JPS6361029A - Polyimide film and production thereof - Google Patents
Polyimide film and production thereofInfo
- Publication number
- JPS6361029A JPS6361029A JP61205576A JP20557686A JPS6361029A JP S6361029 A JPS6361029 A JP S6361029A JP 61205576 A JP61205576 A JP 61205576A JP 20557686 A JP20557686 A JP 20557686A JP S6361029 A JPS6361029 A JP S6361029A
- Authority
- JP
- Japan
- Prior art keywords
- film
- polyimide film
- present
- amount
- polyimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920001721 polyimide Polymers 0.000 title claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 title description 7
- 239000000126 substance Substances 0.000 abstract description 7
- 238000000034 method Methods 0.000 description 29
- 239000000853 adhesive Substances 0.000 description 23
- 230000001070 adhesive effect Effects 0.000 description 23
- 238000010438 heat treatment Methods 0.000 description 12
- 238000011282 treatment Methods 0.000 description 9
- 238000012805 post-processing Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 235000013405 beer Nutrition 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 239000003513 alkali Substances 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 238000010292 electrical insulation Methods 0.000 description 3
- 238000005488 sandblasting Methods 0.000 description 3
- 229920001646 UPILEX Polymers 0.000 description 2
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 238000011160 research Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000002585 base Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000003851 corona treatment Methods 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 230000009849 deactivation Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- ANSXAPJVJOKRDJ-UHFFFAOYSA-N furo[3,4-f][2]benzofuran-1,3,5,7-tetrone Chemical compound C1=C2C(=O)OC(=O)C2=CC2=C1C(=O)OC2=O ANSXAPJVJOKRDJ-UHFFFAOYSA-N 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920006254 polymer film Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000000807 solvent casting Methods 0.000 description 1
Landscapes
- Moulding By Coating Moulds (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
Description
【発明の詳細な説明】
「産業上の利用分野」
本発明は耐熱性ポリイミドフィルム及びその製造方法に
関し、更に詳しくはフィルム中の残揮発物量を従来のポ
リイミドフィルムに比して大きく減する事によって接着
性を改善したポリイミドフィルムとその製造方法に関す
るものである。Detailed Description of the Invention "Field of Industrial Application" The present invention relates to a heat-resistant polyimide film and a method for producing the same, and more specifically, the present invention relates to a heat-resistant polyimide film and a method for producing the same, and more specifically, by greatly reducing the amount of residual volatile matter in the film compared to conventional polyimide films. The present invention relates to a polyimide film with improved adhesiveness and a method for producing the same.
「従来技術と問題点」
ポリイミドフィルムは耐熱性、耐寒性、耐薬品性、電気
絶縁性、機械的強度等の優れた緒特性を有する事が知ら
れており、電気絶縁フィルム、断熱フィルム、フレキシ
ブルプリント配線板のベースフィルム等に広く利用され
ている。ポリイミドフィルムの主要途であるフレキシブ
ルプリント配線板や電気絶縁フィルム等の用途では、接
着材を介し銅箔と接着されたり、接着剤コーティングに
よりプリプレグ化する、フッ素樹脂との複合化をする等
のケースが多く、従ってフィルムの接着能力が重要な特
性となっている。"Prior Art and Problems" Polyimide films are known to have excellent properties such as heat resistance, cold resistance, chemical resistance, electrical insulation, and mechanical strength, and are used as electrical insulation films, heat insulation films, and flexible films. Widely used as base film for printed wiring boards. In the main applications of polyimide films, such as flexible printed wiring boards and electrical insulation films, they are bonded to copper foil through adhesives, made into prepregs by coating with adhesives, and composited with fluororesin. Therefore, the adhesive ability of the film has become an important characteristic.
従来の高分子フィルムにおける接着付与技術では火炎処
理、コロナ処理、紫外線処理、アルカリ処理、プライマ
ー処理、サンドブラスト処理等が行われている。ポリイ
ミドフィルムもこのような一船的技術の中で耐熱性フィ
ルムの目的を満足しうる方法を利用しており、サンドブ
ラスト処理やアルカリ処理等が行われているのが現状で
ある。Conventional adhesion techniques for polymer films include flame treatment, corona treatment, ultraviolet treatment, alkali treatment, primer treatment, sandblasting, and the like. Polyimide films also utilize methods that can satisfy the purpose of heat-resistant films among such single-purpose technologies, and are currently subjected to sandblasting treatment, alkali treatment, etc.
しかし乍ら、これらの方法はいずれも製品化されたフィ
ルムに更に後処理を施す事により接着能力を向上させよ
うとするものである。従って、これらの方法はフィルム
形成工程で既に接着能力の優れたものを作り出す方法で
はないため、後処理前の製品フィルムの接着能力の変動
や後処理法の安定性、均質性等の点で問題が生じる場合
があり、接着能力を改善したフィルムを安定的に供給す
る事は基本的に困難である。又、実用面からは新たな工
程を要し、コストの上昇を招く事は避けられない。これ
らはフッ素樹脂との複合フィルムにおいても同様であり
、従来の技術では高いビール強度を安定的に実現する事
は困難であった。However, all of these methods attempt to improve the adhesive ability by subjecting the manufactured film to further post-treatment. Therefore, these methods do not create a film with excellent adhesive ability already in the film forming process, and there are problems in terms of fluctuations in the adhesive ability of the product film before post-processing and stability and homogeneity of the post-processing method. This may occur, and it is basically difficult to stably supply a film with improved adhesive ability. Furthermore, from a practical standpoint, a new process is required, which inevitably leads to an increase in cost. The same applies to composite films with fluororesin, and it has been difficult to stably achieve high beer strength using conventional techniques.
「問題点を解決するための手段」
本発明者らはかかる実情に鑑み、これらの技術課題を解
決すべく鋭意研究を重ねた結果、フィルム中の残揮発物
量を従来のポリイミドフィルムに比して減する事によっ
て高い接′ＩＩ能力を持つフィルムを提供できる事を見
出し、本発明を完成させた。"Means for Solving the Problems" In view of the above circumstances, the inventors of the present invention have conducted intensive research to solve these technical problems, and have found that the amount of residual volatile matter in the film is lower than that of conventional polyimide films. The present inventors discovered that it is possible to provide a film with high adhesion ability by reducing the amount of bonding, and completed the present invention.
即ち、本発明の第１はフィルム中の残揮発物量がフィル
ム１００重量部当たり０．４５重量％以下であることを
特徴とするポリイミドフィルムを、本発明の第２はポリ
イミドフィルムに加熱処理を施し、該フィルム中の残揮
発物量をフィルム１０ｏｍｉ部当たり０．４５重量％以
下としたことを特徴とするポリイミドフィルムの製造方
法をそれぞれ内容とするものである。That is, the first aspect of the present invention is a polyimide film characterized in that the amount of residual volatile matter in the film is 0.45% by weight or less per 100 parts by weight of the film, and the second aspect of the present invention is a polyimide film characterized by subjecting the polyimide film to heat treatment. , a method for producing a polyimide film characterized in that the amount of residual volatile matter in the film is 0.45% by weight or less per 10 omi parts of the film.
本発明者らは、従来のポリイミドフィルムがソルベント
キャスト法で製造される事から、フィルム表面に機械的
に脆弱な層が形成さり、これが接着性を阻害するものと
考えて各種の改善法を検討してきた。現在実施されてい
るサンドブラスト処理やアルカリ処理は、いずれもこれ
らの脆弱層の除去によるものであると解釈できる。しか
し乍ら、このような表面層に着目するのみならず、フィ
ルム全体の改質についても鋭意研究を続けた結果、フィ
ルム全体が示す残揮発物量が接着能力を左右する事を見
出したものである０通常、接着能力を評価する為には各
種の溶剤系接着剤が使用され、フィルムに塗工され乾燥
を経て加熱ラミネートされる。この時用いられる溶剤は
各種のものが使用される事から、使用されるフィルム中
の４１発物量が接着能力を左右するという事は驚くべき
知見と言える。即ち、表面層を必ずしも除去しない方法
で、且つ、接着剤系の発揮物量ではな（、フィルム中に
存在する発揮物量をコントロールする方法により接着能
力を向上させ得る事を見出したのである。The present inventors considered that because conventional polyimide films are manufactured using a solvent casting method, a mechanically fragile layer is formed on the film surface, which impairs adhesion, and considered various improvement methods. I've been doing it. The sandblasting and alkali treatments that are currently being carried out can be interpreted as removing these fragile layers. However, as a result of not only focusing on the surface layer, but also conducting intensive research on modifying the entire film, we discovered that the amount of residual volatile matter exhibited by the entire film affects its adhesive ability. 0 Usually, in order to evaluate adhesive ability, various solvent-based adhesives are used, which are coated onto a film, dried, and then heated and laminated. Since various kinds of solvents are used at this time, it is a surprising finding that the amount of 41 particles in the film used influences the adhesion ability. That is, they have discovered that the adhesive ability can be improved by a method that does not necessarily remove the surface layer, and by controlling the amount of adhesive present in the film rather than the amount of adhesive.
本発明において、フィルム中の残揮発物量とは水分を除
く発揮物量であり、下記の式により定義されるものであ
る。In the present invention, the amount of volatile matter remaining in the film is the amount of volatile matter excluding moisture, and is defined by the following formula.
Ｗｏ ７ １５０℃ｘｉｏ分乾燥後の重量Ｗ ：
４５０℃Ｘ２０分加熱処理後の重量本発明のポリイミ
ドフィルムは残揮発物量がフィルム１００重量部当たり
０．４５重量％以下である。これを上回ると接着能力の
十分なフィルムを得ることが困難である。好ましくは当
該量が０．１５〜０．４重量％の範囲である。０．１５
重量％未満では機械的特性等の低下が派生して好ましく
ない場合がある。Wo 7 Weight W after drying at 150°C for xio minutes:
Weight after heat treatment at 450° C. for 20 minutes The polyimide film of the present invention has a residual volatile matter amount of 0.45% by weight or less per 100 parts by weight of the film. If it exceeds this value, it is difficult to obtain a film with sufficient adhesion ability. Preferably, the amount is in the range of 0.15 to 0.4% by weight. 0.15
If it is less than % by weight, mechanical properties etc. may deteriorate, which may be undesirable.
本発明のポリイミドフィルムは公知の各種原料から得ら
れるものであり、特別な制限は何ら存在しない、しかし
乍ら緒特性のバランス面より、ポリ−（Ｎ、Ｎ’−Ｐ、
Ｐ’オキシジフェニレン）−ピロメリット〕−イミドか
らなるポリイミドフィルムが好ましい、又、ポリイミド
フィルムの製法はイミド化剤を用いた方法（ケミカルキ
ュア法）であるか、加熱によるだけの方法（ドライアッ
プ法）であるかにはこだわらないが、ケミカルキュア法
による方が、その効果がより顕著であることから好まし
い。The polyimide film of the present invention is obtained from various known raw materials, and there are no special restrictions.
A polyimide film made of P'oxydiphenylene)-pyromellit]-imide is preferable, and the polyimide film can be produced using a method using an imidizing agent (chemical cure method) or a method using only heating (dry-up method). Although it does not matter which method is used, it is preferable to use a chemical curing method because the effect is more pronounced.
本発明のポリイミドフィルムの厚みは特に限定されるも
のではないが、好ましくは１０−１２５μｍ、更に好ま
しくは５０〜１２５μｍである。Although the thickness of the polyimide film of the present invention is not particularly limited, it is preferably 10-125 μm, more preferably 50-125 μm.
本発明の効果は５０．ｃａｍ以上のフィルムに於いて特
に顕著となる。即ち、従来のポリイミドフィルムでは、
接着能力向上の為には多大な後処理を要するとか、両面
ともに向上させる事が困難である等の弱点が存在してい
たが、本発明の方法によれば容易に両面共同上させるこ
とが可能である。The effect of the present invention is 50. This is particularly noticeable in films of cam or higher. That is, in conventional polyimide film,
In order to improve the adhesion ability, there were weaknesses such as requiring a large amount of post-processing and it being difficult to improve both sides, but according to the method of the present invention, it is possible to easily improve both sides. It is.
本発明の残揮発物量を０．４５重量％以下とする具体的
方法としては、例えば加熱処理を施こす方法を挙げるこ
とができる。A specific method for reducing the amount of residual volatile matter to 0.45% by weight or less in the present invention includes, for example, a method of applying heat treatment.
即ち、３００℃以上の高温下で必要十分なる加熱処理を
施すのであるが、この時の時間と温度は本発明の目的を
達する範囲内で容易に設定する事ができる。一つの目安
としては、第１図に示した斜線部の範囲が効果的である
。That is, necessary and sufficient heat treatment is performed at a high temperature of 300° C. or higher, and the time and temperature at this time can be easily set within a range that achieves the purpose of the present invention. As a guideline, the shaded area shown in FIG. 1 is effective.
本発明の加熱処理は生産工程における最高温度のもとで
の条件の目安であるが、必ずしも生産工程の中で行う場
合に限られず、別工程を設けて実施する事も可能である
。Although the heat treatment of the present invention is based on the conditions under the highest temperature in the production process, it is not necessarily limited to the case where it is carried out in the production process, and it is also possible to provide a separate process and carry out the heat treatment.
本発明の方法はフィルム中残揮発物量をコントロールし
て接着能力を向上させるものであるが、必ずしもこの方
法単独で実施する場合に限られず、必要に応じて、他の
公知の後処理法を更に適用することも可能である。Although the method of the present invention improves adhesive ability by controlling the amount of volatile matter remaining in the film, it is not necessarily limited to the case where this method is carried out alone, and if necessary, other known post-treatment methods may be further applied. It is also possible to apply
「作用・効果」
ポリイミドフィルムの接着能力について、フィルム中の
残揮発物量との関係を論じた報告は過去において見当た
らない０本発明者らはフィルム中の残揮発物量をコント
ロールする事により、ポリイミドフィルムの接着能力を
向上させる事が出来ることを初めて見出したものである
。そのメカニズムは必ずしも明らかではないが、フィル
ム中の残揮発物量を０．４５重量％以下とする工程中に
おいて、接着能力を阻害する揮発物が除去された効果に
よるものと推定される。"Action/Effect" Regarding the adhesion ability of polyimide film, there have been no reports in the past that discussed the relationship between the amount of residual volatile matter in the film. This is the first time that we have discovered that it is possible to improve the adhesion ability of Although the mechanism is not necessarily clear, it is presumed that it is due to the effect of removing volatile substances that inhibit adhesive ability during the process of reducing the amount of volatile substances remaining in the film to 0.45% by weight or less.
本発明を利用すれば、従来用難視されていた接着能力の
直接的付与が可能である。又、従来、両面共に接着能力
に優れたポリイミドフィルムは提供されていないが、本
発明によれば容易に両面共接着能力を向上させる事が可
能である。更に、後処理法ではないため、別工程が不要
で設備コスト面で有利であるばかりでなく、後処理法に
ありがちな接着能力のバラツキ、接着能力の失活等の不
安定性も克服できる極めて有利且つ安価な方法である。By utilizing the present invention, it is possible to directly provide adhesive ability, which has been difficult to achieve in the past. In addition, conventionally, a polyimide film with excellent adhesion ability on both sides has not been provided, but according to the present invention, it is possible to easily improve the adhesion ability on both sides. Furthermore, since it is not a post-processing method, it is not only advantageous in terms of equipment costs as it does not require a separate process, but it is also extremely advantageous in that it can overcome the instability such as variations in adhesive ability and deactivation of adhesive ability that tend to occur with post-processing methods. Moreover, it is an inexpensive method.
又、本発明によればフン素樹脂との複合フィルムのビー
ル強度も安定的に高い値を実現する事が可能である。Further, according to the present invention, it is possible to stably achieve a high beer strength of a composite film with a fluorine resin.
「実施例」
以下実施例により本発明を具体的に説明するが、本発明
はこれらにより何ら制約を受けるものではない。"Examples" The present invention will be specifically described below with reference to Examples, but the present invention is not limited in any way by these.
実施例１〜４
とロメリフト酸二無水物と４．４′−ジアミノジフェニ
ルエーテルからなる５０μｍ厚みのポリイミドフィルム
を作製した。Examples 1 to 4 A 50 μm thick polyimide film consisting of Lomelift acid dianhydride and 4,4'-diaminodiphenyl ether was produced.
このフィルムを用いて更に加熱処理を施し、フィルム中
の残揮発物量の異なるフィルムを作製しそれらの接着強
度等を測定した。結果を第１表に示す。This film was further subjected to heat treatment to produce films with different amounts of residual volatile matter, and their adhesive strength etc. were measured. The results are shown in Table 1.
比較例１
加熱処理を施さない他は、実施例１〜４と同様にして５
０μｍ厚みのポリイミドフィルムを作製し、接着強度等
を調べた。結果を第１表に示した。Comparative Example 1 5 was prepared in the same manner as Examples 1 to 4 except that no heat treatment was performed.
A polyimide film with a thickness of 0 μm was produced and its adhesive strength etc. were examined. The results are shown in Table 1.
実施例５．６
実施例１〜４と同様の方法にて、７５μｍ及び１２５μ
ｍ厚みのポリイミドフィルムをそれぞれ作製した。この
フィルムを用いて４５０℃で１分間加熱処理を行い、そ
の接着強度等を測定した。Example 5.6 By the same method as Examples 1 to 4, 75 μm and 125 μm
Polyimide films each having a thickness of m were produced. This film was heat treated at 450° C. for 1 minute, and its adhesive strength etc. were measured.
結果を第１表に示す。The results are shown in Table 1.
比較例２．３
加熱処理を施さない他は、実施例５．６と同様に７５μ
ｍ及び１２５μｍ厚みのポリイミドフィルムを作製し、
接着強度等を測定した。結果を第１表に示す。Comparative Example 2.3 Same as Example 5.6 except that the heat treatment was not performed.
A polyimide film with a thickness of m and 125 μm was prepared,
Adhesive strength etc. were measured. The results are shown in Table 1.
第 １ 表
９０℃はくり、５０ ｌ１ｍ／ｓｉｎ
テストスピード： ２００ ｍｍ／ｍ１ｎＸ／６ ：
６本のうちＸ本がＣ／Ａ破壊実施例７〜９
実施例１〜４と同様の方法で第２表で示す各種のポリイ
ミドフィルムを５０μｍ厚みにて作製し、残揮発物量と
接着強度を調べた結果を第２表に示す。Table 1 Peeling at 90°C, 50 l1m/sin Test speed: 200 mm/m1nX/6:
X films out of 6 were C/A fracture Examples 7 to 9 Various polyimide films shown in Table 2 were produced to a thickness of 50 μm using the same method as Examples 1 to 4, and the amount of residual volatile matter and adhesive strength were determined. The results of the investigation are shown in Table 2.
第 ２ 表
ＰＭＤＡ：ピロメリット酸二無水物
ＢＰＤ、６１：３．３’、４．４’−ビフェニルテトラ
カルボン酸二無水物ＰＰＤ：パラフェニレンジアミン
ＯＤＡ：４．４’−ジアミノジフェニルエーテル実施例
１０
実施例３の５０μｍポリイミドフィルムの片面に、表面
処理した厚さ１２．５μｍのＦＥＰフィルムを熱ラミネ
ートしたフッ素樹脂との複合フィルムを作製し、ＦＥＰ
同志が重なるようにヒートシールし、テストスピード３
００１ｎ／ｗｉｎのもとでＴは（リテストを行い、ビー
ル強度を求めた結果、３００ｇ１０．５インチ中と優れ
た値が得られた。Table 2 PMDA: Pyromellitic dianhydride BPD, 61: 3.3', 4.4'-biphenyltetracarboxylic dianhydride PPD: paraphenylenediamine ODA: 4.4'-diaminodiphenyl ether Example 10 Implementation A composite film with a fluororesin was prepared by thermally laminating a surface-treated 12.5 μm thick FEP film on one side of the 50 μm polyimide film of Example 3.
Heat seal so that the comrades overlap, test speed 3
Under 001n/win, T was retested and the beer strength was determined, and an excellent value of 300g and 10.5 inches was obtained.
比較例４
比較例１のポリイミドフィルムを使用し、実施例１Ｏと
同様にしてビール強度を求めた結果は１５０ｇ１０．５
インチ中であった。Comparative Example 4 Using the polyimide film of Comparative Example 1, the beer strength was determined in the same manner as in Example 1O, and the result was 150g10.5
It was inside an inch.
第１図は加熱処理温度と加熱処理時間との関係を示すグ
ラフである。FIG. 1 is a graph showing the relationship between heat treatment temperature and heat treatment time.
Claims (1)
たり０．４５重量％以下であることを特徴とするポリイ
ミドフィルム。 ２、ポリイミドフィルムに加熱処理を施し、該フィルム
中の残揮発物量をフィルム１００重量部当たり０．４５
重量％以下としたことを特徴とするポリイミドフィルム
の製造方法。[Scope of Claims] 1. A polyimide film characterized in that the amount of residual volatile matter in the film is 0.45% by weight or less per 100 parts by weight of the film. 2. Heat-treating the polyimide film to reduce the amount of residual volatile matter in the film to 0.45 parts by weight per 100 parts by weight of the film.
% or less by weight.
Priority Applications (7)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61205576A JPS6361029A (en) | 1986-09-01 | 1986-09-01 | Polyimide film and production thereof |
| AU77226/87A AU604254B2 (en) | 1986-09-01 | 1987-08-19 | Polyimide film and its manufacturing method |
| US07/088,326 US4808468A (en) | 1986-09-01 | 1987-08-21 | Polyimide film and its manufacturing method |
| CA 545287 CA1322624C (en) | 1986-09-01 | 1987-08-25 | Polyimide film and its manufacturing method |
| EP19870112650 EP0258859B1 (en) | 1986-09-01 | 1987-08-31 | Polyimide film and its manufacturing method |
| DE3751866T DE3751866T2 (en) | 1986-09-01 | 1987-08-31 | Polyimide film and process for its manufacture |
| KR1019870009572A KR940008996B1 (en) | 1986-09-01 | 1987-08-31 | Polyimide film and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61205576A JPS6361029A (en) | 1986-09-01 | 1986-09-01 | Polyimide film and production thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6361029A true JPS6361029A (en) | 1988-03-17 |
| JPH0588850B2 JPH0588850B2 (en) | 1993-12-24 |
Family
ID=16509173
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61205576A Granted JPS6361029A (en) | 1986-09-01 | 1986-09-01 | Polyimide film and production thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6361029A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02228978A (en) * | 1989-03-01 | 1990-09-11 | Sumitomo Rubber Ind Ltd | Large sized three-piece solid golf ball |
| US5072944A (en) * | 1989-04-04 | 1991-12-17 | Sumitomo Rubber Industries, Ltd. | Three-piece solid golf ball |
| JPH0623069A (en) * | 1990-06-01 | 1994-02-01 | Ilya Co Ltd | Solid three-piece golf ball |
| JPH0724085A (en) * | 1993-07-08 | 1995-01-27 | Bridgestone Sports Co Ltd | Three-piece solid golf ball |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5729425A (en) * | 1980-07-31 | 1982-02-17 | Nippon Carbide Ind Co Ltd | Manufacture of polyimide film or polyamide-imide film |
| JPS6063226A (en) * | 1983-09-16 | 1985-04-11 | Ube Ind Ltd | Manufacture of polyimide molded product |
-
1986
- 1986-09-01 JP JP61205576A patent/JPS6361029A/en active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5729425A (en) * | 1980-07-31 | 1982-02-17 | Nippon Carbide Ind Co Ltd | Manufacture of polyimide film or polyamide-imide film |
| JPS6063226A (en) * | 1983-09-16 | 1985-04-11 | Ube Ind Ltd | Manufacture of polyimide molded product |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02228978A (en) * | 1989-03-01 | 1990-09-11 | Sumitomo Rubber Ind Ltd | Large sized three-piece solid golf ball |
| US5002281A (en) * | 1989-03-01 | 1991-03-26 | Sumitomo Rubber Industries, Ltd. | Three-piece solid golf ball |
| US5072944A (en) * | 1989-04-04 | 1991-12-17 | Sumitomo Rubber Industries, Ltd. | Three-piece solid golf ball |
| JPH0623069A (en) * | 1990-06-01 | 1994-02-01 | Ilya Co Ltd | Solid three-piece golf ball |
| JPH0724085A (en) * | 1993-07-08 | 1995-01-27 | Bridgestone Sports Co Ltd | Three-piece solid golf ball |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0588850B2 (en) | 1993-12-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5880658B2 (en) | Polyimide film, and these polyimide laminates and polyimide metal laminates | |
| JP4540964B2 (en) | Low temperature polyimide adhesive composition | |
| US7285321B2 (en) | Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto | |
| JP2907598B2 (en) | Flexible multilayer polyimide film laminates and methods for their manufacture | |
| US5741598A (en) | Polyimide/metal composite sheet | |
| JP3786157B2 (en) | Polyimide film with improved adhesion, process for producing the same, and laminate | |
| JP3952196B2 (en) | Method for producing flexible metal foil polyimide laminate | |
| JPS6361029A (en) | Polyimide film and production thereof | |
| JP2005015596A (en) | Polyimide-based precursor resin solution composition sheet | |
| JP3355986B2 (en) | Aromatic polyimide film and laminate | |
| US4808468A (en) | Polyimide film and its manufacturing method | |
| JPH0588851B2 (en) | ||
| JPS6399282A (en) | Bonding of polyimide formed article | |
| JPH0367534B2 (en) | ||
| JP4258895B2 (en) | Adhesive tape | |
| JP3008471B2 (en) | Heat resistant laminate and method for producing the same | |
| JP3295952B2 (en) | Method for manufacturing flexible wiring board | |
| JP3039854B2 (en) | Heat resistant resin adhesive sheet and substrate | |
| JPH0712650B2 (en) | Manufacturing method of flexible copper clad circuit board | |
| JP4151008B2 (en) | POLYIMIDE FILM LAMINATE, ITS MANUFACTURING METHOD, AND FLEXIBLE CIRCUIT BOARD | |
| US11021606B2 (en) | Multilayer film for electronic circuitry applications | |
| JPH11345843A (en) | Copper plated substrate and bonding agent sheet for tab | |
| JPH1058628A (en) | Polyimide molding, its manufacturing and use application | |
| JPS63288744A (en) | Preparation of metal plate-based laminated plate for printed circuit | |
| JPS6399281A (en) | Bonding of polyimide film |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| S533 | Written request for registration of change of name |
Free format text: JAPANESE INTERMEDIATE CODE: R313533 |
|
| R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| EXPY | Cancellation because of completion of term |