JPS6358906A - Manufacture of moisture-proof sic thin film thermistor - Google Patents
Manufacture of moisture-proof sic thin film thermistorInfo
- Publication number
- JPS6358906A JPS6358906A JP20413086A JP20413086A JPS6358906A JP S6358906 A JPS6358906 A JP S6358906A JP 20413086 A JP20413086 A JP 20413086A JP 20413086 A JP20413086 A JP 20413086A JP S6358906 A JPS6358906 A JP S6358906A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- sic thin
- glass
- film thermistor
- sic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 title claims description 35
- 238000004519 manufacturing process Methods 0.000 title claims description 9
- 239000011521 glass Substances 0.000 claims description 28
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 11
- 239000000758 substrate Substances 0.000 claims description 11
- 238000000034 method Methods 0.000 claims description 7
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 5
- 238000007796 conventional method Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000007650 screen-printing Methods 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000004078 waterproofing Methods 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Thermistors And Varistors (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明ばＳｉＣ薄膜をガラスによシ外気よシ遮断する防
水形ＳｉＣ薄膜サーミスタの製造法に関するものである
。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for manufacturing a waterproof SiC thin film thermistor in which a SiC thin film is shielded from outside air by using glass.
従来の技術
以下、図面を参照しながら従来の防水形薄膜サーミスタ
の製造法について説明をする。2. Description of the Related Art Hereinafter, a conventional method for manufacturing a waterproof thin film thermistor will be explained with reference to the drawings.
従来の防水形薄膜サーミスタの製造法は、第２図に示す
ように、アルミナ基板１上に金属ペーストにて一対の対
向電極２ａ、２ｂを形成した後、リード線接続部３１Ｌ
、３ｂを除く前記アルミナ基板１上にＳｉＣ薄膜４を
スパッタリングにより形成し、さらにガラスペーストを
前記ＳｉＣ薄膜４のすべてを覆い、かつ前記リード線接
続部３ｚ、３ｂが露出するように前記アルミナ基板１上
にスクリーン印刷により形成後、加熱し、ガラス被覆ら
を形成していた。As shown in FIG. 2, the conventional method for manufacturing a waterproof thin film thermistor is to form a pair of opposing electrodes 2a and 2b using metal paste on an alumina substrate 1, and then connect a lead wire connection portion 31L.
, 3b is formed on the alumina substrate 1 by sputtering, and the alumina substrate 1 is further coated with glass paste so that all of the SiC thin film 4 is covered and the lead wire connection parts 3z and 3b are exposed. A glass coating was formed by screen printing and then heating.
発明が解決しようとする問題点
ところがこのような従来の方法では、スクリーン印刷に
よって形成されたガラス被覆６は、印刷の位置のずれや
ガラスのピンホール等（つ印刷による欠陥のため、ガラ
ス被覆６によって完全に被覆されているべきＳｉＣ薄膜
４が露出し、防水不良を生じることが多かった。Problems to be Solved by the Invention However, in such a conventional method, the glass coating 6 formed by screen printing has defects such as misalignment of the printing position and pinholes in the glass. The SiC thin film 4, which should be completely covered, is exposed, often resulting in poor waterproofing.
本発明はこのような問題点を解決するもので、防水不良
の生じないガラス被覆ができる、防水形ＳｉＣ薄膜サー
ミスタの製造法を提供するものでちる。The present invention solves these problems and provides a method for manufacturing a waterproof SiC thin film thermistor that can be coated with glass without causing waterproofing defects.
問題点を解決するための手段
この問題点を解決するために本発明の防水形ＳｉＣ薄膜
サーミスタの製造法は、ＳｉＣ薄膜上に、あらかじめ前
記ＳｉＣ薄膜を完全に覆いかくす大きさに成形、焼結し
たガラスプレスフリノ）板をおいた後、加熱し、前記ガ
ラスプレスフリット板を前記ＳＩＣ薄膜およびその周囲
のアルミナ基板、電極と融着させ、ＳｉＣ薄膜サーミス
タの耐水性を得る方法である。Means for Solving the Problem In order to solve this problem, the manufacturing method of the waterproof SiC thin film thermistor of the present invention includes forming and sintering the SiC thin film in advance to a size that completely covers the SiC thin film. In this method, a glass press frit plate is placed and then heated to fuse the glass press frit plate with the SIC thin film and the surrounding alumina substrate and electrodes to obtain water resistance of the SiC thin film thermistor.
作用
この方法によると、ガラス被覆用のガラスプレスフリッ
ト板があらかじめ一定の大きさ、厚さに整えられている
ため、ピンホールやずれのないガラス被覆を得ることが
できる。Effect: According to this method, since the glass press frit plate for glass coating is prepared in advance to a certain size and thickness, it is possible to obtain glass coating without pinholes or displacement.
実施例
以下、本発明の一実施例の防水形薄膜サーミスタの製造
法について図面を参照しながら説明する。EXAMPLE Hereinafter, a method for manufacturing a waterproof thin film thermistor according to an example of the present invention will be described with reference to the drawings.
第１図に示すように、アルミナ基板１１の上に金属ペー
ストにて一対の対向電極１２２Ｌ、１２ｂを形成した後
、リード線接続部１３ａ、１３ｂおよび前記アルミナ基
板１１の端面から５ｏμｍ以上は露出するように、前記
対向電極１２ａ、 １２ｂが形成されている前記アルミ
ナ基板１１上にＳｉＣ薄膜１４をスパッタリングにより
形成する。さらに、前記ＳｉＣ薄膜１４を完全に覆い、
かつ前記リード線接続部１３ａ、１３ｂが露出する大き
さに成形、焼成したガラスプレスフリット板１５を前記
ＳｉＣ薄膜１４上においた後、加熱し、前記ガラスプレ
スフリット板１６を前記ＳｉＣ薄膜１４およびその開門
のアルミナ基板１１、前記対向電極１２＆、１２ｂと融
着させ、前記ＳｉＣ薄膜１４を外気から遮断させ、Ｓｉ
Ｃ薄膜サーミスタの耐水性を得る方法である。As shown in FIG. 1, after forming a pair of opposing electrodes 122L and 12b using metal paste on the alumina substrate 11, the lead wire connecting portions 13a and 13b and the end surface of the alumina substrate 11 are exposed by 5 μm or more. A SiC thin film 14 is formed by sputtering on the alumina substrate 11 on which the counter electrodes 12a and 12b are formed. Furthermore, completely covering the SiC thin film 14,
A glass press frit plate 15 formed and fired to a size that exposes the lead wire connection parts 13a and 13b is placed on the SiC thin film 14, and then heated, so that the glass press frit plate 16 is bonded to the SiC thin film 14 and the glass press frit plate 16. The open alumina substrate 11 is fused to the counter electrodes 12 & 12b, the SiC thin film 14 is isolated from the outside air, and the Si
This is a method for obtaining water resistance of C thin film thermistors.
発明の効果
以上のように本実施例によれば、下記のような効果を有
する。Effects of the Invention As described above, this embodiment has the following effects.
（１）ガラス被覆にあらかじめ所定の大きさに成形。(1) Molded into a predetermined size on the glass coating.
焼成したガラスプレスフリット板を用いているため、ガ
ラスペーストのスクリーン印刷のよってガラス被覆が所
定の位置からずれてＳｉＣ薄膜が露出し薄膜サーミスタ
素子の耐水性をそこなうことがない。Since a fired glass press frit plate is used, screen printing of glass paste will not cause the glass coating to shift from a predetermined position and expose the SiC thin film, thereby preventing the water resistance of the thin film thermistor element from being impaired.
（２） ガラス被覆にガラスプレスフリット板を用い
ているため、ガラスペーストのスクリーンの印刷で生じ
るようなピンホール、かすれ等の欠陥が発生して、薄膜
サーミスタ素子の耐水性をそこなうことがない。(2) Since a glass press frit plate is used for the glass coating, defects such as pinholes and scratches that occur when printing glass paste screens do not occur and impair the water resistance of the thin film thermistor element.
（３）鉛等の有害物質を含むガラスペーストを取扱わ々
いため、安全衛生上、作業管理が楽になる。(3) Work management becomes easier in terms of health and safety since glass paste containing harmful substances such as lead is not handled.
（４）バインダーの除去が不要になり、ガラスの加熱焼
成時の温度管理が楽になる。(4) There is no need to remove the binder, making temperature control easier during heating and firing of glass.
第１図は本発明の一実施例による防水形ＳｉＣ薄膜サー
ミスタの製造法を説明するための将視図、第２図は従来
の防水形ＳｉＣ薄膜サーミスタを示す斜視図である。
１１・・・・・・アルミナ基板、１２２Ｌ、１２ｂ・・
・・・・対向電極、１３ａ、１３ｂ・・・・・・リード
線接続部、１４・・・・・・ＳｉＣ薄膜、１５・・・・
・・ガラスプレスフリット板。FIG. 1 is a perspective view for explaining a method of manufacturing a waterproof SiC thin film thermistor according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a conventional waterproof SiC thin film thermistor. 11...Alumina substrate, 122L, 12b...
...Counter electrode, 13a, 13b...Lead wire connection part, 14...SiC thin film, 15...
...Glass press frit plate.
Claims (1)
れたＳｉＣ薄膜をガラスにて被覆し、前記ＳｉＣ薄膜上
に前記ＳｉＣ薄膜を完全に覆いかくすようにガラスフリ
ットを所定の寸法に成形焼結したガラスプレスフリット
板をおいた後、前記ＳｉＣ薄膜サーミスタチップを加熱
し、前記ガラスプレスフリット板を前記ＳｉＣ薄膜およ
びその周囲のアルミナ基板、電極と融着させ、前記Ｓｉ
Ｃ薄膜を外気から遮断させ、ＳｉＣ薄膜サーミスタチッ
プの耐水性を得る防水形ＳｉＣ薄膜サーミスタの製造法
。A glass press frit in which a SiC thin film formed on an alumina substrate of a SiC thin film thermistor chip is covered with glass, and a glass frit is formed and sintered to a predetermined size so as to completely cover and hide the SiC thin film. After placing the plate, the SiC thin film thermistor chip is heated and the glass press frit plate is fused to the SiC thin film and the surrounding alumina substrate and electrode, and the SiC thin film thermistor chip is heated.
A method for manufacturing a waterproof SiC thin film thermistor by shielding the C thin film from the outside air and obtaining water resistance of the SiC thin film thermistor chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20413086A JPS6358906A (en) | 1986-08-29 | 1986-08-29 | Manufacture of moisture-proof sic thin film thermistor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20413086A JPS6358906A (en) | 1986-08-29 | 1986-08-29 | Manufacture of moisture-proof sic thin film thermistor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6358906A true JPS6358906A (en) | 1988-03-14 |
Family
ID=16485327
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20413086A Pending JPS6358906A (en) | 1986-08-29 | 1986-08-29 | Manufacture of moisture-proof sic thin film thermistor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6358906A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006239083A (en) * | 2005-03-02 | 2006-09-14 | Figla Co Ltd | Liquid dispensing mechanism and liquid cosmetic container including the liquid dispensing mechanism |
-
1986
- 1986-08-29 JP JP20413086A patent/JPS6358906A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006239083A (en) * | 2005-03-02 | 2006-09-14 | Figla Co Ltd | Liquid dispensing mechanism and liquid cosmetic container including the liquid dispensing mechanism |
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