JPS635648U - - Google Patents
Info
- Publication number
- JPS635648U JPS635648U JP9950886U JP9950886U JPS635648U JP S635648 U JPS635648 U JP S635648U JP 9950886 U JP9950886 U JP 9950886U JP 9950886 U JP9950886 U JP 9950886U JP S635648 U JPS635648 U JP S635648U
- Authority
- JP
- Japan
- Prior art keywords
- conductive layer
- lead frame
- mounting portion
- land portion
- element mounting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 238000000465 moulding Methods 0.000 claims 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9950886U JPS635648U (fi) | 1986-06-27 | 1986-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9950886U JPS635648U (fi) | 1986-06-27 | 1986-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS635648U true JPS635648U (fi) | 1988-01-14 |
Family
ID=30968446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9950886U Pending JPS635648U (fi) | 1986-06-27 | 1986-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS635648U (fi) |
-
1986
- 1986-06-27 JP JP9950886U patent/JPS635648U/ja active Pending