JPS6353944A - Semiconductor manufacturing equipment - Google Patents
Semiconductor manufacturing equipmentInfo
- Publication number
- JPS6353944A JPS6353944A JP61196771A JP19677186A JPS6353944A JP S6353944 A JPS6353944 A JP S6353944A JP 61196771 A JP61196771 A JP 61196771A JP 19677186 A JP19677186 A JP 19677186A JP S6353944 A JPS6353944 A JP S6353944A
- Authority
- JP
- Japan
- Prior art keywords
- vacuum chamber
- chamber
- cover plate
- vacuum
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 33
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000000428 dust Substances 0.000 abstract description 7
- 238000011109 contamination Methods 0.000 abstract 2
- 230000000694 effects Effects 0.000 description 2
- 230000000903 blocking effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野］
本発明は半導体基板を大気圧中より半導体製Ｒ装置内に
搬入し、真空中で種々の加工を行う半導体製造装置に関
する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a semiconductor manufacturing apparatus in which a semiconductor substrate is carried into a semiconductor R apparatus from atmospheric pressure and subjected to various processing in a vacuum.
［従来の技術］
従来、半導体製造装置において、真空中で加工した半導
体基板を搬出する際には、気体を半導体製造装置内に供
給し、真空から大気圧にし半導体基板を搬出していた。[Prior Art] Conventionally, in semiconductor manufacturing equipment, when a semiconductor substrate processed in a vacuum is transported out, gas is supplied into the semiconductor manufacturing equipment, and the pressure is changed from vacuum to atmospheric pressure, and the semiconductor substrate is transported out.
［発明が解決しようとする問題点］
上述した従来の方法では、半導体装置内を真空より大気
圧にするときに、半導体基板搬入後、真空にする際、半
導体装置内下部に下降し付着していた塵埃が舞い上がり
、半導体基板に付着するという欠点がある。[Problems to be Solved by the Invention] In the conventional method described above, when the inside of the semiconductor device is brought from vacuum to atmospheric pressure, when the inside of the semiconductor device is brought into a vacuum after being carried in, the particles that fall down and adhere to the lower part of the inside of the semiconductor device are removed. The drawback is that dust is thrown up and adheres to the semiconductor substrate.
本発明の目的は半導体基板が塵埃により汚染されるのを
防止する半導体製造装置を提供することにある。An object of the present invention is to provide a semiconductor manufacturing apparatus that prevents a semiconductor substrate from being contaminated by dust.
［問題点を解決するための手段］
本発明は内部を大気圧に開放した状態で半導体基板を搬
出入する゛真空室を有する半導体製造装置において、真
空室下部を覆う覆板を前記真空室に出入可能に設置した
ことを特徴とする半導体製造装置である。[Means for Solving the Problems] The present invention provides a semiconductor manufacturing apparatus having a vacuum chamber in which semiconductor substrates are transferred in and out with the inside thereof open to atmospheric pressure, and a cover plate that covers the lower part of the vacuum chamber is placed in the vacuum chamber. This semiconductor manufacturing equipment is characterized by being installed so that it can be accessed and accessed.
［実施例］ 以下、本発明の一実施例を図により説明する。[Example] Hereinafter, one embodiment of the present invention will be described with reference to the drawings.
第１図において、本発明装置は開閉可能な遮断板５によ
り仕切られた半導体加工室９と真空室１０とを有し、真
空室１０に気体の供給口３と排気口４とを設け、ざらに
半導体加工室９の下部に、真空室１０の下部を覆う覆板
７を収容する格納至１１を形成し、該格納室１１から真
空室１０の下部に向けて覆板７を出入可能に設置したも
ので必る。６は真空ｉ１０と格納室１１とを仕切る遮断
板である。８は搬送部、１２は外壁である。In FIG. 1, the apparatus of the present invention has a semiconductor processing chamber 9 and a vacuum chamber 10 separated by an openable and closable shield plate 5, and the vacuum chamber 10 is provided with a gas supply port 3 and an exhaust port 4, and has a rough At the lower part of the semiconductor processing chamber 9, a storage space 11 is formed for accommodating the cover plate 7 that covers the lower part of the vacuum chamber 10, and the cover plate 7 is installed so as to be accessible from the storage chamber 11 toward the lower part of the vacuum chamber 10. It's a must have. 6 is a shielding plate that partitions the vacuum i10 and the storage chamber 11. 8 is a conveyance section, and 12 is an outer wall.
実施例において、真空室１０が大気圧の状態のときにカ
セット２に半導体基板１を保持してこれを真空室１０内
に送り込み、気体排気口４より排気し真空室１０を真空
にする。このとき、覆板７は格納室１１に格納され遮断
板５，６は閉じている。真空到達後、遮断板６を開放し
、覆板７を真空室１０内に挿入し、真空室１０の下面を
覆板７にて覆いこれを真空室１０から隔離する。次に遮
断板５を開放し、半導体基板１を半導体加工室９に搬送
し加工する。In the embodiment, when the vacuum chamber 10 is at atmospheric pressure, the semiconductor substrate 1 is held in the cassette 2 and fed into the vacuum chamber 10, and the gas is evacuated from the gas exhaust port 4 to make the vacuum chamber 10 evacuated. At this time, the cover plate 7 is stored in the storage chamber 11 and the blocking plates 5 and 6 are closed. After the vacuum is reached, the shielding plate 6 is opened, the cover plate 7 is inserted into the vacuum chamber 10, and the lower surface of the vacuum chamber 10 is covered with the cover plate 7 to isolate it from the vacuum chamber 10. Next, the shielding plate 5 is opened, and the semiconductor substrate 1 is transported to the semiconductor processing chamber 9 and processed.
加工後、カセット２に半導体基板１を入れ遮断板５を閉
じ、気体供給口３より気体を供給し、真空室１０を大気
圧に開放し、半導体基板１を装置外へ搬出する。After processing, the semiconductor substrate 1 is placed in the cassette 2, the shield plate 5 is closed, gas is supplied from the gas supply port 3, the vacuum chamber 10 is opened to atmospheric pressure, and the semiconductor substrate 1 is carried out of the apparatus.
［発明の効果］
以上説明したように本発明によれば、真空室下面を覆板
にて覆うようにしたので、真空室を大気圧に開放する際
に塵埃が舞い上がらず、半導体基板の塵埃による汚染を
防止できる効果を有するものでおる。[Effects of the Invention] As explained above, according to the present invention, since the lower surface of the vacuum chamber is covered with a cover plate, dust does not fly up when the vacuum chamber is opened to atmospheric pressure, and dust from the semiconductor substrate does not fly up. It has the effect of preventing pollution.
第１図は本発明の一実施例を示す半導体製造装置の断面
図である。
１・・・半導体基板 ２・・・カセット３・・・
気体供給口 ４・・・気体排気口５．６・・・遮
断板 ７・・・覆板８・・・搬送部
９・・・半導体基板加工全１０・・・真空室
１１・・・格納室１２・・・外壁FIG. 1 is a sectional view of a semiconductor manufacturing apparatus showing an embodiment of the present invention. 1... Semiconductor substrate 2... Cassette 3...
Gas supply port 4...Gas exhaust port 5.6...Shielding plate 7...Covering plate 8...Transportation section
9...Semiconductor substrate processing total 10...Vacuum chamber
11...Storage room 12...Outer wall
Claims (1)
入する真空室を有する半導体製造装置において、真空室
下部を覆う覆板を前記真空室に出入可能に設置したこと
を特徴とする半導体製造装置。(1) A semiconductor manufacturing device having a vacuum chamber in which semiconductor substrates are transferred in and out with the inside open to atmospheric pressure, characterized in that a cover plate covering a lower part of the vacuum chamber is installed to be able to enter and exit the vacuum chamber. Manufacturing equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61196771A JPS6353944A (en) | 1986-08-22 | 1986-08-22 | Semiconductor manufacturing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61196771A JPS6353944A (en) | 1986-08-22 | 1986-08-22 | Semiconductor manufacturing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6353944A true JPS6353944A (en) | 1988-03-08 |
Family
ID=16363352
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61196771A Pending JPS6353944A (en) | 1986-08-22 | 1986-08-22 | Semiconductor manufacturing equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6353944A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7670228B2 (en) | 2006-06-20 | 2010-03-02 | Asmo Co., Ltd. | Coupling apparatus, motor device, and wiper motor device |
| CN108977780A (en) * | 2017-05-31 | 2018-12-11 | 株式会社爱发科 | Sputtering equipment |
-
1986
- 1986-08-22 JP JP61196771A patent/JPS6353944A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7670228B2 (en) | 2006-06-20 | 2010-03-02 | Asmo Co., Ltd. | Coupling apparatus, motor device, and wiper motor device |
| CN108977780A (en) * | 2017-05-31 | 2018-12-11 | 株式会社爱发科 | Sputtering equipment |
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