U JP S6365266 U JPS6365266 U JP S6365266U JP 16051286 U JP16051286 U JP 16051286U JP 16051286 U JP16051286 U JP 16051286U JP S6365266 U JPS6365266 U JP S6365266U
- Authority
- JP
- Japan
- Prior art keywords
- electrolytic capacitor
- notch
- circuit board
- printed circuit
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16051286U JPS6365266U (xx) | 1986-10-20 | 1986-10-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP16051286U JPS6365266U (xx) | 1986-10-20 | 1986-10-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6365266U true JPS6365266U (xx) | 1988-04-30 |
Family
ID=31085964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP16051286U Pending JPS6365266U (xx) | 1986-10-20 | 1986-10-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6365266U (xx) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014143379A (ja) * | 2013-01-25 | 2014-08-07 | Canon Inc | 実装基板および電子部品の実装方法 |
-
1986
- 1986-10-20 JP JP16051286U patent/JPS6365266U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2014143379A (ja) * | 2013-01-25 | 2014-08-07 | Canon Inc | 実装基板および電子部品の実装方法 |