JPS635891A - Laser trimming device - Google Patents

Laser trimming device

Info

Publication number
JPS635891A
JPS635891A JP61147612A JP14761286A JPS635891A JP S635891 A JPS635891 A JP S635891A JP 61147612 A JP61147612 A JP 61147612A JP 14761286 A JP14761286 A JP 14761286A JP S635891 A JPS635891 A JP S635891A
Authority
JP
Japan
Prior art keywords
unit
scan
laser
target fuse
worked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61147612A
Inventor
Naoto Sakagami
Original Assignee
Nec Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nec Corp filed Critical Nec Corp
Priority to JP61147612A priority Critical patent/JPS635891A/en
Publication of JPS635891A publication Critical patent/JPS635891A/en
Application status is Pending legal-status Critical

Links

Abstract

PURPOSE:To improve the processing capacity by providing a scan unit for moving a laser light onto a memory IC to be worked, and also, providing a trigger generating unit for blowing a target fuse. CONSTITUTION:A scan unit 1 for loading a wafer stage 2 and a memory IC wafer 3 to be worked is provided, and also, the unit 1 is controlled by a scan unit controller 5 so that a laser optical system 4 passes through successively on plural target fuse coordinates of the IC wafer 3. When an output 13 of a position detector 6 of the unit 1 has coincided with a latching circuit output 12 of a trigger generating unit 8, a trigger signal 15 is inputted to a laser controller 14, and a target fuse is blown by generating a laser pulse from an oscillator 16. A scan is executed without stopping the unit 1, therefore, acceleration and deceleration become unnecessary, and the processing capacity is improved.
JP61147612A 1986-06-24 1986-06-24 Laser trimming device Pending JPS635891A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61147612A JPS635891A (en) 1986-06-24 1986-06-24 Laser trimming device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61147612A JPS635891A (en) 1986-06-24 1986-06-24 Laser trimming device

Publications (1)

Publication Number Publication Date
JPS635891A true JPS635891A (en) 1988-01-11

Family

ID=15434260

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61147612A Pending JPS635891A (en) 1986-06-24 1986-06-24 Laser trimming device

Country Status (1)

Country Link
JP (1) JPS635891A (en)

Cited By (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7192846B2 (en) 2001-03-29 2007-03-20 Gsi Group Corporation Methods and systems for processing a device, methods and systems for modeling same and the device
US7289549B2 (en) 2004-12-09 2007-10-30 Electro Scientific Industries, Inc. Lasers for synchronized pulse shape tailoring
US7396706B2 (en) 2004-12-09 2008-07-08 Electro Scientific Industries, Inc. Synchronization technique for forming a substantially stable laser output pulse profile having different wavelength peaks
US7425471B2 (en) 2004-06-18 2008-09-16 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset
US7435927B2 (en) 2004-06-18 2008-10-14 Electron Scientific Industries, Inc. Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset
US7629234B2 (en) 2004-06-18 2009-12-08 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling
US7633034B2 (en) 2004-06-18 2009-12-15 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure
US7687740B2 (en) 2004-06-18 2010-03-30 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows
US7935941B2 (en) 2004-06-18 2011-05-03 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures
US8148211B2 (en) 2004-06-18 2012-04-03 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously
US8383982B2 (en) 2004-06-18 2013-02-26 Electro Scientific Industries, Inc. Methods and systems for semiconductor structure processing using multiple laser beam spots

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7192846B2 (en) 2001-03-29 2007-03-20 Gsi Group Corporation Methods and systems for processing a device, methods and systems for modeling same and the device
US8193468B2 (en) 2001-03-29 2012-06-05 Gsi Group Corporation Methods and systems for precisely relatively positioning a waist of a pulsed laser beam and method and system for controlling energy delivered to a target structure
US7633034B2 (en) 2004-06-18 2009-12-15 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots overlapping lengthwise on a structure
US7935941B2 (en) 2004-06-18 2011-05-03 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis on non-adjacent structures
US7425471B2 (en) 2004-06-18 2008-09-16 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis with cross-axis offset
US7435927B2 (en) 2004-06-18 2008-10-14 Electron Scientific Industries, Inc. Semiconductor link processing using multiple laterally spaced laser beam spots with on-axis offset
US7629234B2 (en) 2004-06-18 2009-12-08 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laterally spaced laser beam spots with joint velocity profiling
US8148211B2 (en) 2004-06-18 2012-04-03 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots spaced on-axis delivered simultaneously
US7687740B2 (en) 2004-06-18 2010-03-30 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laterally spaced laser beam spots delivering multiple blows
US7923306B2 (en) * 2004-06-18 2011-04-12 Electro Scientific Industries, Inc. Semiconductor structure processing using multiple laser beam spots
US8383982B2 (en) 2004-06-18 2013-02-26 Electro Scientific Industries, Inc. Methods and systems for semiconductor structure processing using multiple laser beam spots
US7396706B2 (en) 2004-12-09 2008-07-08 Electro Scientific Industries, Inc. Synchronization technique for forming a substantially stable laser output pulse profile having different wavelength peaks
US7301981B2 (en) 2004-12-09 2007-11-27 Electro Scientific Industries, Inc. Methods for synchronized pulse shape tailoring
US7289549B2 (en) 2004-12-09 2007-10-30 Electro Scientific Industries, Inc. Lasers for synchronized pulse shape tailoring

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