JPS6361145U - - Google Patents
Info
- Publication number
- JPS6361145U JPS6361145U JP15646286U JP15646286U JPS6361145U JP S6361145 U JPS6361145 U JP S6361145U JP 15646286 U JP15646286 U JP 15646286U JP 15646286 U JP15646286 U JP 15646286U JP S6361145 U JPS6361145 U JP S6361145U
- Authority
- JP
- Japan
- Prior art keywords
- storage box
- semiconductor wafer
- opposing
- wafer storage
- groove
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 238000005192 partition Methods 0.000 claims description 2
Landscapes
- Packaging Frangible Articles (AREA)
Description
第1図は本考案の半導体ウエハ収納ボツクスの
一実施例の斜視図、第2図は同じく他の実施例を
示す上面図、第3図は従来例を示す斜視図である
。
1:箱状容器、2,2′:溝、3:仕切板、4
:溝、5,5′:凹部、6:ネジ、8:ナツト。
FIG. 1 is a perspective view of one embodiment of the semiconductor wafer storage box of the present invention, FIG. 2 is a top view of another embodiment, and FIG. 3 is a perspective view of a conventional example. 1: Box-shaped container, 2, 2': Groove, 3: Partition plate, 4
: groove, 5, 5': recess, 6: screw, 8: nut.
Claims (1)
る溝の間にその両端をそれぞれ保持した状態で収
納される半導体ウエハ収納ボツクスにおいて、前
記対向する溝の一方が前記収納ボツクス内を前記
他の対向する溝の設けられている辺と平行し移動
可能に設けられた可動仕切板に設けられているこ
とを特徴とする半導体ウエハ収納ボツクス。 In a semiconductor wafer storage box that is stored with its both ends held between opposing grooves provided on two opposing sides, one of the opposing grooves extends inside the storage box toward the other opposing groove. A semiconductor wafer storage box characterized in that the semiconductor wafer storage box is provided on a movable partition plate that is movably provided parallel to the side on which the groove is provided.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15646286U JPS6361145U (en) | 1986-10-13 | 1986-10-13 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15646286U JPS6361145U (en) | 1986-10-13 | 1986-10-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS6361145U true JPS6361145U (en) | 1988-04-22 |
Family
ID=31078101
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15646286U Pending JPS6361145U (en) | 1986-10-13 | 1986-10-13 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6361145U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07326657A (en) * | 1994-05-31 | 1995-12-12 | Korea Electron Telecommun | Cassette of wafer installation of manufacturing equipment ofsemiconductor |
JP2012109622A (en) * | 2006-10-25 | 2012-06-07 | Siltronic Ag | Method for simultaneously slicing at least two cylindrical workpieces into many wafers |
-
1986
- 1986-10-13 JP JP15646286U patent/JPS6361145U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07326657A (en) * | 1994-05-31 | 1995-12-12 | Korea Electron Telecommun | Cassette of wafer installation of manufacturing equipment ofsemiconductor |
JP2012109622A (en) * | 2006-10-25 | 2012-06-07 | Siltronic Ag | Method for simultaneously slicing at least two cylindrical workpieces into many wafers |
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