JPS6354431A - Molding of diacetylene group-containing 1,3-substituted aromatic polyamide - Google Patents
Molding of diacetylene group-containing 1,3-substituted aromatic polyamideInfo
- Publication number
- JPS6354431A JPS6354431A JP19805186A JP19805186A JPS6354431A JP S6354431 A JPS6354431 A JP S6354431A JP 19805186 A JP19805186 A JP 19805186A JP 19805186 A JP19805186 A JP 19805186A JP S6354431 A JPS6354431 A JP S6354431A
- Authority
- JP
- Japan
- Prior art keywords
- group
- diacetylene
- molding
- formula
- substituted aromatic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- LLCSWKVOHICRDD-UHFFFAOYSA-N buta-1,3-diyne Chemical group C#CC#C LLCSWKVOHICRDD-UHFFFAOYSA-N 0.000 title claims abstract description 37
- 239000004760 aramid Substances 0.000 title claims abstract description 15
- 229920003235 aromatic polyamide Polymers 0.000 title claims abstract description 15
- 238000000465 moulding Methods 0.000 title abstract description 19
- 125000003368 amide group Chemical group 0.000 claims abstract description 9
- 125000002029 aromatic hydrocarbon group Chemical group 0.000 claims abstract description 9
- 125000001183 hydrocarbyl group Chemical group 0.000 claims abstract description 8
- 238000006116 polymerization reaction Methods 0.000 claims abstract description 6
- 125000004432 carbon atom Chemical group C* 0.000 claims description 6
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims 1
- 239000004952 Polyamide Substances 0.000 abstract description 7
- 229920002647 polyamide Polymers 0.000 abstract description 7
- 150000001412 amines Chemical class 0.000 abstract description 6
- 125000002915 carbonyl group Chemical group [*:2]C([*:1])=O 0.000 abstract description 6
- -1 carboxylic acid halide Chemical class 0.000 abstract description 6
- 150000001732 carboxylic acid derivatives Chemical class 0.000 abstract description 4
- 239000003960 organic solvent Substances 0.000 abstract description 4
- 239000000243 solution Substances 0.000 abstract description 4
- 125000000472 sulfonyl group Chemical group *S(*)(=O)=O 0.000 abstract description 4
- 150000001733 carboxylic acid esters Chemical class 0.000 abstract description 3
- 239000003513 alkali Substances 0.000 abstract 1
- 229910052736 halogen Inorganic materials 0.000 abstract 1
- 150000002367 halogens Chemical class 0.000 abstract 1
- 239000011259 mixed solution Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 25
- 238000006243 chemical reaction Methods 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 11
- 239000000463 material Substances 0.000 description 9
- 230000009257 reactivity Effects 0.000 description 8
- 238000005452 bending Methods 0.000 description 6
- 238000012360 testing method Methods 0.000 description 6
- 125000005843 halogen group Chemical group 0.000 description 5
- 239000002994 raw material Substances 0.000 description 5
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000004132 cross linking Methods 0.000 description 4
- 125000004433 nitrogen atom Chemical group N* 0.000 description 4
- 230000035484 reaction time Effects 0.000 description 4
- 238000003786 synthesis reaction Methods 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 125000003277 amino group Chemical group 0.000 description 3
- 230000002706 hydrostatic effect Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000011160 research Methods 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 125000002723 alicyclic group Chemical group 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 239000007864 aqueous solution Substances 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 2
- 150000001735 carboxylic acids Chemical class 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 150000001875 compounds Chemical class 0.000 description 2
- 125000004093 cyano group Chemical group *C#N 0.000 description 2
- 125000004185 ester group Chemical group 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Chemical group CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- 230000005284 excitation Effects 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 125000000449 nitro group Chemical group [O-][N+](*)=O 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 230000002194 synthesizing effect Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 238000001069 Raman spectroscopy Methods 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 150000001350 alkyl halides Chemical class 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 150000001721 carbon Chemical group 0.000 description 1
- 150000001244 carboxylic acid anhydrides Chemical class 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012776 electronic material Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012761 high-performance material Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 230000009878 intermolecular interaction Effects 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 239000012948 isocyanate Substances 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000000462 isostatic pressing Methods 0.000 description 1
- 229920002521 macromolecule Polymers 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000008204 material by function Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000691 measurement method Methods 0.000 description 1
- 230000015654 memory Effects 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 238000001225 nuclear magnetic resonance method Methods 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 238000005691 oxidative coupling reaction Methods 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000015 polydiacetylene Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 230000000379 polymerizing effect Effects 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 230000001568 sexual effect Effects 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 238000010561 standard procedure Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- YBBRCQOCSYXUOC-UHFFFAOYSA-N sulfuryl dichloride Chemical class ClS(Cl)(=O)=O YBBRCQOCSYXUOC-UHFFFAOYSA-N 0.000 description 1
- 238000002076 thermal analysis method Methods 0.000 description 1
Landscapes
- Macromonomer-Based Addition Polymer (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
- Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
- Polyamides (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用技術分野〕
本発明は、ジアセチレン基含有1.3−置換型芳香族ポ
リアミドを用いた成形品に関するものであり、更に詳し
くは、ジアセチレン基によって、特に容易に重合し高弾
性率を発現するジアセチレン基含有1.3−置換型芳香
族ポリアミドを用いた成形品に関するものである。Detailed Description of the Invention [Technical Field of Application of the Invention] The present invention relates to a molded article using a diacetylene group-containing 1,3-substituted aromatic polyamide. In particular, it relates to a molded article using a diacetylene group-containing 1,3-substituted aromatic polyamide that is easily polymerized and exhibits a high elastic modulus.
近年、固相重合によるトポケミカル反応を用いた単結晶
ポリマーの合成は、注目されており、この手法を用いて
、種々の高弾性率を有する高結晶性高分子の開発が試み
られている。In recent years, the synthesis of single-crystalline polymers using topochemical reactions through solid-state polymerization has attracted attention, and attempts have been made to use this technique to develop various highly crystalline polymers having high elastic moduli.
(例えば、「有機非線形光学材料」、シーエムシー(1
985)、マクロモレキュル ケミストリー第134巻
、第219頁(1970)、ジャーナル オブ ポリマ
ー サイエンス 第89巻、第133頁(1971)、
ジャーナル オブ ポリマー サイエンス ポリマー
フイジクスエデイション第12巻 第1511頁(19
74)。)〔発明が解決しようとしている問題点〕しか
しながら、これまで合成されてきたジアセチレン化合物
のポリマーは、原料モノマーの粉体または単結晶を光化
学的あるいは熱的に重合して得ていたので、大きな成形
体として得ることができず、またポリマー自体、水およ
び有機溶媒に不溶なものが多いので、重合後の加工性が
きわめて悪い。(For example, "Organic nonlinear optical materials", CMC (1
985), Macromolecule Chemistry Vol. 134, p. 219 (1970), Journal of Polymer Science Vol. 89, p. 133 (1971),
Journal of Polymer Science Polymers
Physics Edition Volume 12, Page 1511 (19
74). ) [Problem to be solved by the invention] However, the polymers of diacetylene compounds synthesized so far have been obtained by photochemically or thermally polymerizing raw material monomer powders or single crystals. It cannot be obtained as a molded article, and the polymer itself is often insoluble in water and organic solvents, so its processability after polymerization is extremely poor.
また、これまで合成研究されてきたトポケミカル重合性
を有するジアセチレン化合物は、HOCH、C=c−c
accHzO’Hのような水酸基を有する化合物及び
その誘導体に限られており、研究の進展が妨げられてい
た。これに対し窒素原子が導入された素材では窒素原子
の電気陰性度や凝集力が活用可能な上に、窒素原子が−
Nil−結合を有する場合は水素結合による分子間力や
窒素原子の反応性が活用可能であるなどジアセチレン化
合物間の分子間相互作用の強化や種々の誘導体への展開
などが考えられ、トポケミカル反応の可能性とその実用
化へ大きな期待が持たれる。In addition, diacetylene compounds with topochemical polymerizability that have been synthesized and researched so far are HOCH, C=c-c
This research has been limited to compounds with hydroxyl groups such as accHzO'H and their derivatives, which has hindered the progress of research. On the other hand, in materials into which nitrogen atoms are introduced, the electronegativity and cohesive force of nitrogen atoms can be utilized, and the nitrogen atoms are −
When Nil-bonds are present, intermolecular forces due to hydrogen bonds and reactivity of nitrogen atoms can be used to strengthen intermolecular interactions between diacetylene compounds, and development into various derivatives can be considered, leading to topochemical reactions. There are great expectations for its potential and its practical application.
このような観点から、ジアセチレン基を持つポリアミド
及びその成形品は、非常に興味が持たれるが、従来この
ようなトポケミカル反応性を示すジアセチレン基含有ポ
リアミドは、はとんど知られていない。−
本発明者らは、従来からジアセチレン基の隣りにアルキ
ル基など種々の基を導入する方法及び得られた化合物の
特性を検討してきたが、その過程でジアセチレン基含有
ポリアミドの合成に成功し、更に研究の結果本発明に到
達した。From this point of view, polyamides containing diacetylene groups and molded products thereof are of great interest, but until now, diacetylene group-containing polyamides that exhibit such topochemical reactivity are largely unknown. . - The present inventors have been studying the methods of introducing various groups such as alkyl groups next to diacetylene groups and the properties of the resulting compounds, and in the process succeeded in synthesizing a polyamide containing diacetylene groups. However, as a result of further research, we have arrived at the present invention.
すなわち、本発明は、
繰り返し単位として、
(ここで、x、x’ は、水素原子、炭素数が1から2
0までの炭化水素基、該炭化水素基に結合したカルボニ
ル基またはスルホニル基、及びハロゲン原子の中から選
ばれた1種または2種以上の基または原子を示し、R,
R’ は、炭素数カ月から20までの1位と3位がアミ
ド基とジアセチレン基に結合した2価の芳香族炭化水素
基を示し、本発明において、x、x’ はそれぞれ水素
原子、炭素数1から20までの炭化水素基、該炭化水素
基に結合したカルボニル基又はスルホニル基、及びハロ
ゲン原子中から選ばれた1種又は2種以上の基又は原子
であり、炭素数1から20までの炭化水素基としては、
CH:l 、CtHs、CJ?、C4H9、CsH++
−Cb■Ix % CJ+s % CII
HI? −、C9HI9 sC9゜H2いCHz=
CH−、CHzCH=CH−、HC=C−1HC=jし
、好ましくは、不飽和脂肪族炭化水素基及び芳香族炭化
水素基であり、又、上記の脂肪族炭化水素基、脂環式炭
化水素基、芳香族炭化水素基は、ハロゲン原子、ニトロ
基、シアノ基、カルボキシル基、アミド基、エステル基
、カルボニル基、エーテル結合等で置換されていてもよ
い。That is, in the present invention, as a repeating unit, (where x and x' are hydrogen atoms and carbon atoms are 1 to 2
0 to 0, a carbonyl group or sulfonyl group bonded to the hydrocarbon group, and one or more groups or atoms selected from halogen atoms, R,
R' represents a divalent aromatic hydrocarbon group having carbon atoms ranging from several months to 20, with the 1st and 3rd positions bonded to an amide group and a diacetylene group, and in the present invention, x and x' are a hydrogen atom and a carbon atom, respectively. One or more groups or atoms selected from a hydrocarbon group having a number of 1 to 20, a carbonyl group or sulfonyl group bonded to the hydrocarbon group, and a halogen atom, and having a carbon number of 1 to 20. As a hydrocarbon group,
CH:l, CtHs, CJ? , C4H9, CsH++
-Cb■Ix % CJ+s % CII
HI? −, C9HI9 sC9°H2 CHz=
CH-, CHzCH=CH-, HC=C-1HC=j, preferably unsaturated aliphatic hydrocarbon groups and aromatic hydrocarbon groups, and the above aliphatic hydrocarbon groups, alicyclic hydrocarbon groups The hydrogen group and aromatic hydrocarbon group may be substituted with a halogen atom, nitro group, cyano group, carboxyl group, amide group, ester group, carbonyl group, ether bond, or the like.
また、該炭化水素基に結合したカルボニル基又はスルホ
ニル基としては、一般式で書(と、y−c。Further, the carbonyl group or sulfonyl group bonded to the hydrocarbon group is represented by the general formula (and y-c.
−又はy−so□−(Yは、該炭化水素基をあられす。- or y-so□- (Y represents the hydrocarbon group.
)○
で示される基であり、例としては、CH3C−1PhC
Ht C−、CH35O□−1CtHsSOz−1C:
1H7SO□−1C4H9SO□−1PhSOz−1P
hCH2SO□−等が挙げられ、好である。)○ is a group represented by, for example, CH3C-1PhC
HtC-, CH35O□-1CtHsSOz-1C:
1H7SO□-1C4H9SO□-1PhSOz-1P
Preferred examples include hCH2SO□-.
ハロゲン原子としては、F% Cl、、Brs Iであ
り、好ましくは、C11Brである。The halogen atom is F% Cl, Brs I, preferably C11Br.
これらのx、x’ のうち、特に好ましいのはX、X゛
共に水素原子である場合であり、これは、凝集力の向上
によるトポケミカル性、耐熱性、強度等の点でずぐれて
いるからである。Among these x and x', it is particularly preferable that both X and It is.
本発明において、R,R“は、炭素数が1から20まで
の1位と3位がアミド基とジアセチレン本発明において
、Zとしては、−CH2−1−C18,−1−CJa−
、−C4H11−−−C5HIO−−、−C1lHI&
−−−CHJzo−−I
C1li C1l:I
CII* CHff C
H3−CHz−CI!−1−CIlz C−CHz−、
−CH2CH2−C−C1lz−、山 H
CH,−
CH,−
CH□−
族基、及び脂環式基の複合した基が挙げられ、またこれ
らのZの水素原子のいくつかが、ハロゲン原子、ニトロ
基、水酸基、シアノ基、カルボキシ、ル基、アミノ基、
アミド基、エステル基、カルボニル基、エーテル結合等
で、置換されていてもよい。In the present invention, R and R" have 1 to 20 carbon atoms, and the 1st and 3rd positions are amide groups and diacetylene. In the present invention, Z is -CH2-1-C18, -1-CJa-
, -C4H11--C5HIO--, -C1lHI&
---CHJzo--I C1li C1l:I CII* CHff C
H3-CHz-CI! -1-CIlz C-CHz-,
Examples include complex groups of -CH2CH2-C-C1lz-, H CH, - CH, - CH□- group groups, and alicyclic groups, and some of the hydrogen atoms of these Z are halogen atoms, Nitro group, hydroxyl group, cyano group, carboxy, ru group, amino group,
It may be substituted with an amide group, ester group, carbonyl group, ether bond, etc.
Zとして好ましいのは、入手しやすさより、−〇、−C
4−1早、−CsH+b−、−CH山。−である。-〇, -C are preferable as Z due to ease of acquisition.
4-1 early, -CsH+b-, -CH mountain. − is.
本発明において、X、X’ 、R,R’ 、Zの組るが
、この組み合せ例だけに限定されないことは言うまでも
ない。In the present invention, although X, X', R, R', and Z are combined, it goes without saying that the combination is not limited to this example.
本発明において、重合度は2以上の整数以外に特に制限
はないが、充分な成形性と強度を持たせるために50以
上の整数が好ましい。In the present invention, the degree of polymerization is not particularly limited other than an integer of 2 or more, but is preferably an integer of 50 or more in order to provide sufficient moldability and strength.
本発明のジアセチレン基含有1.3−置換型芳香族ポリ
アミドを用いた成形品の素材であるジアセチレン基含有
1,3−置換型芳香族ポリアミドの製造法としては、た
とえば、原料としてアミンHNRCECC=CR’NH
を用い、カルボン酸ハロゲン化X”
縮合させる方法(以下、方法1と呼ぶ)や、アミうな金
属触媒を用いて酸化カップリング重合する方法(以下、
方法2と呼ぶ)が例として挙げられる。As a method for producing a diacetylene group-containing 1,3-substituted aromatic polyamide, which is a raw material for a molded article using the diacetylene group-containing 1,3-substituted aromatic polyamide of the present invention, for example, amine HNRCECC is used as a raw material. =CR'NH
A method of condensing carboxylic acid halogenated
(referred to as method 2) is given as an example.
方法1の場合、例えばアミンHNRCiaCCミ組み合
わせでは、例えばアミンをアルカリ水溶液に溶かし、カ
ルボン酸ハロゲン化物を水とまざらない有機溶媒に溶か
し、この2液をまぜあわせることにより合成できる。ま
た、アミンHNRCミCCミCR″NHとカルボン酸エ
ステル、または力X゛
て重縮合を行なってもジアセチレン基含有1.3−置換
型芳香族ポリアミドは合成できる。この場合、アミンと
カルボン酸エステル、またはカルボン酸を混合しただけ
でも均一になるのであれば有機溶媒はなくてもよい、こ
の均一系の重縮合はカルボン酸ハロゲン化物についても
適用できる。In the case of method 1, for example, the combination of amine HNRCiaCC can be synthesized by dissolving the amine in an alkaline aqueous solution, dissolving the carboxylic acid halide in an organic solvent that does not mix with water, and mixing these two solutions. In addition, a diacetylene group-containing 1,3-substituted aromatic polyamide can be synthesized by polycondensing amine HNRCmiCCMiCR"NH with a carboxylic acid ester or with force X. In this case, amine and carboxylic acid If homogeneity can be obtained by simply mixing esters or carboxylic acids, the organic solvent may not be used. This homogeneous polycondensation can also be applied to carboxylic acid halides.
次に方法2の場合、例えば別途合成したアミドな金属触
媒を用い、ピリジンを溶媒として酸素を吹き込みながら
合成できる。Next, in the case of method 2, synthesis can be carried out using, for example, a separately synthesized amide metal catalyst, using pyridine as a solvent and blowing oxygen into it.
上記の方法1の場合、カルボン酸ハロゲン化物、カルボ
ン酸エステル、またはカルボン酸のアミンに対する量は
特に制限はないが、好ましくは0.1当景から2当量で
ある。In the case of method 1 above, the amount of carboxylic acid halide, carboxylic ester, or carboxylic acid relative to the amine is not particularly limited, but is preferably 0.1 to 2 equivalents.
上記の方法1の場合、用いるアルカリ水溶液の種類、濃
度、量についても特に制限はない。In the case of method 1 above, there are no particular limitations on the type, concentration, and amount of the alkaline aqueous solution used.
上記の方法1の場合、反応温度、反応時間についても特
に制限はなく、好ましくは反応温度は一20℃から30
0℃であり、反応時間は20分から10時間である。In the case of the above method 1, there are no particular restrictions on the reaction temperature and reaction time, and the reaction temperature is preferably from -20°C to 30°C.
The temperature is 0° C. and the reaction time is 20 minutes to 10 hours.
上記の方法2の酸化カップリング重合において、用いる
金属触媒のモル数は基質に対し0.01当量から1当量
、酸素の流量は10〜l 000mj!/minが好ま
しい。この反応に用いる溶媒としてはピリジンが好まし
く、他の溶媒を共存させることも可能であり、反応温度
、反応時間については特に制限はなく、好ましくは反応
温度は一20℃から100℃の間でよく、反応時間は2
0分から12時間の範囲である。In the oxidative coupling polymerization of method 2 above, the number of moles of the metal catalyst used is 0.01 to 1 equivalent relative to the substrate, and the flow rate of oxygen is 10 to 1000mj! /min is preferable. Pyridine is preferred as the solvent used in this reaction, and other solvents may also be present. There are no particular restrictions on the reaction temperature and reaction time, and preferably the reaction temperature is between -20°C and 100°C. , reaction time is 2
It ranges from 0 minutes to 12 hours.
このジアセチレン基含有1.3−置換型芳香族ポリアミ
ドを合成する際、原料が高度な純度を有することが極め
て重要であるが、このような純度としるが、必要な純度
を得るために、これらの精製方法を繰り返し行なうこと
が大切である。When synthesizing this diacetylene group-containing 1,3-substituted aromatic polyamide, it is extremely important that the raw materials have a high degree of purity. It is important to repeat these purification methods.
このジアセチレン基含有1.3−置換型芳香族ポリアミ
ド及びその合成上の原料は、赤外分光法(以下IRと呼
ぶ)、レーザーラマン法、xH法、熱分析法、核磁気共
鳴法にて確認同定できる。This diacetylene group-containing 1,3-substituted aromatic polyamide and raw materials for its synthesis were analyzed using infrared spectroscopy (hereinafter referred to as IR), laser Raman method, xH method, thermal analysis method, and nuclear magnetic resonance method. Can be confirmed and identified.
本発明のジアセチレン基含有1.3−置換型芳香族ポリ
アミドを用いた成形品は、素材のジアセチレン基含有1
.3−置換型ボリアミドを用いて成形することにより、
高弾性率、すなわち少なくとも6GPa以上の弾性率を
発現する。発現される弾性率の値は、成形の方法、条件
により、好ましい方法を用いれば7GPa以上の弾性率
を発現することも容易である。The molded article using the diacetylene group-containing 1,3-substituted aromatic polyamide of the present invention has a diacetylene group-containing 1
.. By molding using 3-substituted polyamide,
It exhibits a high elastic modulus, that is, an elastic modulus of at least 6 GPa or more. The value of the elastic modulus developed depends on the molding method and conditions, and if a preferable method is used, an elastic modulus of 7 GPa or more can be easily achieved.
本発明における成形物の形状は、特に制限はなく任意の
形状に成形されたものであり、例えば板状、塊状、棒状
、球状あるいは繊維状、フイルム状であってよく、用途
に応じた形態と大きさを有するものである。The shape of the molded product in the present invention is not particularly limited and may be molded into any shape, such as a plate, a block, a rod, a sphere, a fiber, or a film, depending on the purpose. It has a size.
本発明における弾性率は、成形物の形状に依り、曲げ弾
性率あるいは引張弾性率を適用できる0曲げ弾性率の測
定方法は、標準的な方法とし゛てASTM−D790−
66が使用できる。しかし、本発明の成形物は必ずしも
ASTMの測定法で測定できるだけの大型(長い)の成
形物を製造すると)よ限らない場合がある。このため、
本発明では、小型成形物の曲げ弾性率の測定方法として
、次の方法を用いた。The elastic modulus in the present invention depends on the shape of the molded product, and the bending elastic modulus or tensile elastic modulus can be applied.The measuring method for the bending elastic modulus is the standard method ASTM-D790-
66 can be used. However, the molded product of the present invention may not necessarily be large enough (long enough) to be measured by the ASTM measurement method. For this reason,
In the present invention, the following method was used to measure the flexural modulus of a small molded product.
すなわち、本発明で用いた曲げ弾性率の測定法としては
、試験片を長さ15w以上、幅4fi、高さ2flとし
、支点間距離10m、支点先端半径2R1加圧(さび先
端半径5R,試験速度5m/winに設定して測定した
。この場合ASTMの方法に比べ曲げ弾性率は若干小さ
く測定されるもののほぼ近い値が得られた。That is, the method for measuring the bending elastic modulus used in the present invention is to use a test piece with a length of 15 w or more, a width of 4 fi, and a height of 2 fl, with a distance between fulcrums of 10 m, a fulcrum tip radius of 2 R1 (rust tip radius of 5 R, test The measurement was performed at a speed of 5 m/win.In this case, although the flexural modulus was measured slightly smaller than the ASTM method, almost similar values were obtained.
弾性率が6GPa以上を有する成形物を成形する方法と
しては、成形時に架橋反応が進みうる方法を用いること
ができ、例えば、押出し成形、射出成形、圧縮成形、フ
ィルムの圧延成形などが用いられる0本発明のジアセチ
レン結合含有ポリエーテルは、ジアセチレン結合が、き
わめて反応性に富むため、これらの方法により、架橋反
応が進みうると思われ、さらに好ましくは、より積極的
に架橋反応を進めるため、圧力、熱、紫外線、放射線等
の励起エネルギーを単独に、又、組み合せて特に高度の
弾性率を発現させる方法としては高圧下で成形する方法
が好ましく、例えば、プレス成形や静水圧加圧法などの
加圧方法を使用できる。As a method for molding a molded article having an elastic modulus of 6 GPa or more, a method that allows a crosslinking reaction to proceed during molding can be used, such as extrusion molding, injection molding, compression molding, film rolling molding, etc. In the diacetylene bond-containing polyether of the present invention, since the diacetylene bond is extremely reactive, it is thought that the crosslinking reaction can proceed by these methods, and more preferably, in order to proceed with the crosslinking reaction more actively. , Pressure, heat, ultraviolet rays, radiation, etc. excitation energy can be used singly or in combination to develop a particularly high degree of elasticity.For example, a method of forming under high pressure is preferable, such as press molding or isostatic pressing. Pressure methods can be used.
加圧圧力は特に制限はないが、好ましくは15MPa以
上であり、特に好ましくは100MPa以上である。ま
た、加圧時には大気圧下で加圧することによって成形可
能であるが、空隙のない成形物を得るためには加圧時に
加圧容器内や試料空隙の空気を排気し、減圧ないし真空
状態にして加圧成形することが好ましい。The pressurizing pressure is not particularly limited, but is preferably 15 MPa or more, particularly preferably 100 MPa or more. Furthermore, when pressurizing, molding is possible by applying pressure under atmospheric pressure, but in order to obtain a molded product without voids, the air in the pressurized container and the sample voids must be evacuated during pressurization, and the pressure must be reduced or vacuumed. It is preferable to perform pressure molding.
加圧成形時の温度は、特に制限はない。好ましくは、室
温(20℃)から350℃の範囲、特に120から20
0℃の範囲であればよい。The temperature during pressure molding is not particularly limited. Preferably in the range from room temperature (20°C) to 350°C, especially from 120 to 20°C.
It may be within the range of 0°C.
フィルム状成形物を得るには、フィルム形態を付与した
後あるいは付与と同時に圧力、熱、紫外線、放射線等の
励起エネルギーを与えることが好ましく、延伸により一
方向の弾性率を向上させながら、又、させた後、これら
エネルギーを与えることも効果的でより弾性率の向上し
た成形物を得ることができる。In order to obtain a film-like molded product, it is preferable to apply excitation energy such as pressure, heat, ultraviolet rays, or radiation after or simultaneously with imparting the film shape, and while improving the elastic modulus in one direction by stretching, It is also effective to apply these energies after the molding, and it is possible to obtain a molded product with a further improved modulus of elasticity.
もよい、また、成形時に、無機あるいは有機充填剤、顔
料、紫外線吸収剤、安定剤等を配合して成形することも
可能である。It is also possible to mix inorganic or organic fillers, pigments, ultraviolet absorbers, stabilizers, etc. during molding.
本発明のジアセチレン基含有1.3−置換型芳香族ボリ
アミドは、ジアセチレン基とアミド基に直接1位と3位
に結合した芳香族炭化水素基を導入することにより、ジ
アセチレン基のトポケミカル性を高度に高めたことに最
大の特徴を有する。一般にジアセチレン基のトポケミカ
ル性は、ジアセチレン基の隣接基の種類に大きな影響を
受け、隣接基がかさ高くなると反応性が低下する。その
ために、ジアセチレン基含有のポリマーを材料と児なし
た時、耐熱性、強度の点で剛直な芳香族炭化水素基の導
入は興味があるが、ジアセチレン基の反応性ではマイナ
ス面になる。これまでに、アミド基を有するジアセチレ
ン化合物として
1゛ル ケミ−1第154巻、35頁、(1974))
そこで、ジアセチレン基とアミド基に、直接1位と3位
で結合した芳香族炭化水素基を導入すれば、耐熱性、強
度、成形性で優れ、しかも、ジアセチレン基の反応性を
そこなうことなく、容易に架橋させることが可能である
ため、高弾性率を発現させうるきわめて有用な新素材を
提供できる。The diacetylene group-containing 1,3-substituted aromatic polyamide of the present invention is produced by introducing aromatic hydrocarbon groups directly bonded to the 1- and 3-positions into the diacetylene group and the amide group, thereby creating a topochemical structure of the diacetylene group. Its greatest feature is that it has a highly enhanced sexual quality. Generally, the topochemical properties of a diacetylene group are greatly influenced by the type of groups adjacent to the diacetylene group, and the bulkier the adjacent groups are, the lower the reactivity is. For this reason, when a diacetylene group-containing polymer is used as a material, it is interesting to introduce rigid aromatic hydrocarbon groups in terms of heat resistance and strength, but the reactivity of the diacetylene group is a disadvantage. . So far, we have reported on diacetylene compounds having an amide group (1974).
Therefore, by introducing an aromatic hydrocarbon group directly bonded to the diacetylene group and the amide group at the 1- and 3-positions, the heat resistance, strength, and moldability are excellent, and the reactivity of the diacetylene group is not impaired. Since it can be easily crosslinked without having to be used as a material, it is possible to provide an extremely useful new material that can exhibit a high modulus of elasticity.
従って、本発明のジアセチレン基含有1.3−11模型
芳香族ポリアミドは、π電子共役系に基づいた打機導電
性材料や高移動度の素子などの電子材料、非線形光学材
料、また固相反応性を生かした指紋検出材、ホログラム
感材、三次元メモリー等多岐にわたる高機能材料源とし
て使用できる。Therefore, the diacetylene group-containing 1.3-11 model aromatic polyamide of the present invention can be used in electronic materials such as punch conductive materials and high-mobility devices based on π-electron conjugated systems, nonlinear optical materials, and solid phase materials. It can be used as a source of a wide variety of high-performance materials such as fingerprint detection materials, hologram sensitive materials, and three-dimensional memories that take advantage of their reactivity.
また、−N)I−結合を有する本発明のジアセチレン基
含有1.3−置換型芳香族ボリアミドは、このアミノ基
の反応性を利用してこれまでに知られていない新しいタ
イプのポリジアセチレンを合成するのにきわめて重要な
中間体となる。例えば、カルボン酸やカルボン酸無水物
、酸クロリド、スルホニルクロリド、イソシアナート、
ハロゲン化アルキル、エポキシ等ときわめて容易に反応
し、こうして合成したポリアミドは、元のポリアミドと
は全く異った性質を示し、高度の機能性材料として有用
である。Furthermore, the diacetylene group-containing 1,3-substituted aromatic polyamide of the present invention having an -N)I- bond utilizes the reactivity of this amino group to create a new type of polydiacetylene that has not been previously known. It is an extremely important intermediate in the synthesis of For example, carboxylic acids, carboxylic acid anhydrides, acid chlorides, sulfonyl chlorides, isocyanates,
Polyamides that react very easily with alkyl halides, epoxies, etc., exhibit properties completely different from the original polyamides, and are useful as highly functional materials.
以下、本発明を一層明確にするために実施例を挙げて説
明するが、本発明の範囲をこれらの実施例に限定するも
のでないことはいうまでもない。EXAMPLES Hereinafter, the present invention will be described with reference to Examples in order to further clarify the present invention, but it goes without saying that the scope of the present invention is not limited to these Examples.
また、実施例において用いる試薬は必要に応じて精製し
てもよく、むしろその方が好ましい。Furthermore, the reagents used in the examples may be purified as necessary, and this is preferable.
〔実施例1〕
HOOC(CHI)scOOH1モルをN−メチルピロ
リドン30mj!に溶かし、12時間100℃にて反応
させる。反応後、メタノール中に反応物を注ぎ、析出し
たポリマーを単離する。こうして単離したポリマーを、
第1図に示す成形器のシリンダー内に詰め、内部を真空
ポンプにより減圧する。[Example 1] 1 mol of HOOC(CHI)scOOH was mixed with 30 mj of N-methylpyrrolidone! and react at 100°C for 12 hours. After the reaction, the reactants are poured into methanol and the precipitated polymer is isolated. The polymer thus isolated is
The mixture is packed into a cylinder of a molding machine shown in FIG. 1, and the pressure inside is reduced using a vacuum pump.
続いて、油圧プレス上に成形器を置き、加圧圧力20M
Pa、加圧時間5時間で成形する。Next, place the molding machine on a hydraulic press and apply pressure of 20M.
Molding was performed under pressure of 5 hours.
得られた成形物を長さ15fs、幅4鶴、高さ2龍の直
方体を切り出し、試験片とし、支点間距離10龍、支点
先端半径2R1加圧くさび先端半径5R1試験速度5鶴
/winの条件で、オートグラフDSS−500形、C
C式曲げ試験装置(島津製作所製)を用い測定した曲げ
弾性率は、6.4 GPaである。A rectangular parallelepiped with a length of 15 fs, a width of 4, and a height of 2 was cut out from the obtained molded product and used as a test piece.The distance between the fulcrums was 10, the radius of the fulcrum tip was 2R1, the radius of the pressure wedge was 5R1, the test speed was 5Trus/win. Under the conditions, Autograph DSS-500 type, C
The bending elastic modulus measured using a C-type bending test device (manufactured by Shimadzu Corporation) is 6.4 GPa.
り返すと得られた弾性率は、5.3 GPaである。こ
の弾性率のちがいは、ジアセチレン基の反応性の差異に
基づく成形体中の架橋密度の差に帰因する。The elastic modulus obtained upon repetition is 5.3 GPa. This difference in elastic modulus is attributable to the difference in crosslinking density in the molded product due to the difference in reactivity of diacetylene groups.
〔実施例2〕
実施例1において、HOOC(CHz) acOOHの
代りに、HOOC(CH2) 4COOHを用いた以外
は、実施例1を繰り返した。この場合、得られた弾性率
は、6.3 GPaである。[Example 2] Example 1 was repeated except that HOOC(CH2) 4COOH was used instead of HOOC(CHz) acOOH. In this case, the elastic modulus obtained is 6.3 GPa.
〔実施例3〕
実施例1において、HOOC(CHz) acOOl(
の代りに、した。この場合、得られた弾性率は、7.
I GPaである。[Example 3] In Example 1, HOOC(CHz) acOOl(
Instead of, I did. In this case, the obtained elastic modulus is 7.
IGPa.
〔実施例4〕
した。この場合、得られた弾性率は、6.8 GPaで
ある。[Example 4] In this case, the obtained elastic modulus is 6.8 GPa.
〔実施例5〕
実施例1で製造した成形物をポリエチレンのフィルムで
真空シールし、図2に示す静水圧装置に入れ、650M
Paの静水圧処理を2時間行った。[Example 5] The molded product produced in Example 1 was vacuum-sealed with a polyethylene film, placed in the hydrostatic pressure device shown in Figure 2, and heated to 650M.
Hydrostatic pressure treatment of Pa was performed for 2 hours.
得られた成形物を、長さ15鰭、幅4 m、高さ21m
の直方体に切り出し、試験片として、同様の方法で曲げ
弾性率を測定したところ12.3CPaであった。The resulting molded product has a length of 15 fins, a width of 4 m, and a height of 21 m.
A rectangular parallelepiped was cut out, and the bending elastic modulus of the test piece was measured in the same manner as 12.3CPa.
返すと得られた弾性率は、10.3GPaである。The elastic modulus obtained upon return is 10.3 GPa.
〔実施例6〕
実施例5において、HOOC(CHz) 5cOOHO
代りに、した。この場合、得られた弾性率は、11.5
GPaである。[Example 6] In Example 5, HOOC (CHz) 5cOOHO
Instead, I did. In this case, the obtained elastic modulus is 11.5
It is GPa.
第1図は、成形装置の半分切欠断面図である。
図中、1は押棒、2は押え金具、3は外筒のフタ、4は
外筒、5は空気排出管、6は内筒、7は受は用プラグ、
8は成形ポリマー、9.10はローリングである。
第2図は、静水圧装置の概略図である0図中、11は、
油圧ポンプ、12は圧力計、13は高圧容器、14はバ
ンドヒーター、15は高圧室である。FIG. 1 is a half-cutaway sectional view of the molding device. In the figure, 1 is the push rod, 2 is the presser metal fitting, 3 is the lid of the outer cylinder, 4 is the outer cylinder, 5 is the air exhaust pipe, 6 is the inner cylinder, 7 is the plug for the receiver,
8 is molded polymer, 9.10 is rolling. FIG. 2 is a schematic diagram of a hydrostatic pressure device. In FIG. 0, 11 is a
A hydraulic pump, 12 a pressure gauge, 13 a high pressure container, 14 a band heater, and 15 a high pressure chamber.
Claims (1)
までの炭化水素基、該炭化水素基に結合したカルボニル
基またはスルホニル基、及びハロゲン原子の中から選ば
れた1種または2種以上の基または原子を示し、R、R
′は、炭素数が1から20までの1位と3位がアミド基
とジアセチレン基に結合した2価の芳香族炭化水素基を
示し、Zは、炭素数が1から20までの2価の炭化水素
基を示し、重合度は、2以上の整数を示す。)を有する
ジアセチレン基含有1,3−置換型芳香族ポリアミドを
用いた弾性率6GPa以上を有する成形品[Claims] As repeating units, there are ▲mathematical formulas, chemical formulas, tables, etc.▼ (Here, X and X' are hydrogen atoms, and the number of carbon atoms is 1 to 20.
R, R
' represents a divalent aromatic hydrocarbon group having from 1 to 20 carbon atoms and whose 1st and 3rd positions are bonded to an amide group and a diacetylene group, and Z represents a divalent aromatic hydrocarbon group having from 1 to 20 carbon atoms. represents a hydrocarbon group, and the degree of polymerization represents an integer of 2 or more. ) A molded article having an elastic modulus of 6 GPa or more using a diacetylene group-containing 1,3-substituted aromatic polyamide
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19805186A JPS6354431A (en) | 1986-08-26 | 1986-08-26 | Molding of diacetylene group-containing 1,3-substituted aromatic polyamide |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP19805186A JPS6354431A (en) | 1986-08-26 | 1986-08-26 | Molding of diacetylene group-containing 1,3-substituted aromatic polyamide |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6354431A true JPS6354431A (en) | 1988-03-08 |
JPH0338296B2 JPH0338296B2 (en) | 1991-06-10 |
Family
ID=16384715
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP19805186A Granted JPS6354431A (en) | 1986-08-26 | 1986-08-26 | Molding of diacetylene group-containing 1,3-substituted aromatic polyamide |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6354431A (en) |
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
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Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62288628A (en) * | 1986-06-06 | 1987-12-15 | Agency Of Ind Science & Technol | Aromatic polyamide containing diacetylene group |
-
1986
- 1986-08-26 JP JP19805186A patent/JPS6354431A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62288628A (en) * | 1986-06-06 | 1987-12-15 | Agency Of Ind Science & Technol | Aromatic polyamide containing diacetylene group |
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Publication number | Publication date |
---|---|
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