JPS6356383A - レーザ加工位置制御装置 - Google Patents

レーザ加工位置制御装置

Info

Publication number
JPS6356383A
JPS6356383A JP61200385A JP20038586A JPS6356383A JP S6356383 A JPS6356383 A JP S6356383A JP 61200385 A JP61200385 A JP 61200385A JP 20038586 A JP20038586 A JP 20038586A JP S6356383 A JPS6356383 A JP S6356383A
Authority
JP
Japan
Prior art keywords
stage
slit
laser processing
processing position
laser
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61200385A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0534116B2 (enrdf_load_stackoverflow
Inventor
Toshikazu Kajikawa
敏和 梶川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP61200385A priority Critical patent/JPS6356383A/ja
Publication of JPS6356383A publication Critical patent/JPS6356383A/ja
Publication of JPH0534116B2 publication Critical patent/JPH0534116B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Lasers (AREA)
  • Laser Beam Processing (AREA)
JP61200385A 1986-08-27 1986-08-27 レーザ加工位置制御装置 Granted JPS6356383A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61200385A JPS6356383A (ja) 1986-08-27 1986-08-27 レーザ加工位置制御装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61200385A JPS6356383A (ja) 1986-08-27 1986-08-27 レーザ加工位置制御装置

Publications (2)

Publication Number Publication Date
JPS6356383A true JPS6356383A (ja) 1988-03-10
JPH0534116B2 JPH0534116B2 (enrdf_load_stackoverflow) 1993-05-21

Family

ID=16423439

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61200385A Granted JPS6356383A (ja) 1986-08-27 1986-08-27 レーザ加工位置制御装置

Country Status (1)

Country Link
JP (1) JPS6356383A (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10235484A (ja) * 1997-02-24 1998-09-08 Mitsubishi Electric Corp レーザ加工装置
US7253376B2 (en) * 2005-01-21 2007-08-07 Ultratech, Inc. Methods and apparatus for truncating an image formed with coherent radiation

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5548489A (en) * 1978-09-29 1980-04-07 Nec Corp Full-automatic laser work system

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5548489A (en) * 1978-09-29 1980-04-07 Nec Corp Full-automatic laser work system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH10235484A (ja) * 1997-02-24 1998-09-08 Mitsubishi Electric Corp レーザ加工装置
US7253376B2 (en) * 2005-01-21 2007-08-07 Ultratech, Inc. Methods and apparatus for truncating an image formed with coherent radiation

Also Published As

Publication number Publication date
JPH0534116B2 (enrdf_load_stackoverflow) 1993-05-21

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