JPS6356655U - - Google Patents
Info
- Publication number
- JPS6356655U JPS6356655U JP15068686U JP15068686U JPS6356655U JP S6356655 U JPS6356655 U JP S6356655U JP 15068686 U JP15068686 U JP 15068686U JP 15068686 U JP15068686 U JP 15068686U JP S6356655 U JPS6356655 U JP S6356655U
- Authority
- JP
- Japan
- Prior art keywords
- recording head
- cooling
- contact
- substrate
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims 1
- 108091008695 photoreceptors Proteins 0.000 claims 1
- 230000003287 optical effect Effects 0.000 description 1
Description
第１図はこの考案の冷却装置の第一実施例を示
す概略斜視図、第２図はこの考案における高膨張
金属にて冷却手段を構成した場合の概略側面図、
第３図はこの考案における低膨張金属にて冷却手
段を構成した場合の概略側面図、第４図はこの考
案の冷却装置の第二実施例を示す概略斜視図、第
５図はこの考案の冷却装置の第三実施例を示す概
略側面図である。
符号説明、１０……ＬＥＤアレイヘツド（記録
ヘツド）、１２……基板、１４……光学記録素子
、２０，２０′……冷却フイン、２４……ヒート
シンク、２６……熱伝導部材、２８……ヒートパ
イプ、３０……高膨張金属、３２……低膨張金属
、４０……固定手段。
Fig. 1 is a schematic perspective view showing a first embodiment of the cooling device of this invention, and Fig. 2 is a schematic side view of the case where the cooling means is constructed of high expansion metal in this invention.
Fig. 3 is a schematic side view of a case where the cooling means of this invention is made of a low expansion metal, Fig. 4 is a schematic perspective view showing a second embodiment of the cooling device of this invention, and Fig. 5 is a schematic side view of the cooling means of this invention. It is a schematic side view which shows the third Example of a cooling device. Description of symbols, 10... LED array head (recording head), 12... substrate, 14... optical recording element, 20, 20'... cooling fin, 24... heat sink, 26... thermal conductive member, 28... heat Pipe, 30... High expansion metal, 32... Low expansion metal, 40... Fixing means.
Claims (1)
光体に書込み信号を送る記録ヘツドの基板の冷却
側に冷却手段を取付けて、上記記録ヘツドが発生
する熱を冷却するものにおいて、互いに接触する
熱膨張係数の異なる２種類の金属のうちのいずれ
か一方の金属にて上記冷却手段の一部を構成し、
他方の金属と上記記録ヘツドの基板の冷却側面と
を接触させると共に、接触部の適宜箇所を固定し
て成ることを特徴とする記録ヘツドの冷却装置。 A cooling means is attached to the cooling side of the substrate of the recording head that converts information from the reading means into light or heat and sends a write signal to the photoreceptor, and the recording heads contact each other in order to cool down the heat generated by the recording head. A part of the cooling means is made of one of two types of metals having different coefficients of thermal expansion,
A cooling device for a recording head, characterized in that the other metal is brought into contact with the cooling side surface of the substrate of the recording head, and the contact portion is fixed at an appropriate location.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15068686U JPS6356655U (en) | 1986-10-02 | 1986-10-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP15068686U JPS6356655U (en) | 1986-10-02 | 1986-10-02 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6356655U true JPS6356655U (en) | 1988-04-15 |
Family
ID=31067049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15068686U Pending JPS6356655U (en) | 1986-10-02 | 1986-10-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6356655U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003525785A (en) * | 2000-03-10 | 2003-09-02 | シルバーブルック リサーチ ピーティーワイ リミテッド | Compensation for thermal expansion of modular printhead devices |
-
1986
- 1986-10-02 JP JP15068686U patent/JPS6356655U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003525785A (en) * | 2000-03-10 | 2003-09-02 | シルバーブルック リサーチ ピーティーワイ リミテッド | Compensation for thermal expansion of modular printhead devices |
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