JPS6356409A - Mold device - Google Patents

Abstract

PURPOSE:To permit the correct recognition of the conditions of respective molds at all times, by a method wherein a mold is provided with sensors, detecting respective values of at least two kinds of physical amounts of the mold under using condition, and, further, the mold is equipped with memories, memorizing the outputs of respective sensors and the using numbers of the molds. CONSTITUTION:A fixed mounting board 1 is provided with an attaching hole 1a capable of storing an IC memory 26 while the IC memory 26 is attached into the attaching hole 1a through an insulating material 31. A temperature, pressure, strain or the like, which are applied on a mold upon working, the temperatures of returning cooling water, resin injected into and molded in a cavity and the like are detected by temperature sensors 18, 18A, 18B, a pressure gauge 19 and a strain meter 20 while respective detecting values are converted into digital signals by A/D converters 21, 23, 21A, 21B to input them into a CPU 24. According to this method, the memorizing contents of the IC chip are read by connecting a connecting pin to a reader whereby the correct and actual using conditions of the molds may be recognized at all times.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention is applicable to casting, forging, drawing, pressing,
This article relates to improvements in mold devices used in injection molding, extrusion molding, etc.

[Conventional technology]

Molding molds are used in various other molding equipment such as compression molding, transfer molding, injection molding, extrusion molding, blow molding, and calender molding, but if you want to obtain the best molded product, it is important to use molds. It is necessary to accurately grasp the status at all times.

In other words, as molds repeatedly expand and contract with use, they become fatigued and their strength decreases. Accurately record the usage history of the mold, such as the distortion that occurred in the mold, as well as the name of the processing equipment and worker used, and check the above recorded data periodically to inspect the mold and check the results according to the degree of fatigue. The best molded product can always be obtained by replacing it with a new one, or by controlling the molding device according to the state of the mold during processing.

However, in the past, the usage history of molds was hardly recorded, and even if the usage history of molds was recorded, the date, number of times it was used, processing equipment used, etc. were roughly recorded in a management book. The method used was to periodically judge the condition of the mold based on records such as control books. Therefore, when performing complex work, entries may be forgotten in the control book, or if molds of similar shapes are frequently replaced and used, entries may not be made accurately in the control book. There was a problem in that it was difficult to accurately grasp the status of each type from the time it was first used until the present day.

Furthermore, even if a combiator is used to record and manage these data, checking the recorded data with the actual mold must be done manually, and the storage and recording of the mold must be done separately. Therefore, the verification process becomes extremely complicated. Furthermore, mold fatigue is almost invisible from the outside, so there was a problem with the reliability of recording, but it is possible to record the values of physical quantities such as temperature and working pressure, as well as the working time, etc. while the mold is being used. As a result, there was virtually no control over the mold equipment.

[Problems to be solved by the present invention] The present invention has been made based on the above-mentioned viewpoint, and its purpose is to solve the problems that have been applied to each kata from the beginning of use to the present. At least two of the physical quantities that are important for mold control (usually temperature, pressure, and time of action, or even strain, return cooling water, and the temperature of the injection molding resin in the mold, etc.) Detected and recorded at a predetermined location, and also accurately memorized the usage history of the mold, such as the number of times it was used, the name of the processing equipment used and the name of the operator, etc., and based on the recorded data, the condition of each mold can be determined. The objective is to provide a molding device that can always be accurately grasped.

[Means for solving problems]

Therefore, the above purpose is to provide the mold with each sensor that detects the respective values of two or more physical quantities of the mold at least in the state of use, or to further detect the output of each of the sensors and the number of times the mold is used. This is accomplished by a type device with a recording memory.

[For production]

With the above configuration, the number of times each mold has been used since the beginning of its use up to the present, the temperature and pressure applied to the mold during individual processing, the distortion caused in the mold, etc. History of physical quantities of species and above, as well as processing equipment R used and operator name, etc.
The usage history of the mold, etc. is accurately and automatically recorded, and the recorded data can be instantly checked.

Furthermore, since the data for each mold is always integrated with the mold, a wide variety of molds can be easily and reliably managed, and therefore the best molded product can always be obtained.

〔Example〕

Hereinafter, details of the present invention will be specifically explained with reference to the drawings.

FIG. 1 is a longitudinal sectional view showing an embodiment of a molding device according to the present invention, and FIG. 2 is an explanatory diagram showing the configuration of an IC memory.

In Figures 1 and 2, 1 is a fixed side mounting plate, 2 is a fixed side template, 3 is a core, 3a is a coolant flow path, 4 is a movable side template, 5
is an upper cavity block, 6 is a lower cavity block, 7.7 is a guide bin, 8.8 is a guide bin bushing, 9 is a receiving plate, 10.10 is a spacer block, 11 is an ejector turbine, 12 is a return bin, 13 and 14 is an ejector plate, 15 is a movable side mounting plate, 16 and 17 are induction heating coils, 18 is a temperature sensor that detects the temperature when the mold is in use, 18A is a temperature sensor that detects the temperature of the return cooling water, 18B is a temperature sensor that detects the temperature of the resin filled in the cavity or formed at a desired time of each injection molding cycle, which will be described later; 19 is a pressure gauge; 20 is a strain gauge;
21 to 21 and 21A and 21B are A/D converters, 2
4 is the CPU, δ is the keyboard, 26 is the IC card, 27
is an IC memory board, n is an IC chip, 29 is a battery, 30
．． 30 is a connection bottle, 31 is a heat insulator, and 32 is a liquid crystal display.

The fixed side mounting plate 1 is attached to a mold mounting stationary plate of a compression molding machine (not shown) via a bolster.

Further, the fixed side template 2 is fixed to the fixed side mounting plate 1, and a core 3 is fitted into the substantially central portion.

The induction heating coils 16 and 17 are provided inside the lower cavity block 5 and inside the core 3 in the form of independent split coils so as to be substantially evenly distributed.
These are supplied with alternating current by a power supply device (not shown).
Cavity blocks 5 and 6 and core 3 are respectively induction heated. During processing, the temperature, pressure, strain, etc. applied to the mold, as well as the temperature of the return cooling water, the temperature of the injection molded resin, etc., are measured by a temperature sensor 18, a pressure gauge 19, a strain gauge 20, etc. as necessary. temperature sensor 18A, 18
Detected by B, etc.

Therefore, at the beginning of each process, a compression molding machine (not shown) is used.
The mold mounting movable plate is lowered, and the movable mold plate 4 and the fixed mold plate 2 face each other with an appropriate interval.

In this state, alternating current is supplied to the induction heating coils 16 and 17 from a power supply device (not shown), and the cavity block 5.6
The core 3 generates heat by induction heating, and then a fixed amount of molding material is weighed and put into the heated mold cavity block 5.6, and the mold mounting movable platen of the compression molding machine (not shown) is placed. rises, the movable mold plate 4 is pushed up, and the molding material plasticized by heat and pressure is sealed in the cavity formed between the core 4 and the cavity block 5.6 and molded into the desired shape. be done.

Furthermore, the cavity block 5.6 and the core 4 are further heated by induction heating to harden the molding material within the cavity.

Therefore, in the molding device according to the present invention, it is necessary to place the molding device at an appropriate position that does not affect its strength or temperature distribution during use, for example,
As shown in FIG. 1, a mounting hole 1a large enough to accommodate an IC memory 26 is provided in the fixed side mounting plate 1, and the IC memory 26 is mounted in this mounting hole la via a heat insulating material 31. . The temperature, pressure, strain, etc. applied to the mold during processing, the temperature of the return cooling water, the temperature of the resin injection molded into the cavity, etc. are measured by temperature sensors 1 and 1.
8.18A and 18B are detected by the pressure gauge 19 and strain gauge 20, and each detected value is sent to the corresponding A/D converter 21.
After being converted into a digital signal in the imperial order and 21A and 21B, C
It is input to PU24. Further, each time the worker starts processing, he inputs the name of the worker, the name of the molding machine to be used, etc. to the CPU 24 using the keyboard.

Next, we will discuss the detection parts of each physical quantity and the mode of its control.The temperature of the mold is determined by the size and shape of the mold, etc., and when compared with the detection temperature of molds with different sizes and shapes. It is desirable to have a part where common information can be obtained for mold management, and in the case of the illustrated embodiment, by detecting the temperature in the core part 3, it is possible to grasp the common characteristics of molds of this type of shape. Yes, the mold temperature can be controlled to a predetermined value by comparing the detection signal with stored control information and changing the mold heating (preheating) or cooling water temperature, and the resin temperature can be controlled by the molding machine injection. The temperature of the resin in the molding machine is controlled by detecting it at the outlet or mold inlet, and the temperature of the cooling water may be at a predetermined location inside the cavity core, but it is supplied to the mold. Since the temperature and flow rate of the cooling water are controlled to known predetermined values, by detecting the temperature of the return cooling water as described above, more accurate or easy-to-judge information can be obtained. The temperature and/or flow rate of the supplied cooling water may be easily controlled based on the obtained signal (and the pressure acting on the mold may be controlled, for example, at a predetermined location such as the mold inlet or at a predetermined location of the mold clamping mechanism). Normally, it is sufficient to record the detection over time and control the injection pressure.The same goes for detecting other distortions, etc.In die casting, etc., it is necessary to detect the sound etc. when the molded material contracts. , the cooling water may be controlled by comparing with the stored signal.

Therefore, each time a mold is used, the IC memory 26 stores information such as the number of uses, the temperature, pressure and strain applied to the mold, the values of various physical quantities such as the temperature of the return cooling water and the molding resin, and the operation time. are stored, and the information is calculated and summarized, and furthermore, the name of the operator and the name of the molding machine used are stored, so connect the connection bin 30.30 to a known reader and record it on the IC chip 28. By reading the contents, you can always know the exact usage history of the type. Therefore, it is possible to grasp the degree of fatigue of the mold and accurately judge when to replace it.

〔Effect of the invention〕

Since the present invention is configured as described above, in accordance with the present invention, at least two or more types of physical quantities important for mold management among the physical quantities that have acted on the mold from the beginning of use of each mold to the present. (Usually, temperature, pressure, usage time, etc., strain amount, return cooling water and injection molding resin temperature, etc.) are detected and recorded, and furthermore, the number of times of use, the processing equipment used, etc. The operator's name, mold usage history, etc. are accurately and automatically recorded, and the recorded data can be instantly checked. Furthermore, since the data of each type is always integrated with the type, a wide variety of types can be easily and reliably managed. Therefore, when performing processing using the mold device according to the present invention,
You can always get the best molded product.

Note that the present invention is not limited to the embodiments described above. That is, for example, in this embodiment, a mold for resin molding is shown, but it is not limited to the above-mentioned mold, and may be a forging mold, a drawing mold, a press mold, etc., and the present invention is applicable depending on the frequency of use. Any type can be similarly constructed as long as it increases the degree of fatigue accordingly.

In addition, the mounting position of the IC card, the method of writing data on the IC card, etc. can be freely changed within the scope of the purpose of the present invention, and the present invention encompasses all of them. .

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a longitudinal sectional view showing an embodiment of a molding device according to the present invention, and FIG. 2 is an explanatory diagram showing the configuration of an RC memory.

Claims (1)

[Scope of Claims] 1) A mold device characterized in that the mold is provided with each sensor that detects the respective values of two or more physical quantities in the usage state of the mold and records the values. 2) The molding device according to claim 1, wherein the recording is made in a memory attached to the molding device. 3) A mold device, wherein the two or more physical quantities are temperature and pressure acting on a predetermined portion of the mold, and are recorded together with the time of action.