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Priority to JP1986154185UpriorityCriticalpatent/JPH0436115Y2/ja
Publication of JPS6359326UpublicationCriticalpatent/JPS6359326U/ja
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Publication of JPH0436115Y2publicationCriticalpatent/JPH0436115Y2/ja
H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
H10W90/00—Package configurations
H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL