JPS6361128U - - Google Patents

Info

Publication number
JPS6361128U
JPS6361128U JP15452786U JP15452786U JPS6361128U JP S6361128 U JPS6361128 U JP S6361128U JP 15452786 U JP15452786 U JP 15452786U JP 15452786 U JP15452786 U JP 15452786U JP S6361128 U JPS6361128 U JP S6361128U
Authority
JP
Japan
Prior art keywords
mold part
resin
fixed
pressurizing
view
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15452786U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0719147Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986154527U priority Critical patent/JPH0719147Y2/ja
Publication of JPS6361128U publication Critical patent/JPS6361128U/ja
Application granted granted Critical
Publication of JPH0719147Y2 publication Critical patent/JPH0719147Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP1986154527U 1986-10-08 1986-10-08 半導体素子の樹脂封止装置 Expired - Lifetime JPH0719147Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986154527U JPH0719147Y2 (ja) 1986-10-08 1986-10-08 半導体素子の樹脂封止装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986154527U JPH0719147Y2 (ja) 1986-10-08 1986-10-08 半導体素子の樹脂封止装置

Publications (2)

Publication Number Publication Date
JPS6361128U true JPS6361128U (enrdf_load_stackoverflow) 1988-04-22
JPH0719147Y2 JPH0719147Y2 (ja) 1995-05-01

Family

ID=31074397

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986154527U Expired - Lifetime JPH0719147Y2 (ja) 1986-10-08 1986-10-08 半導体素子の樹脂封止装置

Country Status (1)

Country Link
JP (1) JPH0719147Y2 (enrdf_load_stackoverflow)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6233317U (enrdf_load_stackoverflow) * 1985-08-17 1987-02-27
JPH0376782A (ja) * 1989-07-31 1991-04-02 Rodel Inc 金属表面を研磨する方法およびそのための組成物

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6233317U (enrdf_load_stackoverflow) * 1985-08-17 1987-02-27
JPH0376782A (ja) * 1989-07-31 1991-04-02 Rodel Inc 金属表面を研磨する方法およびそのための組成物

Also Published As

Publication number Publication date
JPH0719147Y2 (ja) 1995-05-01

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