JPS6361145U - - Google Patents
Info
- Publication number
- JPS6361145U JPS6361145U JP15646286U JP15646286U JPS6361145U JP S6361145 U JPS6361145 U JP S6361145U JP 15646286 U JP15646286 U JP 15646286U JP 15646286 U JP15646286 U JP 15646286U JP S6361145 U JPS6361145 U JP S6361145U
- Authority
- JP
- Japan
- Prior art keywords
- storage box
- semiconductor wafer
- opposing
- wafer storage
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000005192 partition Methods 0.000 claims description 2
Landscapes
- Packaging Frangible Articles (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15646286U JPS6361145U (pl) | 1986-10-13 | 1986-10-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15646286U JPS6361145U (pl) | 1986-10-13 | 1986-10-13 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6361145U true JPS6361145U (pl) | 1988-04-22 |
Family
ID=31078101
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15646286U Pending JPS6361145U (pl) | 1986-10-13 | 1986-10-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6361145U (pl) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07326657A (ja) * | 1994-05-31 | 1995-12-12 | Korea Electron Telecommun | 半導体の製造装備のウエハ装着のカセット |
| JP2012109622A (ja) * | 2006-10-25 | 2012-06-07 | Siltronic Ag | 少なくとも２つの円筒状工作物を多数のウェハに同時に切断するための方法 |
-
1986
- 1986-10-13 JP JP15646286U patent/JPS6361145U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07326657A (ja) * | 1994-05-31 | 1995-12-12 | Korea Electron Telecommun | 半導体の製造装備のウエハ装着のカセット |
| JP2012109622A (ja) * | 2006-10-25 | 2012-06-07 | Siltronic Ag | 少なくとも２つの円筒状工作物を多数のウェハに同時に切断するための方法 |