JPS6361176U - - Google Patents
Info
- Publication number
- JPS6361176U JPS6361176U JP15499386U JP15499386U JPS6361176U JP S6361176 U JPS6361176 U JP S6361176U JP 15499386 U JP15499386 U JP 15499386U JP 15499386 U JP15499386 U JP 15499386U JP S6361176 U JPS6361176 U JP S6361176U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- circuit board
- insulating substrate
- wiring pattern
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims 2
- 229920005989 resin Polymers 0.000 claims 2
- 238000010894 electron beam technology Methods 0.000 claims 1
- 239000002245 particle Substances 0.000 claims 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
- Parts Printed On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986154993U JPH0514542Y2 (sr) | 1986-10-09 | 1986-10-09 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1986154993U JPH0514542Y2 (sr) | 1986-10-09 | 1986-10-09 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6361176U true JPS6361176U (sr) | 1988-04-22 |
| JPH0514542Y2 JPH0514542Y2 (sr) | 1993-04-19 |
Family
ID=31075291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1986154993U Expired - Lifetime JPH0514542Y2 (sr) | 1986-10-09 | 1986-10-09 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0514542Y2 (sr) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009302581A (ja) * | 2009-09-28 | 2009-12-24 | Kyocera Corp | 多層配線基板 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50112764A (sr) * | 1974-02-18 | 1975-09-04 | ||
| JPS58164130U (ja) * | 1982-04-27 | 1983-11-01 | 帝国通信工業株式会社 | スイツチ回路板 |
| JPS59114889A (ja) * | 1982-12-21 | 1984-07-03 | 富士通株式会社 | 導電体パタ−ンの形成方法 |
-
1986
- 1986-10-09 JP JP1986154993U patent/JPH0514542Y2/ja not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS50112764A (sr) * | 1974-02-18 | 1975-09-04 | ||
| JPS58164130U (ja) * | 1982-04-27 | 1983-11-01 | 帝国通信工業株式会社 | スイツチ回路板 |
| JPS59114889A (ja) * | 1982-12-21 | 1984-07-03 | 富士通株式会社 | 導電体パタ−ンの形成方法 |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009302581A (ja) * | 2009-09-28 | 2009-12-24 | Kyocera Corp | 多層配線基板 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0514542Y2 (sr) | 1993-04-19 |