JPS635625U - - Google Patents
Info
- Publication number
- JPS635625U JPS635625U JP9862686U JP9862686U JPS635625U JP S635625 U JPS635625 U JP S635625U JP 9862686 U JP9862686 U JP 9862686U JP 9862686 U JP9862686 U JP 9862686U JP S635625 U JPS635625 U JP S635625U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- claws
- susceptor
- holder
- small
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000000078 claw Anatomy 0.000 claims description 4
- 238000001182 laser chemical vapour deposition Methods 0.000 claims 1
Description
第１図は本考案に係るウエハ保持装置の実施例
を示す斜視図、第２図は同一部破断側面図である
。
４…サセプタ、５…ウエハ、６…爪、１１…ウ
エハ押え、１４…スプリング、１８…Ｏ・Ｆ面、
１９…圧接平面。
FIG. 1 is a perspective view showing an embodiment of a wafer holding device according to the present invention, and FIG. 2 is a partially cutaway side view of the same. 4...Susceptor, 5...Wafer, 6...Claw, 11...Wafer holder, 14...Spring, 18...O/F surface,
19...Pressure plane.
Claims (1)
に、ウエハ表面からの突出量を可及的に小さくし
たウエハ周縁と係合させるための爪を突出させる
と共に、これらの爪に対向する位置に、スプリン
グによりウエハ面に対して平行な付勢力を与えら
れてウエハを上記爪の方に押圧するウエハ押え設
け、このウエハ押えを、ウエハ表面からの突出量
を可及的に小さく形成すると共に、ウエハのオリ
エンテーシヨン・フラツト面に対して接触する圧
接平面を、ウエハをサセプタ上に押し付ける方向
に下向き傾斜させることによつて構成したことを
特徴とするレーザＣＶＤ装置におけるウエハ保持
装置。 At least one point on the susceptor on which the wafer is placed is provided with protruding claws for engaging with the wafer periphery whose protrusion from the wafer surface is as small as possible, and springs are provided at positions opposite to these claws. A wafer holder is provided which applies an urging force parallel to the wafer surface and presses the wafer toward the claws, and this wafer holder is formed so that its protrusion from the wafer surface is as small as possible, and the wafer holder is A wafer holding device for a laser CVD apparatus, characterized in that a pressing plane that contacts an orientation flat surface is inclined downward in a direction to press the wafer onto a susceptor.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9862686U JPS635625U (en) | 1986-06-27 | 1986-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9862686U JPS635625U (en) | 1986-06-27 | 1986-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS635625U true JPS635625U (en) | 1988-01-14 |
Family
ID=30966737
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9862686U Pending JPS635625U (en) | 1986-06-27 | 1986-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS635625U (en) |
-
1986
- 1986-06-27 JP JP9862686U patent/JPS635625U/ja active Pending
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