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Filing date
Publication date
Application filedfiledCritical
Priority to JP15449886UpriorityCriticalpatent/JPH0434934Y2/ja
Publication of JPS6362271UpublicationCriticalpatent/JPS6362271U/ja
Application grantedgrantedCritical
Publication of JPH0434934Y2publicationCriticalpatent/JPH0434934Y2/ja
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
H01L24/743—Apparatus for manufacturing layer connectors
H—ELECTRICITY
H01—ELECTRIC ELEMENTS
H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
H01L2224/741—Apparatus for manufacturing means for bonding, e.g. connectors
H01L2224/743—Apparatus for manufacturing layer connectors
