JPS6356987A - プリント配線板の製造方法 - Google Patents
プリント配線板の製造方法Info
- Publication number
- JPS6356987A JPS6356987A JP20204886A JP20204886A JPS6356987A JP S6356987 A JPS6356987 A JP S6356987A JP 20204886 A JP20204886 A JP 20204886A JP 20204886 A JP20204886 A JP 20204886A JP S6356987 A JPS6356987 A JP S6356987A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- engineering plastic
- copper
- film
- wiring board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20204886A JPS6356987A (ja) | 1986-08-27 | 1986-08-27 | プリント配線板の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20204886A JPS6356987A (ja) | 1986-08-27 | 1986-08-27 | プリント配線板の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6356987A true JPS6356987A (ja) | 1988-03-11 |
| JPH0579197B2 JPH0579197B2 (enExample) | 1993-11-01 |
Family
ID=16451067
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20204886A Granted JPS6356987A (ja) | 1986-08-27 | 1986-08-27 | プリント配線板の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6356987A (enExample) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55148491A (en) * | 1979-05-09 | 1980-11-19 | Meidensha Electric Mfg Co Ltd | Method of fabricating printed circuit board |
| JPS5670684A (en) * | 1979-11-14 | 1981-06-12 | Seikoo Keiyo Kogyo Kk | Circuit board and method of manufacturig same |
| JPS57184282A (en) * | 1981-05-08 | 1982-11-12 | Matsushita Electric Works Ltd | Board for printed circuit substrate |
| JPS5877285A (ja) * | 1981-11-02 | 1983-05-10 | 松下電工株式会社 | プリント配線板の製造方法 |
-
1986
- 1986-08-27 JP JP20204886A patent/JPS6356987A/ja active Granted
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS55148491A (en) * | 1979-05-09 | 1980-11-19 | Meidensha Electric Mfg Co Ltd | Method of fabricating printed circuit board |
| JPS5670684A (en) * | 1979-11-14 | 1981-06-12 | Seikoo Keiyo Kogyo Kk | Circuit board and method of manufacturig same |
| JPS57184282A (en) * | 1981-05-08 | 1982-11-12 | Matsushita Electric Works Ltd | Board for printed circuit substrate |
| JPS5877285A (ja) * | 1981-11-02 | 1983-05-10 | 松下電工株式会社 | プリント配線板の製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0579197B2 (enExample) | 1993-11-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3702284A (en) | Process of producing plated through-hole printed circuit boards | |
| US3475284A (en) | Manufacture of electric circuit modules | |
| US4721550A (en) | Process for producing printed circuit board having improved adhesion | |
| DE69717319D1 (de) | Verfahren zur galvanischen herstellung eines rakels | |
| US3726770A (en) | Electrodeposition process for producing perforated foils with raised portions at the edges of the holes | |
| DE69111003T2 (de) | Verfahren unter Verwendung einer permanenten Matrize zur Herstellung von elektrischen Schaltungen. | |
| US2225734A (en) | Electrolytic method of making screens | |
| JPS6356987A (ja) | プリント配線板の製造方法 | |
| US2225733A (en) | Process for the electrolytic production of metal screens | |
| GB2123616A (en) | Circuit boards and method of manufacture thereof | |
| JPS6317592A (ja) | プリント配線板の製造方法 | |
| AU4338693A (en) | Method of making a printed circuit board | |
| US3645855A (en) | Ultrasonic repair plating of microscopic interconnections | |
| US3745096A (en) | Nonstick treatment of mold cavities | |
| CA2177708C (en) | Method of making a printed circuit board | |
| KR970005444B1 (ko) | 목재의 전기도금 방법 | |
| GB2181743A (en) | Metal plating of through holes in printed circuit boards | |
| EP0530564A1 (de) | Verfahren zur Herstellung von Leiterplatten | |
| US3622284A (en) | Electrodeposition of metal over large nonconducting surfaces | |
| US3729388A (en) | Method of preparing at least one conductive form | |
| JPH03145187A (ja) | フレキシブル基板用の電着塗装装置 | |
| JPS6134512B2 (enExample) | ||
| GB1253047A (enExample) | ||
| JPS6380593A (ja) | スル−ホ−ルプリント配線板の製造方法 | |
| JPS5815293A (ja) | 印刷配線板の製造法 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |