JPS636163U - - Google Patents

Info

Publication number
JPS636163U
JPS636163U JP9759286U JP9759286U JPS636163U JP S636163 U JPS636163 U JP S636163U JP 9759286 U JP9759286 U JP 9759286U JP 9759286 U JP9759286 U JP 9759286U JP S636163 U JPS636163 U JP S636163U
Authority
JP
Japan
Prior art keywords
side magnet
jet nozzle
solder jet
impeller
work table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9759286U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP9759286U priority Critical patent/JPS636163U/ja
Publication of JPS636163U publication Critical patent/JPS636163U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Molten Solder (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

図面第1図は本考案に係る局所はんだ付け装置
の一実施例を示す概略構成図、第2図は他の一実
施例を示す要部概略構成図である。 1……装置筐体、2……作業テーブル、3……
溶融はんだ、4……はんだ槽、5……はんだ噴流
ノズル、7……羽根車、10……水平軸、11,
15……従動側マグネツト、12……カバー体、
13,16……主動側マグネツト、14……モー
タ(回転駆動源)。
FIG. 1 is a schematic diagram showing an embodiment of a local soldering device according to the present invention, and FIG. 2 is a schematic diagram showing a main part of another embodiment. 1...Device housing, 2...Work table, 3...
Molten solder, 4... Solder bath, 5... Solder jet nozzle, 7... Impeller, 10... Horizontal shaft, 11,
15... Driven side magnet, 12... Cover body,
13, 16... Active side magnet, 14... Motor (rotary drive source).

Claims (1)

【実用新案登録請求の範囲】 (1) 作業テーブル上に露呈するはんだ噴流ノズ
ルとこのはんだ噴流ノズルに溶融はんだを給送す
る羽根車とを有して前記作業テーブル下側に配設
されているはんだ槽を備え、前記羽根車から延設
された水平軸の他端には異なる磁極を周方向に配
列してなる従動側マグネツトが設けられるととも
に、この従動側マグネツトには異なる磁極を周方
向に配列してなる主動側マグネツトが配設され、
上記主動側マグネツトの磁極位置変更によつて従
動側マグネツトが回転駆動されることを特徴とす
る局所はんだ付け装置。 (2) 実用新案登録請求の範囲第1項記載の装置
において、主動側マグネツトが回転駆動源に連結
されていることによつて磁極位置変更されること
を特徴とする局所はんだ付け装置。
[Scope of Claim for Utility Model Registration] (1) A solder jet nozzle exposed above the work table and an impeller for feeding molten solder to the solder jet nozzle, and the solder jet nozzle is disposed below the work table. A driven side magnet having different magnetic poles arranged in the circumferential direction is provided at the other end of the horizontal shaft extending from the impeller, and this driven side magnet has different magnetic poles arranged in the circumferential direction. The active side magnets are arranged in an array,
A local soldering device characterized in that a driven side magnet is rotationally driven by changing the magnetic pole position of the driving side magnet. (2) Utility Model Registration A local soldering device according to claim 1, characterized in that the position of the magnetic pole is changed by connecting the active side magnet to a rotational drive source.
JP9759286U 1986-06-27 1986-06-27 Pending JPS636163U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9759286U JPS636163U (en) 1986-06-27 1986-06-27

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9759286U JPS636163U (en) 1986-06-27 1986-06-27

Publications (1)

Publication Number Publication Date
JPS636163U true JPS636163U (en) 1988-01-16

Family

ID=30964694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9759286U Pending JPS636163U (en) 1986-06-27 1986-06-27

Country Status (1)

Country Link
JP (1) JPS636163U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008087068A (en) * 2006-10-05 2008-04-17 Denso Corp Jet soldering apparatus
JP2010120063A (en) * 2008-11-20 2010-06-03 Nippon Dennetsu Co Ltd Device for forming jet wave of soldering

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6112563B2 (en) * 1980-04-04 1986-04-09 Omron Tateisi Electronics Co

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6112563B2 (en) * 1980-04-04 1986-04-09 Omron Tateisi Electronics Co

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008087068A (en) * 2006-10-05 2008-04-17 Denso Corp Jet soldering apparatus
JP2010120063A (en) * 2008-11-20 2010-06-03 Nippon Dennetsu Co Ltd Device for forming jet wave of soldering

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