JPS6359326U - - Google Patents

Info

Publication number
JPS6359326U
JPS6359326U JP1986154185U JP15418586U JPS6359326U JP S6359326 U JPS6359326 U JP S6359326U JP 1986154185 U JP1986154185 U JP 1986154185U JP 15418586 U JP15418586 U JP 15418586U JP S6359326 U JPS6359326 U JP S6359326U
Authority
JP
Japan
Prior art keywords
chip
semiconductor
metal bumps
wiring board
bumps
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1986154185U
Other languages
English (en)
Japanese (ja)
Other versions
JPH0436115Y2 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1986154185U priority Critical patent/JPH0436115Y2/ja
Publication of JPS6359326U publication Critical patent/JPS6359326U/ja
Application granted granted Critical
Publication of JPH0436115Y2 publication Critical patent/JPH0436115Y2/ja
Expired legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10WGENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00Package configurations
    • H10W90/701Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Wire Bonding (AREA)
JP1986154185U 1986-10-07 1986-10-07 Expired JPH0436115Y2 (https=)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1986154185U JPH0436115Y2 (https=) 1986-10-07 1986-10-07

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986154185U JPH0436115Y2 (https=) 1986-10-07 1986-10-07

Publications (2)

Publication Number Publication Date
JPS6359326U true JPS6359326U (https=) 1988-04-20
JPH0436115Y2 JPH0436115Y2 (https=) 1992-08-26

Family

ID=31073750

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1986154185U Expired JPH0436115Y2 (https=) 1986-10-07 1986-10-07

Country Status (1)

Country Link
JP (1) JPH0436115Y2 (https=)

Also Published As

Publication number Publication date
JPH0436115Y2 (https=) 1992-08-26

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