JPS6355456U - - Google Patents
Info
- Publication number
- JPS6355456U JPS6355456U JP14750086U JP14750086U JPS6355456U JP S6355456 U JPS6355456 U JP S6355456U JP 14750086 U JP14750086 U JP 14750086U JP 14750086 U JP14750086 U JP 14750086U JP S6355456 U JPS6355456 U JP S6355456U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive tape
- backing plate
- reinforcing portion
- printed circuit
- flexible printed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 230000003014 reinforcing effect Effects 0.000 claims 2
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Structure Of Printed Boards (AREA)
Description
第１図は本考案に係るフレキシブルプリント基
板の一実施例を示す側面図、第２図は同平面図、
第３図は同実施例における気泡排出状態を説明す
るための断面図、第４図及び第５図はそれぞれ本
考案の他の実施例を示す側面図、第６図は従来例
を示す平面図、第７図は同側面図、第８図は気泡
の存在状態を示す断面図である。
１１……フレキシブルプリント基板本体、１２
，１２Ａ及び１２Ｂ……空気逃げ用の孔、１３…
…裏打板、１４……粘着テープ、１５……気泡。
FIG. 1 is a side view showing an embodiment of the flexible printed circuit board according to the present invention, FIG. 2 is a plan view of the same,
FIG. 3 is a sectional view for explaining the bubble discharge state in the same embodiment, FIGS. 4 and 5 are side views showing other embodiments of the present invention, and FIG. 6 is a plan view showing the conventional example. , FIG. 7 is a side view of the same, and FIG. 8 is a sectional view showing the state of existence of bubbles. 11...Flexible printed circuit board body, 12
, 12A and 12B... air escape holes, 13...
... Backing board, 14 ... Adhesive tape, 15 ... Air bubbles.
Claims (1)
わせたフレキシブルプリント基板において、基板
本体の補強部分か粘着テープを含む裏打板または
その両方に空気逃げ用の孔を設けたことを特徴と
するフレキシブルプリント基板。 A flexible printed circuit board in which a backing plate is bonded to a required reinforcing portion with adhesive tape, characterized in that holes for air escape are provided in the reinforcing portion of the board body, the backing plate containing the adhesive tape, or both. substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14750086U JPS6355456U (en) | 1986-09-26 | 1986-09-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14750086U JPS6355456U (en) | 1986-09-26 | 1986-09-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6355456U true JPS6355456U (en) | 1988-04-13 |
Family
ID=31060919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14750086U Pending JPS6355456U (en) | 1986-09-26 | 1986-09-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6355456U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008016725A (en) * | 2006-07-07 | 2008-01-24 | Sharp Corp | Printed wiring board, method for mounting components thereof, and the board for mounting the electronic components |
| JP2020174168A (en) * | 2019-04-08 | 2020-10-22 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Printed circuit board |
-
1986
- 1986-09-26 JP JP14750086U patent/JPS6355456U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008016725A (en) * | 2006-07-07 | 2008-01-24 | Sharp Corp | Printed wiring board, method for mounting components thereof, and the board for mounting the electronic components |
| JP2020174168A (en) * | 2019-04-08 | 2020-10-22 | サムソン エレクトロ−メカニックス カンパニーリミテッド． | Printed circuit board |
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